CN-116387919-B - Connecting device and connecting method applied to sensor heterogeneous material pin line

Abstract

The invention provides a connecting device for a sensor heterogeneous material pin line, and belongs to the technical field of avionic components. The electromagnetic shrinkage connector comprises a shrinkage body, a heating device, a magnetic collector and a coil, wherein the shrinkage body is filled with solder, a plurality of wires and microfilament sensor pins are arranged in the shrinkage body, the heating device is used for heating the shrinkage body to enable the solder to be melted into liquid solder, and the coil is electrified to generate electromagnetic pulse to enable the metal electromagnetic shrinkage sleeve to generate shrinkage plastic deformation, so that the liquid solder is filled in gaps between the plurality of wires and the microfilament sensor pins. According to the invention, the heating device is used for heating and melting the brazing filler metal to form the liquid brazing filler metal, and the coil is used for plastically shrinking the shrinkage body, so that the liquid brazing filler metal can better infiltrate gaps between the multi-strand wires and the microfilaments, and the connection between the multi-strand wires and the microfilaments is completed.

Inventors

• Tu Jiaxi
• CHEN YUHUA
• HU JINYANG
• DENG JIAHAO
• XIE JILIN
• LU JINZHONG
• YIN LIMENG
• ZHANG TIMING

Assignees

• 南昌航空大学

Dates

Publication Date

20260508

Application Date

20230116

Claims (6)

1. 1. The connecting device for the sensor heterogeneous material pin line is characterized by comprising an electromagnetic shrinkage connector, a heating device, a magnetic collector and a coil which are sleeved in sequence from inside to outside; The electromagnetic shrink connector comprises: a shrinkage body filled with solder and provided with microfine sensor pins therein; A heating device for heating the shrinkage body to melt the solder into a liquid solder; And the coil generates electromagnetic pulse after being electrified, and the shrinkage body is impacted at a high speed through the magnetic collector, so that the shrinkage body is subjected to shrinkage plastic deformation, and the liquid solder is filled into gaps between the multi-strand wires in the shrinkage body and the pin of the microfilament sensor.
2. 2. The device for connecting lead wires of dissimilar materials for sensors according to claim 1, wherein said heating means is two conductive copper terminals each coated with a graphite layer.
3. 3. The connecting device for heterogeneous material pin wires of a sensor according to claim 1, wherein the magnetic collector is made of red copper, and the cross section of the magnetic collector is isosceles trapezoid.
4. 4. The device for connecting a sensor hetero-material pin line according to claim 1, wherein the shrinkage body is a conductive deformable alloy material.
5. 5. A lead wire connection device for sensor dissimilar materials according to any of claims 1 to 4, wherein said solder is a solid silver based solder sheet.
6. 6. A connection method applied to a sensor heterogeneous material pin line connection device according to any one of claims 1 to 5, comprising the steps of: S1, fixing brazing filler metal, a dispersing end of a multi-strand wire and a microfilament sensor pin in a shrinkage body; s2, starting a heating device, and melting the brazing filler metal into a liquid state at high temperature; S3, energizing the coil, and enabling the shrinkage body at the joint of the multi-strand wire and the pin of the microfilament sensor to produce local shrinkage by electromagnetic force; S4, the whole shrinkage body is shrunk by electromagnetic force to form the connecting joint.

Description

Connecting device and connecting method applied to sensor heterogeneous material pin line Technical Field The invention relates to the technical field of avionic components, in particular to a device and a method for connecting heterogeneous material pin wires of a sensor. Background The sensing component is an important part in an avionics system, and the manufacturing process of the sensing component relates to a technology for connecting a micro-filament and a plurality of wires with different diameters, however, the micro-filament and the plurality of wires are usually made of dissimilar metals and have large diameter difference, and meanwhile, the micro-filament is easy to soften when being subjected to high temperature, so that the welding difficulty is greatly increased. The traditional fusion welding has high heat input and is easy to burn and melt and even break the microfilaments, so the traditional fusion welding is not suitable for connecting the microfilaments and the multi-strand wires, and a welding method with small and stable heat input is selected. Currently, welding of such parts is mainly brazing, and generally includes flame brazing, laser brazing and resistance brazing, wherein resistance brazing technology is widely applied. However, because of capillary action, the existing resistance brazing process often causes that the brazing filler metal infiltrates into gaps of the stranded wires, rather than gaps between the micro-filaments and the stranded wires, so that the degree of infiltration between the micro-filaments and the brazing filler metal and the degree of infiltration between the stranded wires and the brazing filler metal are poor, and the welding quality is reduced. Disclosure of Invention In view of the above, in order to solve the technical problem that in the prior art, in the resistance brazing process, the brazing filler metal preferentially infiltrates the gaps of the stranded wires, but not the gaps between the micro-filament and the stranded wires, so that the degree of infiltration between the micro-filament and the brazing filler metal and the degree of infiltration between the stranded wires and the brazing filler metal are poor, and the welding quality is reduced, on one hand, the invention provides a device for connecting a lead wire of a sensor heterogeneous material, which is sequentially sleeved with an electromagnetic contraction connector, a heating device, a magnetic collector and a coil from inside to outside; the multi-strand wire and the microfilament sensor pin are fixed in the electromagnetic shrinkage connector and filled with solder, the solder is heated and melted into liquid solder by utilizing the heating device, and then the shrinkage body is subjected to plastic shrinkage by electromagnetic force generated by the coil, so that the liquid solder infiltrates the microfilament and the multi-strand wire simultaneously, the gap between the multi-strand wire and the microfilament is better infiltrated by the liquid solder, the connection between the multi-strand wire and the microfilament is completed, and the welding device has the advantages of quick forming, high efficiency, cleanness and environmental protection, and improves the welding quality. In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a be applied to sensor heterogeneous material pin line connecting device, includes electromagnetic contraction connector, heating device, concentrator and the coil that from inside to outside overlaps in proper order and establishes; The electromagnetic shrink connector comprises: a shrinkage body filled with solder and provided with microfine sensor pins therein; A heating device for heating the shrinkage body to melt the solder into a liquid solder; And the coil generates electromagnetic pulse after being electrified, and the shrinkage body is impacted at a high speed through the magnetic collector, so that the shrinkage body is subjected to shrinkage plastic deformation, and the liquid solder is filled into gaps between the multi-strand wires in the shrinkage body and the pin of the microfilament sensor. Preferably, the heating means are two conductive copper terminals each coated with a graphite layer. Preferably, the magnetic collector is made of red copper, and the section of the magnetic collector is isosceles trapezoid. Preferably, the shrinkage body is an electrically conductive and deformable alloy material. Preferably, the solder is a solid silver-based solder sheet. On the other hand, the invention provides a connecting method applied to the sensor heterogeneous material pin wire connecting device, which comprises the following steps: S1, fixing brazing filler metal, a dispersing end of a multi-strand wire and a microfilament sensor pin in a shrinkage body; s2, starting a heating device, and melting the brazing filler metal into a liquid state at high temperature