CN-116532814-B - Cutting path generation method, cutting system, electronic device and medium

Abstract

The embodiment of the application relates to the field of data processing, and discloses a cutting path generation method, a cutting system, electronic equipment and a medium. The method for generating the cutting path of the dental appliance comprises the steps of obtaining cutting path information of a film pressing component to be cut and a target cutting position of the film pressing component, wherein the cutting path information comprises cutting speeds of all cutting points, obtaining point offset information of all the cutting points according to preset cutting parameters of a laser, cutting speeds of all the cutting points and the target cutting position when the cutting speeds of all the cutting points meet preset changing conditions, and adding the point offset information to the cutting path information to generate updated cutting path information. When the cutting speed meets the conditions, the cutting point is shifted, the power density of the laser light spot at the shifted cutting point is reduced, the problem of energy accumulation caused by the slow cutting speed can be solved, and the dental appliance which meets the correction requirement of a user and has complete shape can be generated.

Inventors

• LI SHUAI
• WANG HUI
• PU HAOXUE
• SHEN BINJIE
• YAO JUNFENG

Assignees

• 浙江正雅齿科股份有限公司

Dates

Publication Date

20260508

Application Date

20220126

Claims (16)

1. 1. A method of generating a cutting path, the method comprising: acquiring cutting path information of a film pressing assembly to be cut and a target cutting position of the film pressing assembly, wherein the cutting path information comprises cutting speeds of all cutting points; When the cutting speed of each cutting point meets a preset changing condition, acquiring point offset information of each cutting point according to preset cutting parameters of a laser, the cutting speed of each cutting point and the target cutting position, wherein the point offset information is used for enabling the cutting point to deviate from a laser focus of the laser; and adding each point offset information to the cutting path information to generate updated cutting path information.
2. 2. The cutting path generation method of claim 1, wherein the cutting parameters of the laser include laser power and laser beam cone angle; The obtaining the point offset information of each cutting point according to the preset cutting parameters of the laser, the cutting speed of each cutting point and the target cutting position includes: and acquiring the point offset information according to the laser power, the laser beam cone angle, the cutting speed of each cutting point and the target cutting position.
3. 3. The cutting path generation method according to claim 2, wherein the acquiring the point offset information according to the laser power, the laser beam cone angle, the cutting speed of each of the cutting points, and the target cutting position includes: Determining a first light spot power density required by each cutting point according to the cutting speed of each cutting point; Determining energy density distribution information of a laser beam of the laser according to the laser power and the laser beam cone angle; And determining the point offset information according to the first light spot power density and the energy density distribution of the laser beam of the laser.
4. 4. The cutting path generation method according to claim 3, wherein the energy density distribution information includes a second spot power density of the laser at the laser focus and a spot power density attenuation amount of a laser divergence point when the laser beam diverges; Determining a spot power density offset of the cutting point according to the first spot power density and the second spot power density; and determining the point offset information according to the light spot power density attenuation amount and the light spot power density offset amount.
5. 5. The method of claim 3, wherein the energy density distribution information includes a second spot power density and a spot power density attenuation factor of the laser at the laser focus, wherein the spot power density attenuation factor refers to an attenuation amount of the spot power density within a unit distance from the laser focus; and obtaining the point offset information of the cutting point according to the first light spot power density, the second light spot power density and the light spot power density attenuation factor.
6. 6. The method of claim 1, further comprising obtaining a film thickness of the film pressing assembly and a film characteristic of the film pressing assembly; The obtaining the point offset information of each cutting point according to the preset cutting parameters of the laser, the cutting speed of each cutting point and the target cutting position includes: And acquiring the point offset information according to the cutting parameters of the laser, the cutting speed of each cutting point, the target cutting position, the thickness of the diaphragm and the diaphragm characteristics.
7. 7. The cutting path generation method according to claim 6, further comprising: And obtaining laser power according to the designated cutting speed of the film pressing assembly, the film thickness and the film characteristics, wherein the laser power is kept constant in the cutting of the film pressing assembly.
8. 8. The cutting path generation method according to claim 1, wherein the cutting path information further includes a cutting angle of each of the cutting points; The obtaining the point offset information of each cutting point according to the preset cutting parameters of the laser, the cutting speed of each cutting point and the target cutting position includes: And acquiring the point offset information according to the cutting parameters of the laser, the cutting speed of each cutting point, the cutting angle of each cutting point and the target cutting position.
9. 9. The cutting path generation method according to any one of claims 1 to 7, wherein the cutting path information further includes a cutting angle of each of the cutting points and a cutting path of each of the cutting points; the adding each point offset information to the cutting path information, generating updated cutting path information, includes: acquiring path offset information of a cutting path of each cutting point according to the point offset information, the cutting angle and the target cutting position; The adding each point offset information to the cutting path information, generating updated cutting path information, includes: And adding each point offset information and each path offset information to the cutting path information to generate the updated cutting path information.
10. 10. The cutting path generation method of any one of claims 1 to 8, wherein the film pressing assembly comprises a tooth mold and a tooth appliance to be cut on the tooth mold; The point offset information is used for enabling laser energy applied to the target cutting position by the laser to be maintained within a preset energy range, and the laser energy in the energy range can cut through the tooth appliance to be cut to form a complete tooth appliance on the basis of maintaining the integrity of the appliance area of the tooth mould.
11. 11. A method of cutting, the method comprising: acquiring updated cutting path information generated by the cutting path generation method according to any one of claims 1 to 10; Cutting the film pressing component to be cut according to the updated cutting path information to generate the tooth appliance.
12. 12. The cutting method according to claim 11, wherein the updated cutting path information includes a cutting path, point offset information, and path offset information for each cutting point; cutting the film pressing component to be cut according to the updated cutting path information to generate a tooth appliance, wherein the tooth appliance comprises: for each of the cut points, moving the film pressing assembly according to the point offset information so that the cut point moves to a specified cut position indicated by the point offset information; Determining a designated cutting path of the cutting point according to the path offset information and the cutting path; and after the movement of the film pressing assembly is completed, cutting the film pressing assembly according to the designated cutting path by taking the designated cutting position as a cutting starting point to generate the tooth appliance.
13. 13. The cutting path generation system is characterized by comprising a first acquisition module, a second acquisition module and a first generation module; the first acquisition module is used for acquiring cutting path information of a film pressing assembly to be cut and a target cutting position of the film pressing assembly, wherein the cutting path information comprises cutting speeds of all cutting points; The second acquisition module is used for acquiring point offset information of each cutting point according to preset cutting parameters of the laser, the cutting speed of each cutting point and the target cutting position when the cutting speed of each cutting point meets preset changing conditions, wherein the point offset information is used for enabling the cutting point to deviate from a laser focus of the laser; The first generation module is configured to add each point offset information to the cutting path information, and generate updated cutting path information.
14. 14. The cutting path generation system of claim 13, further comprising a transmission module configured to transmit the updated cutting path information to a preset cutting system, such that the cutting system cuts the film pressing assembly according to the updated cutting path information to generate a dental appliance.
15. 15. An electronic device, comprising: At least one processor, and A memory communicatively coupled to the at least one processor, wherein, The memory stores instructions executable by the at least one processor to enable the at least one processor to perform the cutting path generation method of any one of claims 1 to 10 or the cutting method of any one of claims 11 to 12.
16. 16. A computer readable storage medium storing a computer program, wherein the computer program when executed by a processor implements the cutting path generation method of any one of claims 1 to 10 or the cutting method of any one of claims 11 to 12.

