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CN-116447901-B - Three-dimensional heat transfer device

CN116447901BCN 116447901 BCN116447901 BCN 116447901BCN-116447901-B

Abstract

A three-dimensional heat transfer device comprises a first heat conduction shell, a second heat conduction shell, at least one heat conduction convex block, at least one first capillary structure, at least one second capillary structure and at least one first heat pipe. The second heat conducting shell is provided with at least one first perforation, and the second heat conducting shell is arranged on the first heat conducting shell so that the first heat conducting shell and the second heat conducting shell form a liquid-tight cavity together. At least one heat conducting convex block protrudes out of the first heat conducting shell. At least one first capillary structure is overlapped on the first heat conducting shell. The at least one second capillary structure is stacked on the at least one heat conduction bump and is thermally coupled to the at least one first capillary structure. The at least one first heat pipe penetrates through the at least one first perforation and abuts against the at least one second capillary structure.

Inventors

  • WANG XUEMEI
  • ZHANG XIAOMIN

Assignees

  • 亚浩电子五金塑胶（惠州）有限公司

Dates

Publication Date
20260508
Application Date
20220106

Claims (14)

  1. 1. A stereoscopic heat transfer device, comprising: a first thermally conductive shell; The second heat conduction shell is provided with at least one first perforation and is arranged on the first heat conduction shell so that the first heat conduction shell and the second heat conduction shell form a liquid-tight cavity together; at least one heat conducting bump protruding from the first heat conducting shell; at least one first capillary structure overlapped with the first heat conducting shell; at least one second capillary structure stacked on the at least one heat conducting bump and thermally coupled to the at least one first capillary structure, and At least one first heat pipe penetrating the at least one first through hole and abutting against the at least one second capillary structure; The first heat conducting shell comprises a bottom plate, a first convex hull structure and a second convex hull structure, the first convex hull structure protrudes from the bottom plate towards a direction away from the second heat conducting shell, the second convex hull structure protrudes from the first convex hull structure towards a direction away from the second heat conducting shell, the at least one heat conducting protruding block protrudes from the inner surface of the second convex hull structure, and the at least one first capillary structure is overlapped on the inner surface of the bottom plate, the inner surface of the first convex hull structure and the inner surface of the second convex hull structure; The heat conducting bump is provided with a first surface and a second surface, the first surface is opposite to the outer surface of the second convex hull structure, the second surface is connected with the first surface and the inner surface of the second convex hull structure, the at least one second capillary structure is overlapped on the first surface of the at least one heat conducting bump, the at least one first heat pipe is respectively abutted against the second capillary structure overlapped on the first surface of the heat conducting bump, the first heat pipe is separated from the first capillary structure overlapped on the inner surface of the second convex hull structure, and meanwhile, the second capillary structure is arranged on the first surface of the heat conducting bump so that the second capillary structure is close to the second heat conducting shell compared with the first capillary structure positioned on the second convex hull structure, so that the thickness of the second capillary structure is thinned through the heat conducting bump pad being higher than the second capillary structure.
  2. 2. The solid heat transfer device of claim 1, wherein the first heat conductive shell further comprises an annular side plate, the annular side plate is connected to the periphery of the bottom plate, and the at least one first capillary structure is further stacked on the inner surface of the annular side plate.
  3. 3. The solid heat transfer device of claim 2, further comprising at least one third capillary structure overlying the second surface of the at least one heat conductive bump and joining the at least one first capillary structure and the at least one second capillary structure.
  4. 4. The solid heat transfer device of claim 2, wherein the at least one second capillary structure has a top surface facing away from the second convex hull structure, the top surface and the inner surface of the second convex hull structure maintain a first distance, a steam channel is formed between the inner surface of the second convex hull structure and the second heat conductive shell, a second distance is maintained between the inner surface of the second convex hull structure and the second heat conductive shell, and the ratio of the first distance to the second distance is 60% -65%: 35% -40%.
  5. 5. The volumetric heat transfer device of claim 1, further comprising a plurality of support structures having one end connected to the first thermally conductive shell and another end connected to the second thermally conductive shell.
  6. 6. The solid heat transfer device of claim 5, wherein the at least one thermally conductive bump is coupled to at least a portion of the support structures.
  7. 7. The solid heat transfer device of claim 1, wherein the at least one heat conducting bump is a plurality of heat conducting bumps, and the heat conducting bumps are parallel to each other.
  8. 8. The solid heat transfer device of claim 1, wherein the at least one thermally conductive bump is separate from the second thermally conductive shell.
  9. 9. The solid heat transfer device of claim 1, further comprising at least one second heat pipe, the second heat conductive shell having at least one second perforation, the at least one second heat pipe being mounted to the at least one second perforation, and the at least one second heat pipe being separate from the first heat conductive shell.
  10. 10. The volumetric heat transfer device of claim 9, wherein the first heat pipe has a first heat pipe chamber in communication with the fluid-tight chamber.
  11. 11. The volumetric heat transfer device of claim 10, wherein the second heat pipe has a second heat pipe chamber, the second heat pipe chamber not in communication with the fluid-tight chamber.
  12. 12. The volumetric heat transfer device of claim 1, wherein the at least one first capillary structure and the at least one second capillary structure are selected from the group consisting of metal mesh, sintered powder, and sintered ceramic.
  13. 13. The volumetric heat transfer device of claim 1, wherein the capillary structure of the first heat pipe is connected to the at least one second capillary structure.
  14. 14. The heat transfer device of claim 1, wherein the capillary structure of the first heat pipe is connected to the at least one second capillary structure by metal bonding.

