CN-116368199-B - Pressure-sensitive adhesive sheet

Abstract

Provided is an adhesive sheet which has moderate adhesion to a sealing resin for sealing a semiconductor chip and the semiconductor chip, can be easily peeled from the sealing resin, is difficult to generate residual glue during peeling, and is difficult to generate a height difference between the semiconductor chip and the sealing resin after peeling the adhesive sheet. The pressure-sensitive adhesive sheet of the present invention comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, wherein the pressure-sensitive adhesive layer comprises an acrylic pressure-sensitive adhesive, the pressure-sensitive adhesive sheet has a dent content of 5 [ mu ] m or less in a 23 ℃ environment using TMA, and the pressure-sensitive adhesive layer has a T 2 relaxation time (T 2s ) of 45 [ mu ] sec or less based on the S component of pulse NMR.

Inventors

• YUTOU TAKUMI
• KATO KAZUMICHI
• NAKAO KOTA

Assignees

• 日东电工株式会社

Dates

Publication Date

20260512

Application Date

20211022

Priority Date

20201207

Claims (9)

1. 1. An adhesive sheet comprising a base material, an adhesive layer disposed on one side of the base material, and a2 nd adhesive layer disposed on the opposite side of the base material from the adhesive layer, The adhesive layer comprises an acrylic adhesive, The acrylic adhesive in the adhesive layer contains a crosslinked product of an acrylic polymer as a base polymer and an epoxy crosslinking agent, The amount of the epoxy crosslinking agent is5 to 15 parts by weight based on 100 parts by weight of the acrylic polymer, The pressure-sensitive adhesive sheet has a dent content of 5 μm or less in a 23 ℃ environment using TMA, The adhesive layer has a T 2 relaxation time (T 2s ) of 45 musec or less based on the S component of pulse NMR, The 2 nd adhesive layer comprises thermally expandable microspheres and an adhesive composed of a base polymer having a dynamic storage modulus at 80 ℃ in the range of 5kPa to 1MPa, The adhesive sheet is a temporary fixing material used in a resin sealing process of a semiconductor chip.
2. 2. The adhesive sheet according to claim 1, wherein the adhesive layer has a thickness change rate of 160% or less after dropping 4-t-butylphenyl glycidyl ether on the surface of the adhesive layer and leaving it for 1 minute.
3. 3. The adhesive sheet according to claim 1 or 2, wherein the thickness variation of the adhesive layer after dropping 4-t-butylphenyl glycidyl ether on the surface of the adhesive layer and standing for 1 minute is 20 μm or less.
4. 4. The adhesive sheet according to claim 1 or 2, wherein, The adhesive layer comprises an adhesive agent and, The adhesive comprises a base polymer having an sp value of 18 (cal/cm 3 ） 1/2 ~20（cal/cm 3 ） 1/2 ).
5. 5. The adhesive sheet according to claim 1 or 2, wherein the base material is a resin sheet composed of a resin having a glass transition temperature (Tg) of 25 ℃ or more.
6. 6. The adhesive sheet according to claim 1 or 2, wherein the thickness of the base material is 20% to 90% relative to the total thickness of the adhesive sheet.
7. 7. The adhesive sheet according to claim 1 or 2, wherein the adhesive sheet has a dent amount of 1 μm to 35 μm in a 145 ℃ environment using TMA.
8. 8. The adhesive sheet according to claim 1 or 2, wherein the amount of nitrogen generated when the adhesive layer is heat-treated is 0.06 to 1.0 wt%.
9. 9. The adhesive sheet according to claim 1 or 2, which is used when a sealing resin is cured on the adhesive sheet.

