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CN-116603824-B - Cleaning and drying process for silicon wafer packaging box

CN116603824BCN 116603824 BCN116603824 BCN 116603824BCN-116603824-B

Abstract

The invention provides a cleaning and drying process of a silicon wafer packaging box, which comprises the steps of loading and placing the packaging box into a pure water tank for soaking, transferring the packaging box into a pre-cleaning tank for pre-cleaning, entering the cleaning tank for cleaning, moving the cleaned packaging box to a first treatment position for drying treatment, transferring the dried packaging box to a second treatment position for primary standing and storage, then placing the packaging box into a constant-temperature nitrogen cabinet for secondary standing treatment, taking the packaging box out, and then carrying out tertiary standing at the second treatment position to finish the treatment. The invention has the beneficial effects that the adopted packaging box comprises three parts, namely hot air drying, heat dissipation and flow guide, primary environment standing and cooling, and N2 cabinet drying, and the packaging box cleaned by the method ensures the surface and tiny liquid drops thereof to be sufficiently dried.

Inventors

  • YOU BAILING
  • WANG WEISHI
  • ZHOU YINGCHAO
  • DENG CHUNXING
  • TAN YONGLIN
  • SUN CHENGUANG
  • WANG YANJUN

Assignees

  • 天津中环领先材料技术有限公司
  • 中环领先半导体材料有限公司

Dates

Publication Date
20260512
Application Date
20230602

Claims (8)

  1. 1. A cleaning and drying process for a silicon wafer packaging box comprises the following steps: the packaging box is uploaded and placed into a pure water tank for soaking, transferred into a pre-cleaning tank for pre-cleaning, and enters the cleaning tank for cleaning; the cleaned packaging box is moved to a first treatment position for drying treatment; Transferring the dried packaging box to a second treatment position for primary standing storage, then placing the packaging box into a constant-temperature nitrogen cabinet for secondary standing treatment, taking out the packaging box, and then standing for three times at the second treatment position to finish the treatment; the second treatment position is a primary microenvironment, and the packaging box is kept stand for 30-60min at the second treatment position once; the box cover and the box body are arranged in a staggered manner when the packaging box is placed at the second treatment position for one time.
  2. 2. The process for cleaning and drying the silicon wafer packaging box according to claim 1, comprising the steps of spraying and cleaning the packaging box for 10-15min, wherein a spraying hole is formed in the pre-cleaning tank.
  3. 3. The process for cleaning and drying the silicon wafer packaging box according to claim 1 or 2, comprising the steps of performing ultrasonic cleaning on the packaging box, wherein the cleaning tank is an ultrasonic cleaning tank with ultrasonic power of 25-30 KHz.
  4. 4. A process for cleaning and drying a silicon wafer packaging box according to claim 3, comprising the step of providing a heating function in said cleaning tank, and maintaining the temperature of the cleaning water at 40-60 ℃ when cleaning said packaging box.
  5. 5. A process for cleaning and drying a wafer package as defined in claim 1, comprising purging said package from different angles with hot air at a temperature of 45-65 ℃.
  6. 6. The process for cleaning and drying the silicon wafer packaging box according to claim 1, wherein the secondary standing time of the packaging box in the constant-temperature nitrogen cabinet is 6-10h.
  7. 7. A process for cleaning and drying a silicon wafer packaging box according to claim 1, comprising the step of standing for 30-150min at the second treatment place for three times.
  8. 8. The process for cleaning and drying a silicon wafer packaging box according to claim 1, wherein the pure water in the pure water tank, the pre-cleaning tank and the cleaning tank is filtered ultrapure water.

Description

Cleaning and drying process for silicon wafer packaging box Technical Field The invention belongs to the field of storage and packaging of finished products of silicon monocrystalline polished wafers of semiconductor materials, and particularly relates to a cleaning and drying process of a silicon wafer packaging box. Background Monocrystalline silicon wafers are important substrate materials in Integrated Circuit (IC) manufacturing processes, and the surface quality of polished wafers has very important effects on the device properties of integrated circuits, such as silicon wafer surface flatness, particles, roughness, metal impurities, product appearance, and the like. Parameters directly related to the quality of the polishing sheet in the processing process of the semiconductor material can be developed and controlled in the processes of process technology, quality control and the like, but factors indirectly influencing the quality of the polishing sheet such as the production factory environment, tooling carriers, packaging, transportation and other indirect product technologies are relatively less researched, and in recent years, the industry finds out the particle level of the factory environment, metal ions and the like in the workshop gas environment, the vacuum packaging process of the silicon wafer, packaging boxes, packaging consumables and the like have great influence on the quality of the silicon wafer when solving the product problem. With the development of industry, the line width process in the field of integrated circuits is smaller and smaller, the current 28nm,14nm and 7nm process technology has begun to produce in mass production, and has raised higher requirements on the processing technology of polishing sheets, and the product quality of maintaining the small particle size level has raised stricter requirements on the product packaging technology, the transportation technology and the like besides raised higher requirements on the processing technology of polishing sheets, and the product clean package has raised higher requirements on the silicon wafer containing device-silicon wafer box, so how to ensure the cleaning of the polishing wafer box and ensure that the increase of small-size particles is effectively controlled is the key point of the patent of the invention. In the mass production process, the cleaned wafer box cannot be immediately used, one factor is that the wafer box just cleaned is not truly dried (generally, only the surface has no water drops, water vapor possibly remains in the wafer box surface, or the wafer box surface is inappropriately cooled in the drying process to cause the phenomenon of so-called moisture regain after packaging), and the other factor is that in the mass production, the related materials are difficult to realize seamless connection in the preparation and standby stage due to factors such as productivity/process/material preparation of upper and lower working procedures, so that the influence of the cleaning, drying and standing and standby modes of the packaged wafer box on the product quality is emphasized. Disclosure of Invention The invention aims to solve the problems that the wafer box is not really dried after being cleaned, and the wafer box cannot be directly packaged due to factors such as productivity, process, material preparation and the like of up-and-down process equipment in mass production, and impurities are attached during waiting. In order to solve the technical problems, the invention adopts the technical scheme that the cleaning and drying process of the silicon wafer packaging box comprises the following steps: the packaging box is uploaded and placed into a pure water tank for soaking, transferred into a pre-cleaning tank for pre-cleaning, and enters the cleaning tank for cleaning; the cleaned packaging box is moved to a first treatment position for drying treatment; And transferring the dried packaging box to a second treatment position for primary standing storage, then placing the packaging box into a constant-temperature nitrogen cabinet for secondary standing treatment, taking out the packaging box, and then standing for three times at the second treatment position to finish the treatment. Furthermore, a spray hole is arranged in the pre-cleaning tank, the packaging box is sprayed and cleaned, and the cleaning time is 10-15min. Further, the cleaning tank is an ultrasonic cleaning tank, the ultrasonic power of the ultrasonic cleaning tank is 25-30KHz, and the packaging box is subjected to ultrasonic cleaning. Further, the washing tank is also provided with a heating function, and the temperature of the washing water is kept at 40-60 ℃ when the packaging box is washed. Further, the drying process purges the package from different angles with air at 45-65 ℃. Further, the second treatment position is a primary microenvironment, and the packaging box is kept stand for 30-60min at the second treatment position onc