CN-116441742-B - Laser processing method and system for controlling laser cutting depth at line segment intersection

CN116441742BCN 116441742 BCN116441742 BCN 116441742BCN-116441742-B

Abstract

The invention discloses a laser processing method and a laser processing system for controlling the laser cutting depth of a line segment intersection, wherein the method comprises the steps of placing a product to be cut on a processing platform and fixing the product to be cut, obtaining a processing graph, marking the line segment intersection in the processing graph, carrying out laser processing on the product to be cut according to a processing line segment path in the processing graph, applying first laser energy to an unmarked section to cut the unmarked section when processing along an X axis, applying second laser energy to the marked section to cut the marked section along the X axis, applying first laser energy to the unmarked section to cut the unmarked section when processing along a Y axis, and applying third laser energy to the marked section to cut the marked section along the Y axis, wherein the sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy. The invention can avoid the ultra-poor depth of the crisscross position and does not reduce the processing efficiency.

Inventors

WANG LI
CHEN JUN
ZHAO SHENG
ZHANG QIANGLIANG
WANG JIANGANG

Assignees

武汉华工激光工程有限责任公司
湖北光谷实验室

Dates

Publication Date: 20260505
Application Date: 20230310

Claims (10)

1. A laser processing method for controlling the laser cutting depth at the intersection of line segments is characterized by comprising the following steps: placing a product to be cut on a processing platform and fixing; Obtaining a processing graph, and marking the intersection of line segments in the processing graph; And (3) carrying out laser processing on the product to be cut according to a processing line segment path in the processing graph, applying first laser energy to the unmarked section to cut the unmarked section when processing along the X axis in the laser processing process, applying second laser energy to the marked section to cut the marked section along the X axis, applying first laser energy to the unmarked section to cut the unmarked section when processing along the Y axis, and applying third laser energy to the marked section to cut the marked section along the Y axis, wherein the sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy.
2. The method of claim 1, wherein the mark size of each mark section is a single spot length.
3. The method for laser processing the laser cutting depth at the intersection of the line segments according to claim 1, wherein the marking of the intersection of the line segments comprises automatically identifying the intersection of the line segments and marking the intersection of the line segments.
4. The method for laser processing the laser cutting depth at the intersection of control line segments according to claim 1 or 3, wherein the line segment intersection is marked by software, and the marking length of the line segment intersection is edited and modified according to an editing instruction so as to adapt to line width change under different focuses of laser.
5. The method for laser processing the product to be cut according to the processing line segment path in the processing graph, which is characterized in that the method for laser processing the product to be cut according to the processing line segment path in the processing graph, comprises the steps of carrying out laser processing on the product to be cut along the X axis and the Y axis according to the processing line segment path in the processing graph, cutting the laser beam from the head end of the line segment to the tail end of the line segment along the X axis or the Y axis when any line segment is processed, ensuring that the cutting stroke is unchanged, keeping the cutting speed for a period of time after the cutting speed is accelerated from 0 to a set value, and reducing the cutting speed to 0 from the set value.
6. The method of claim 1, wherein compressed gas is blown to the laser processing portion during the laser processing, heat generated during the laser processing is reduced, and slag generated during the cutting is removed.
7. The method of claim 1, wherein the product to be cut is fixed on the processing platform by adsorption fixing.
8. The method of claim 1, wherein the laser machining is performed by taking out the material and splitting the material to complete the whole machining process.
9. A laser processing system for controlling the laser cutting depth at the intersection of line segments is characterized by comprising a laser, a processing platform and a control system, wherein, The processing platform is used for supporting and fixing a product to be cut; the laser is connected with a control system, the control system is used for controlling the laser to emit laser beams with corresponding laser energy according to a preset program and emit the laser beams to the surface of a product to be cut through a laser head, and the control system realizes the step of the laser processing method for controlling the laser cutting depth at the intersection of the line segments according to any one of claims 1 to 5 when executing the preset program.
10. The laser processing system of claim 9, wherein the laser head is fixedly provided with a blowing device for blowing air to the processing part, reducing heat generated in the laser processing process and removing slag generated in the cutting process.

Description

Laser processing method and system for controlling laser cutting depth at line segment intersection Technical Field The invention belongs to the technical field of laser processing, and particularly relates to a laser processing method and a laser processing system for controlling laser cutting depth at a line segment intersection. Background During conventional laser cutting, the bottom of a material cutting path needs to be leaked so as to meet the aim of blowing the material slag from a slit by coaxial high-pressure blowing in collimation cutting. Because ceramic is fragile material, the internal mold product can drop after the cutting is accomplished, can lead to product fish tail or cracked. In the ceramic cutting application field, the laser beam energy is controlled to act on the surface of a material, the output is improved in a cutting mode (controllable fracture type cutting) with increased depth, the processing efficiency is greatly improved, and compared with full cutting, the output energy is smaller in energy consumption and smaller in material thermal influence. The laser scribing generally controls the scribing depth to be 30% -60%, so that after the board separation is finished, the whole board material is directly scattered due to the too deep depth when the mechanical automation loading and unloading or manual carrying is handled. Under the condition of no regulation, the depth of the crisscross is inconsistent with the xy depth, and the material is broken down when the depth of the crisscross is excessively deep. The existing scheme is completed by splitting line segments and breaking single line segments for processing in a dividing way, so that the processing efficiency is greatly reduced. Disclosure of Invention The invention aims to overcome the defects of the prior art and provides a laser processing method and a system for controlling the laser cutting depth at the intersection of line segments, which can avoid the ultra-poor depth at the intersection without reducing the processing efficiency. The invention discloses a laser processing method for controlling laser cutting depth at a line segment intersection, which comprises the following steps: placing a product to be cut on a processing platform and fixing; Obtaining a processing graph, and marking the intersection of line segments in the processing graph; And (3) carrying out laser processing on the product to be cut according to a processing line segment path in the processing graph, applying first laser energy to the unmarked section to cut the unmarked section when processing along the X axis in the laser processing process, applying second laser energy to the marked section to cut the marked section along the X axis, applying first laser energy to the unmarked section to cut the unmarked section when processing along the Y axis, and applying third laser energy to the marked section to cut the marked section along the Y axis, wherein the sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy. Further, the mark size of each mark section is a single spot length. Further, marking the intersection of the line segments, which specifically comprises automatically identifying the intersection of the line segments and marking the intersection of the line segments. Further, marking is carried out on the line segment intersection through software, and editing and modifying are carried out on the marking length of the line segment intersection according to an editing instruction so as to adapt to line width change under the condition of different focuses of laser. Further, the laser processing is carried out on the product to be cut according to the processing line segment path in the processing graph, and the method specifically comprises the steps of carrying out the laser processing on the product to be cut along the X axis and the Y axis according to the processing line segment path in the processing graph, cutting the laser beam from the head end of the line segment to the tail end of the line segment along the X axis or the Y axis when any line segment is processed, ensuring that the cutting stroke is unchanged, keeping the cutting speed for a period of time after the cutting speed is accelerated from 0 to a set value, and reducing the cutting speed to 0 from the set value. Further, in the laser processing process, compressed gas is blown to the processing part, so that heat generated in the laser processing process is reduced, and slag generated in cutting is removed. Further, the product to be cut is fixed on the processing platform in an adsorption fixing mode. Further, after the laser processing is completed, the material is taken out, and the whole processing flow is completed by splitting. The invention also discloses a laser processing system for controlling the laser cutting depth at the intersection of line segments, which comprises a laser, a proce