CN-116435238-A - Wafer etching device and wafer etching method

CN116435238ACN 116435238 ACN116435238 ACN 116435238ACN-116435238-A

Abstract

The invention provides a wafer etching device and a wafer etching method, and relates to the field of semiconductor processing. The device comprises: the feeding table, the feeding structure, the discharging structure and the detecting structure; the feeding table is arranged between the feeding structure and the discharging structure, and a height difference exists between a first end and a second end of the feeding table; the feeding structure is used for placing a wafer or a wafer box at the first end of the feeding table; the detection structure is perpendicular to the transmission direction of the feeding table and is used for detecting the position of a first wafer relative to a first wafer box, the first wafer box is a wafer box which is transmitted on the feeding table, and the first wafer is a wafer loaded in the first wafer box. The method solves the problems that the chemical etching process of the wafer needs to be carried out manually for loading and unloading, and fragments possibly occur in the loading and unloading process, so that the personnel cost is increased and the product yield is reduced.

Inventors

JIN LINGXIANG
SUN JIENAN

Assignees

XIAN ESWIN MATERIAL TECH CORP
XIAN YISIWEI SILICON CHIP TECHNOLOGY CO LTD

Dates

Publication Date: 20230714
Application Date: 20230526
Priority Date: 20230526

Claims (10)

1. A wafer etching apparatus, comprising: the feeding table (1), the feeding structure, the discharging structure and the detecting structure; the feeding table (1) is arranged between the feeding structure and the discharging structure, the feeding table (1) is used for conveying wafers or wafer boxes from a first end of the feeding table (1) to a second end of the feeding table (1), and a height difference exists between the first end and the second end of the feeding table (1); the feeding structure is used for placing a wafer or a wafer box at the first end of the feeding table (1), and the discharging structure is used for taking the wafer or the wafer box reaching the second end of the feeding table (1) off the feeding table (1); the detection structure is perpendicular to the transmission direction of the feeding table (1) and is used for detecting the position of a first wafer relative to a first wafer box, wherein the first wafer box is a wafer box which is transmitted on the feeding table (1), and the first wafer is a wafer loaded in the first wafer box.
2. The wafer etching apparatus according to claim 1, wherein the loading structure comprises: a feeding mechanical arm (21), a feeding mechanical arm (22) and a scanner (24); one end of the feeding mechanical arm (21) is connected with the feeding mechanical arm (22); the scanner (24) is arranged on the feeding manipulator (22) and is used for scanning information carried on the wafer box.
3. The wafer etching apparatus according to claim 1 or 2, wherein the feeding structure further comprises: a discharging manipulator (23); the discharging manipulator (23) is used for placing the wafer which is etched in the etching chamber into the wafer box carried at the first end of the feeding table (1).
4. The wafer etching apparatus according to claim 1, wherein the blanking structure comprises: a feeding manipulator (31); the feeding mechanical arm (31) is used for taking out the wafer in the wafer box reaching the second end of the feeding table (1) and placing the wafer in an etching chamber.
5. The wafer etching apparatus according to claim 1, wherein the detecting structure comprises: a signal transmitter (41) and a signal receiver (42); -the signal transmitter (41) and the signal receiver (42) are adapted to detect whether the wafer being transported on the feeding stage (1) is close to the first end of the wafer cassette; the first end of the wafer box is the lower one of the first end and the second end of the feeding table (1).
6. The wafer etching apparatus according to claim 1, wherein the feed stage comprises: a feeding opening (11), a discharging opening (12) and a conveying structure (13); the feeding port (11) is arranged at the first end of the feeding table (1) and is used for temporarily storing wafer boxes to be transmitted; the blanking port (12) is arranged at the second end of the feeding table (1) and is used for temporarily storing the wafer boxes which are conveyed; the conveying structure (13) is used for conveying the wafer boxes.
7. The wafer etching apparatus according to claim 6, wherein the wafer cassette is an open wafer cassette; the lower end of the wafer box is provided with a clamping groove (51) for being clamped with the conveying structure (13); the upper end of the wafer box is provided with a clamping structure (52) which is used for being clamped with the feeding structure and the discharging structure, so that the feeding structure and the discharging structure can take and put the wafer box.
8. The wafer etching apparatus according to claim 1, further comprising: a cassette conveyor belt (6); the first end of the wafer box conveying belt (6) is close to the blanking structure, the second end of the wafer box conveying belt (6) is close to the feeding structure, and the wafer box conveying belt (6) is used for conveying empty wafer boxes from the first end of the wafer box conveying belt (6) to the second end of the wafer box conveying belt (6).
9. A wafer etching method, characterized in that it is applied to the wafer etching apparatus according to any one of claims 1 to 8, comprising: placing a wafer box loaded with wafers at a first end of a feeding table through a feeding structure, and conveying the wafer box through the feeding table; detecting the position of the wafer loaded in the wafer box relative to the wafer box through a detection structure, and judging whether the wafer is damaged according to the obtained detection result; under the condition that the wafer is not damaged, taking the wafer reaching the second end of the feeding table out of the wafer box through a blanking structure, conveying the wafer into an etching chamber for etching, and taking the empty wafer box out of the feeding table; placing the etched wafer into a wafer box positioned at the first end of the feeding table through the feeding structure, and conveying the wafer box through the feeding table; detecting the position of the wafer loaded in the wafer box relative to the wafer box through the detection structure, and judging whether the wafer is damaged according to the obtained detection result; and under the condition that the wafer is not damaged, the wafer box reaching the second end of the feeding table is taken down through a blanking structure.
10. The method of claim 9, further comprising, prior to the placing the wafer cassette loaded with wafers at the first end of the feed station via the loading mechanism: scanning information carried on the wafer box through a scanner arranged on the feeding structure to obtain first information; and placing the etched wafer in a wafer box positioned at the first end of the feeding table through the feeding structure, wherein the wafer box comprises: after the wafer is etched, scanning the empty wafer box reaching the first end of the feeding table to obtain second information; and under the condition that the second information is confirmed to be consistent with the first information, placing the wafer in the wafer box through the feeding structure.

