CN-116529023-B - On-machine measuring system

CN116529023BCN 116529023 BCN116529023 BCN 116529023BCN-116529023-B

Abstract

An on-machine measurement system (H) of the present invention is provided with an on-machine measurement device (20) and an output device (30). The output device (30) acquires measurement data measured by the on-machine measurement device (20) by relatively moving the measurement position of the surface of the workpiece (W) with respect to the workpiece (W) at least in the circumferential direction, and performs a plurality of analyses relating to the processing quality of the workpiece (W) by using any one of a low-frequency component, a high-frequency component, and both the low-frequency component and the high-frequency component of the measurement data, and outputs a plurality of analysis results.

Inventors

MASUDA YUKI
KAWAHARA TAKASHI
Nonoama Ma
MURAKAMI SHINJI
Zhai Tengming

Assignees

株式会社捷太格特

Dates

Publication Date: 20260508
Application Date: 20220112
Priority Date: 20210127

Claims (7)

1. An on-machine assay system, wherein, The on-machine measurement system includes: An on-machine measuring device provided in a grinding device having a grinding wheel, the on-machine measuring device measuring a surface state of a workpiece ground by the grinding wheel and outputting measurement data indicating the surface state of the workpiece, and An output device that performs a plurality of analyses relating to the processing quality of the workpiece ground by the grinding device using the measurement data measured by the on-machine measuring device by relatively moving the measurement position of the surface of the workpiece with respect to the workpiece, and outputs a plurality of analysis results, The on-machine measuring device measures the surface state of the workpiece by moving a measurement position of the surface of the workpiece in a spiral manner in the circumferential direction and the axial direction of the workpiece, and outputs first measurement data as the measurement data, The on-machine measuring device measures the surface state of the work by moving the measuring position in the circumferential direction at the same position in the axial direction of the work, and outputs second measurement data as the measurement data, The output device performs the plurality of analyses using a first low-frequency component of the frequency components of the first measurement data and a first high-frequency component of the high-frequency region closer to the first low-frequency component, and a second low-frequency component of the frequency components of the second measurement data and a second high-frequency component of the high-frequency region closer to the second low-frequency component, and outputs a plurality of analysis results.
2. The on-board assay system of claim 1, wherein, The output device has: a first data analysis processing unit that calculates a plurality of first analysis results by analysis processing using the first low-frequency component and the second low-frequency component; a second data analysis processing unit for calculating a plurality of second analysis results by analysis processing using the first high frequency component and the second high frequency component, and And an output processing unit configured to output a plurality of analysis results using at least one of the first analysis result and the second analysis result.
3. The on-machine assay system according to claim 1 or 2, wherein, The plurality of analysis results include machining accuracy associated with grinding of the workpiece by the grinding device, and a mechanical state associated with grinding of the grinding device.
4. The on-board assay system of claim 1, wherein, The on-machine measuring device outputs the measurement data for each grinding process of the workpiece by the grinding device.
5. The on-machine assay system according to claim 1 or 2, wherein, The on-board measuring device outputs the measurement data as time-series data.
6. The on-machine assay system according to claim 1 or 2, wherein, The on-machine measuring device comprises a sizing device for measuring the outer diameter of the workpiece in the grinding device.
7. The on-board assay system of claim 6, wherein, The on-machine measuring device includes the sizing device and a high-frequency component measuring device which is assembled to the sizing device and measures the first high-frequency component and the second high-frequency component among the frequency components of the surface state of the workpiece, Measuring the first low frequency component and the second low frequency component of the frequency components of the surface state of the workpiece using the sizing device, The first high-frequency component and the second high-frequency component of the frequency components of the surface state of the workpiece are measured using the high-frequency component measuring device.

Description

On-machine measuring system Technical Field The present disclosure relates to on-machine assay systems. Background Patent document 1 describes an example of an automatic size measuring device. The automatic dimension measuring device is provided with a control unit for performing roundness analysis processing. The control unit controls the grinding device so as to perform sizing processing on the workpiece based on the measurement data measured by the sizing device, and analyzes the roundness of the workpiece based on the measurement data of the sizing device. Patent document 1 Japanese patent laid-open No. 2006-153897 However, the automatic size measuring device described in patent document 1 analyzes roundness using only measurement data obtained by the sizing device. When grinding a workpiece, it is desirable to measure the shape of the workpiece, the surface state after grinding, the operating state of the grinding device, and the like, and grasp the processing quality of the workpiece after grinding by the grinding device. Therefore, in a normal case, a plurality of devices for measuring the shape of the workpiece, the surface state after grinding, the operating state of the grinding device, and the like may be provided. As a result, the entire system including the grinding device is complicated and expensive, and it may take time to obtain the machining quality. Disclosure of Invention An object of the present disclosure is to provide an on-machine measuring system capable of obtaining grinding quality in a short time at low cost during grinding. The on-machine measurement system includes an on-machine measurement device provided in a grinding device, the on-machine measurement device measuring a surface state of a workpiece ground by the grinding device and outputting measurement data indicating the surface state of the workpiece, and an output device acquiring measurement data measured by the on-machine measurement device by relatively moving a measurement position of the surface of the workpiece with respect to the workpiece at least in a circumferential direction, and performing a plurality of analyses relating to a processing quality of the workpiece ground by the grinding device using any one of a low frequency component of the frequency components of the measurement data, a high frequency component of the frequency components of the measurement data, and a low frequency component and a high frequency component of the frequency components of the measurement data, and outputting a plurality of analysis results. According to the in-machine measuring system, the surface state of the workpiece can be measured by the in-machine measuring device provided in the grinding device, and the output device can perform a plurality of analyses relating to the processing quality of the workpiece by using the measurement data of any one of the low-frequency component, the high-frequency component, and the low-frequency component and the high-frequency component of the measurement data acquired from the in-machine measuring device. The output device can output a plurality of analysis results obtained by the analysis. Thus, for example, the on-machine measurement system can output a plurality of analysis results using only the low frequency component of the measurement data, only the high frequency component of the measurement data, or both the low frequency component and the high frequency component of the measurement data. The on-machine measurement system may output a plurality of analysis results by appropriately combining the low frequency component and the high frequency component as described below, for example, by using a combination of the first low frequency component and the second low frequency component of the measurement data, the first high frequency component and the second high frequency component of the measurement data, the first low frequency component and the second high frequency component of the measurement data, or the second low frequency component and the first high frequency component of the measurement data. Therefore, according to the on-machine measuring system, the on-machine measuring device having a simple structure for measuring the surface state of the workpiece can be used, and therefore, the structure of the system can be simplified and made inexpensive. In addition, according to the on-machine measurement system, by appropriately combining the low-frequency component and the high-frequency component of the measurement data measured by the on-machine measurement device, the time required to obtain the analysis result can be shortened as compared with the case where analysis is performed by collecting the respective measurement data from a plurality of measurement devices. Drawings Fig. 1 is a plan view showing the structure of a grinding apparatus. Fig. 2 is a diagram for explaining an on-machine measurement device. Fig. 3 is a flowchart showing a grinding process of the grindi