Description

Cutting path generation method, cutting system, electronic device and medium Technical Field The embodiment of the application relates to the field of data processing, in particular to a cutting path generation method, a cutting system, electronic equipment and a medium, which belong to the field of dental instrument data processing. Background In the process of processing the dental appliance, the dental appliance is usually required to be subjected to the procedures of 3D printing, film preparation, film pressing, cutting, cleaning and the like of a dental model. Most of the existing tooth appliance cuts adopt manual cutting, but due to lower manual cutting efficiency, automatic cutting tends to be adopted at present. The automatic cutting scheme is that a fixed laser is used as a cutting tool, a robot absorbs a film pressing component through a clamp, the film pressing component comprises a tooth die and a tooth appliance to be cut, wherein the tooth die is divided into a base area and an appliance area, and then the robot drives the film pressing component to move, so that the laser cuts (relates to rotation, offset and acceleration and deceleration movement) along a target cutting position on the film pressing component according to a cutting path, and finally a finished tooth appliance is obtained. Because the shape of the tooth gum line is complex, the cutting path of the appliance is also very complex, and in order to obtain an ideal appliance finished product, the speed of the robot for driving the film pressing assembly to cut is required to be changed in real time according to the shape of the gum line. The laser matched with the laser can change the output power in real time according to the cutting speed in an ideal state so as to prevent the appliance from cutting marks and over-melting or cutting the appliance or cutting through the appliance area of the tooth mould. However, the laser output power adjustment needs to be delayed for a long time through a series of software and hardware control processes, the cutting speed of the correction device is fast and needs to be continuously carried out, the ideal cutting effect is difficult to obtain, the laser output power real-time adjustment needs a complex laser control system, the requirements on the laser and the control system are high, and the service life of the laser can be reduced due to the real-time change of the laser output power. Therefore, the laser used in practical application is usually a fixed power laser, but there are also several problems that 1, in the area of slower cutting speed, the appliance is easily cut and excessively melted or cut, and the appliance is damaged or scrapped. 2. In the area with slower cutting speed, the black trace is easily melted at the notch of the appliance, and the workload of the subsequent polishing procedure is increased. 3. In addition, the correction device is required to be installed on the tooth mould to compare with a target cutting position to judge whether the correction device is qualified or not in the correction device process inspection, and if the correction device area of the tooth mould is damaged, the inspection result is affected. Disclosure of Invention The embodiment of the application aims to provide a cutting path generation method, a cutting system, electronic equipment and a medium, so that a tooth appliance to be cut on a tooth mould of a film pressing assembly can be cut through on the basis of guaranteeing the integrity of an appliance area of the tooth mould, and further the tooth appliance which meets the correction requirement of a user and has complete shape can be generated. In order to solve the technical problems, the embodiment of the application provides a cutting path generation method, which comprises the steps of obtaining cutting path information of a film pressing component to be cut and a target cutting position of the film pressing component, wherein the cutting path information comprises cutting speeds of all cutting points, obtaining point offset information of all the cutting points according to preset cutting parameters of a laser, the cutting speeds of all the cutting points and the target cutting position when the cutting speeds of all the cutting points meet preset changing conditions, and adding the point offset information into the cutting path information to generate updated cutting path information. In addition, the cutting path generating method provided by the embodiment of the application comprises the steps of obtaining the point offset information of each cutting point according to the preset cutting parameters of the laser, the cutting speed of each cutting point and the target cutting position, wherein the cutting parameters of the laser comprise the laser power and the laser beam cone angle, and the point offset information is obtained according to the laser power, the laser beam cone angle, the cutting speed of each cutting point and t