Description

Wafer etching device and wafer etching method Technical Field The invention relates to the field of semiconductor processing, in particular to a wafer etching device and a wafer etching method. Background In the wafer manufacturing process, if the wafer needs to be processed, manual handling is generally adopted, so that the loading and unloading efficiency of the wafer is low, and the processing efficiency is finally affected. After exposure and development, the wafer needs to be subjected to a chemical etching process, and the wafer still needs to be fed and discharged manually, so that the personnel cost is high, the production efficiency is low, fragments can be generated in the feeding and discharging process, and the personnel cost is increased and the product yield is reduced. Disclosure of Invention In order to solve the technical problems, the invention provides a wafer etching device and a wafer etching method, which can realize automatic loading and unloading of wafers and simultaneously achieve the purposes of reducing cost and improving the yield of products. In order to solve the technical problems, the invention adopts the following technical scheme: the embodiment of the invention also provides a wafer etching device, which comprises: the feeding table, the feeding structure, the discharging structure and the detecting structure; the feeding table is arranged between the feeding structure and the discharging structure, and is used for conveying wafers or wafer boxes from a first end of the feeding table to a second end of the feeding table, and a height difference exists between the first end and the second end of the feeding table; the feeding structure is used for placing a wafer or a wafer box at the first end of the feeding table, and the discharging structure is used for taking down the wafer or the wafer box reaching the second end of the feeding table from the feeding table; the detection structure is perpendicular to the transmission direction of the feeding table and is used for detecting the position of a first wafer relative to a first wafer box, the first wafer box is a wafer box which is transmitted on the feeding table, and the first wafer is a wafer loaded in the first wafer box. Further, the feeding structure includes: the feeding mechanical arm, the feeding mechanical arm and the scanner; one end of the feeding mechanical arm is connected with the feeding mechanical arm; the scanner is arranged on the feeding manipulator and is used for scanning information carried on the wafer box. Further, the feeding structure further comprises: a discharging manipulator; the discharging manipulator is used for placing the wafer which is etched in the etching chamber into the wafer box carried at the first end of the feeding table. Further, the unloading structure includes: a feeding manipulator; the feeding mechanical arm is used for taking out the wafer in the wafer box reaching the second end of the feeding table and placing the wafer in the etching chamber. Further, the detection structure includes: a signal transmitter and a signal receiver; the signal transmitter and the signal receiver are used for detecting whether the wafer conveyed on the feeding table approaches to the first end of the wafer box or not; the first end of the wafer box is the lower end of the first end and the second end of the feeding table. Further, the feeding table includes: a feeding port, a discharging port and a conveying structure; the feeding port is arranged at the first end of the feeding table and is used for temporarily storing the wafer boxes to be transmitted; the blanking port is arranged at the second end of the feeding table and is used for temporarily storing the wafer boxes which are conveyed; the conveying structure is used for conveying the wafer boxes. Further, the wafer cassette is an open wafer cassette; the lower end of the wafer box is provided with a clamping groove for being clamped with the conveying structure; the upper end of the wafer box is provided with a clamping structure which is used for being clamped with the feeding structure and the discharging structure, so that the feeding structure and the discharging structure can take and put the wafer box. Further, the apparatus further comprises: a wafer cassette conveyor; the first end of the wafer box conveyor belt is close to the blanking structure, the second end of the wafer box conveyor belt is close to the feeding structure, and the wafer box conveyor belt is used for conveying empty wafer boxes from the first end of the wafer box conveyor belt to the second end of the wafer box conveyor belt. The embodiment of the invention also provides a wafer etching method, which comprises the following steps: placing a wafer box loaded with wafers at a first end of a feeding table through a feeding structure, and conveying the wafer box through the feeding table; detecting the position of the wafer loaded in the wafer box relative to t