Description

Three-dimensional heat transfer device Technical Field The invention relates to a heat transfer device, in particular to a three-dimensional heat transfer device. Background The technical principle of the temperature equalizing plate is similar to that of a heat pipe, but the conduction mode is different. The heat pipe is one-dimensional linear heat conduction, and the heat in the vacuum cavity vapor chamber is conducted on a two-dimensional surface, so that the efficiency is higher. Specifically, the temperature equalizing plate mainly comprises a cavity and a capillary structure. The cavity is internally provided with a hollow cavity for filling a working fluid. The capillary tissue is arranged in the hollow cavity. The heated portion of the chamber is referred to as the evaporation zone. The portion of the cavity that dissipates heat is referred to as the condensation zone. The working fluid evaporates in the evaporation zone absorbing heat and expands rapidly throughout the cavity. Heat evolved in the condensation zone condenses to a liquid state. Then, the liquid working medium returns to the evaporation area through the capillary structure to form a cooling cycle. However, the current isoplates and heat pipes operate independently, resulting in individual heat transfer, either planar or linear, rather than monolithic, three-dimensional heat transfer, for the isoplates or the heat pipes. Disclosure of Invention The invention provides a three-dimensional heat transfer device, which is used for improving the heat dissipation efficiency of the three-dimensional heat transfer device. The three-dimensional heat transfer device disclosed by the embodiment of the invention comprises a first heat conduction shell, a second heat conduction shell, at least one heat conduction convex block, at least one first capillary structure, at least one second capillary structure and at least one first heat pipe. The second heat conducting shell is provided with at least one first perforation, and the second heat conducting shell is arranged on the first heat conducting shell so that the first heat conducting shell and the second heat conducting shell form a liquid-tight cavity together. At least one heat conducting convex block protrudes out of the first heat conducting shell. At least one first capillary structure is overlapped on the first heat conducting shell. The at least one second capillary structure is stacked on the at least one heat conduction bump and is thermally coupled to the at least one first capillary structure. The at least one first heat pipe penetrates through the at least one first perforation and abuts against the at least one second capillary structure. According to the three-dimensional heat transfer device of the embodiment, through the design that the first heat pipe is propped against the second capillary structure overlapped on the heat conduction convex block, on one hand, the heat conduction convex block can be prevented from being provided with the abdication structure for the first heat pipe to pass through, and on the other hand, the backwater distance of the heat pipe can be shortened, so that the heat dissipation efficiency of the three-dimensional heat transfer device is improved. The foregoing description of the invention and the following description of embodiments are presented to illustrate and explain the principles of the invention and to provide a further explanation of the invention as claimed. Drawings Fig. 1 is a perspective view of a three-dimensional heat transfer device according to a first embodiment of the present invention. Fig. 2 is an exploded view of fig. 1. Fig. 3 is an exploded view of the other view of fig. 1. Fig. 4 is a cross-sectional view of fig. 1. Wherein, the reference numerals are as follows: 10-dimensional heat transfer device 100 First heat conductive shell 110 Bottom plate 111 Inner surface 120 Annular side plate 121 Inner surface 130 First convex hull structure 131 Inner surface 140 Second convex hull structure 141 Inner surface 142 Outer surface 200 Second heat conducting shell 210 First perforation 220 Second perforation 300 Heat conduction bump 310 First surface 320 Second surface 400 First capillary structure 500 Second capillary structure 510 Top surface 550 Third capillary structure 600 First heat pipe 610 First heat pipe chamber 620 Notch 700 Second heat pipe 710 Second heat pipe chamber 800 Supporting structure C circumference edge D1 first distance D2 second distance L1, L2 return water length S-shaped liquid-tight chamber Detailed Description Please refer to fig. 1 to 4. Fig. 1 is a perspective view of a three-dimensional heat transfer device according to a first embodiment of the present invention. Fig. 2 is an exploded view of fig. 1. Fig. 3 is an exploded view of the other view of fig. 1. Fig. 4 is a cross-sectional view of fig. 1. The three-dimensional heat transfer device 10 of the present embodiment includes a first heat conductive shell