Description

Pressure-sensitive adhesive sheet Technical Field The present invention relates to an adhesive sheet. Background In recent years, in the manufacture of semiconductor components including semiconductor chips, the semiconductor chips are sometimes resin-sealed in order to prevent damage to the semiconductor chips, to expand metal wiring, and the like. In the resin sealing step, the semiconductor chip may be resin-sealed on the adhesive sheet from the viewpoint of operability and the like. For example, in order to prevent movement of the semiconductor chips, a plurality of semiconductor chips are arranged on a predetermined adhesive sheet as a temporary fixing material, and the semiconductor chips are sealed on the adhesive sheet at one time. Then, in a predetermined post-step, the adhesive sheet is peeled from the resin for sealing the semiconductor chip. In the above-described steps, when a conventional adhesive sheet is used, there is a problem that, when the adhesive sheet is peeled from a structure including a sealing resin and a semiconductor chip, a residual adhesive is generated on the structure. In addition, when sealing, the semiconductor chip is pressed into the adhesive sheet, and as a result, there is a problem that a height difference between the semiconductor chip and the sealing resin occurs after the adhesive sheet is peeled off. Such a level difference may cause defects such as insufficient protection of the semiconductor chip or inability to form metal wiring. In addition, the residual glue caused by the height difference is also easily generated. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2001-308116 Patent document 2 Japanese patent application laid-open No. 2001-313350 Disclosure of Invention Problems to be solved by the invention The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide an adhesive sheet having moderate adhesion to a sealing resin for sealing a semiconductor chip and a semiconductor chip, capable of being easily peeled from the sealing resin, hardly causing a residual adhesive at the time of peeling, and hardly causing a height difference between the semiconductor chip and the sealing resin after peeling the adhesive sheet. Solution for solving the problem The pressure-sensitive adhesive sheet of the present invention comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, wherein the pressure-sensitive adhesive layer comprises an acrylic pressure-sensitive adhesive, the pressure-sensitive adhesive sheet has a dent content of 5 [ mu ] m or less in a 23 ℃ environment using TMA, and the pressure-sensitive adhesive layer has a T 2 relaxation time (T 2s) of 45 [ mu ] sec or less based on the S component of pulse NMR. In one embodiment, the thickness change rate of the adhesive layer after dropping 4-tert-butylphenyl glycidyl ether onto the surface of the adhesive layer and standing for 1 minute is 160% or less. In one embodiment, the thickness variation of the adhesive layer after dropping 4-t-butylphenyl glycidyl ether onto the surface of the adhesive layer and standing for 1 minute is 20 μm or less. In one embodiment, the adhesive layer comprises an adhesive comprising a base polymer having an sp value of 18 (cal/cm 3)1/2～20(cal/cm3)1/2). In one embodiment, the acrylic adhesive comprises a crosslinked product of an acrylic polymer as a base polymer. In one embodiment, the acrylic adhesive includes an epoxy-based crosslinking agent. In one embodiment, the amount of the epoxy-based crosslinking agent is 0.6 to 15 parts by weight based on 100 parts by weight of the acrylic polymer. In one embodiment, the base material is a resin sheet made of a resin having a glass transition temperature (Tg) of 25 ℃ or higher. In one embodiment, the thickness of the base material is 20% to 90% of the total thickness of the adhesive sheet. In one embodiment, the pressure-sensitive adhesive sheet has a dent content of 1 μm to 35 μm in a 145 ℃ environment using TMA. In one embodiment, the amount of nitrogen generated when the adhesive layer is heat treated is 0.06 wt% to 1 wt%. In one embodiment, the adhesive sheet includes the base material, the adhesive layer disposed on one side of the base material, and the 2 nd adhesive layer disposed on the opposite side of the base material from the adhesive layer. In one embodiment, the adhesive sheet is a temporary fixing material used in a resin sealing process of a semiconductor chip. In one embodiment, the adhesive sheet is used when the sealing resin is cured on the adhesive sheet. ADVANTAGEOUS EFFECTS OF INVENTION According to the present invention, it is possible to provide an adhesive sheet having moderate adhesion to a sealing resin for sealing a semiconductor chip and a semiconductor chip, capable of being easily peeled from the sealing resin, and being