CN-116619850-B - High-strength heat conduction silica gel

CN116619850BCN 116619850 BCN116619850 BCN 116619850BCN-116619850-B

Abstract

The invention discloses high-strength heat-conducting silica gel in the field of silica gel, which comprises a lower silica gel layer, a lower glass fiber layer, a resin layer, an upper glass fiber layer and an upper silica gel layer which are sequentially stacked from bottom to top, wherein the resin layer is provided with a copper wire mesh which is horizontally paved inside, at least two protruding parts which extend to the edge of the resin layer are arranged around the copper wire mesh, one surface of the resin layer, which is connected with the upper glass fiber layer, is provided with at least two protruding upper inserting strips which penetrate through the upper glass fiber layer and extend to the inside of the upper silica gel layer, the upper inserting strips are provided with protruding upper limiting blocks which are embedded into the inside of the upper silica gel layer, one surface of the resin layer, which is connected with the lower glass fiber layer, is provided with at least two protruding lower inserting strips which penetrate through the lower glass fiber layer and extend to the inside of the lower silica gel layer, and the lower inserting strips are provided with protruding lower limiting blocks which are embedded into the inside of the lower silica gel layer. The copper wire mesh is added inside the resin layer, so that the stability of the internal structure can be enhanced and the heat conduction silica gel is prevented from deforming besides the internal heat conduction effect.

Inventors

Qian Lingzhen
HUANG XIAOQIAO
QIAN WEI
ZHOU GANG

Assignees

东莞市昌圣硅胶制品有限公司

Dates

Publication Date: 20260505
Application Date: 20230419

Claims (5)

1. The high-strength heat conduction silica gel comprises a lower silica gel layer, a lower glass fiber layer, a resin layer, an upper glass fiber layer and an upper silica gel layer which are sequentially stacked from bottom to top, and is characterized in that the resin layer is provided with a copper wire mesh which is horizontally paved inside, at least two protruding parts which extend to the edge of the resin layer are arranged around the copper wire mesh, one surface of the resin layer, which is connected with the upper glass fiber layer, is provided with at least two protruding upper inserting strips which penetrate through the upper glass fiber layer and extend to the inside of the upper silica gel layer, the upper inserting strips are provided with upper limiting blocks which are protruding and embedded into the inside of the upper silica gel layer, one surface of the resin layer, which is connected with the lower glass fiber layer, is provided with at least two protruding lower inserting strips which penetrate through the lower glass fiber layer and extend to the inside of the lower silica gel layer, and the lower inserting strips are provided with lower limiting blocks which are protruding and embedded into the inside of the lower silica gel layer.
2. The high-strength heat-conducting silica gel as set forth in claim 1, wherein the resin layer is further provided with a containing groove for containing a copper wire mesh.
3. The high-strength heat-conducting silica gel as set forth in claim 1, wherein the outer sides of the upper and lower insertion strips are covered with copper rings tightly fixed.
4. The high-strength heat-conducting silica gel as set forth in claim 1, wherein the upper limiting block has a width greater than that of the upper insertion strip and the lower limiting block has a width greater than that of the lower insertion strip.
5. The high-strength heat-conducting silica gel as set forth in claim 1, wherein the upper silica gel layer and the lower silica gel layer are both adhered with removable protective film layers.

Description

High-strength heat conduction silica gel Technical Field The invention relates to the technical field of silica gel, in particular to high-strength heat-conducting silica gel. Background In daily life, people can be widely applied to various electronic products, and all electronic products relate to the problem of heat dissipation, because the temperature of electronic components in the electronic products can be increased in the use process, particularly, transistors and semiconductor components are particularly easy to generate heat, and when the use temperature of the electronic components is high, the performance of the electronic components can be reduced, so that the electronic components need to be subjected to heat dissipation. When the heat dissipation element is connected with the heat dissipation element, the gap between the heat dissipation element and the heat dissipation element is generally required to be filled with a filling material and a heat conduction material, but the existing heat conduction silica gel material is insufficient in internal compactness, and the heat conduction effect is poor due to the fact that the heat conduction is completely dependent on the performance of the silica gel, meanwhile, after the silica gel is rubbed after the elements move mutually during connection, the compression resistance is insufficient due to the fact that the compression is easy to deform. Disclosure of Invention In order to overcome the defects of the prior art, the invention provides high-strength heat-conducting silica gel, which can effectively solve the problems of poor heat-conducting property and poor compression resistance of the conventional silica gel. The technical scheme adopted for solving the technical problems is as follows: The utility model provides a high strength heat conduction silica gel, includes from down up lower silica gel layer, down glass fiber layer, resin layer, goes up glass fiber layer and last silica gel layer that stacks in proper order, the resin layer is equipped with the copper wire net of tiling in inside, copper wire net is equipped with two at least fixed bellying that extend to resin layer edge all around, resin layer connects glass fiber layer one side and is equipped with two at least archs and pierce through glass fiber layer and extend to the inside last stopper that inserts of upper silica gel layer, it is equipped with the inside fixed stopper of protruding embedding upper silica gel layer to go up the stopper that inserts, resin layer connects glass fiber layer one side and is equipped with two at least archs and pierce through glass fiber layer and extend to the inside lower strip that inserts down of silica gel layer, lower the stopper that inserts that the strip is equipped with protruding embedding to the inside fixed of silica gel layer down. Further, a containing groove for containing the copper wire mesh is also formed in the resin layer. Further, copper rings which are tightly fixed are sleeved on the outer side surfaces of the upper inserting strip and the lower inserting strip. Further, the width of the upper limiting block is larger than that of the upper inserting strip, and the width of the lower limiting block is larger than that of the lower inserting strip. Further, the upper silica gel layer and the lower silica gel layer are respectively stuck with a removable protective film layer. Compared with the prior art, the invention has the beneficial effects that: According to the invention, the copper wire mesh is added in the resin layer, the copper wire mesh can not only improve the internal heat conduction effect through the self performance, but also strengthen the stability of the internal structure, prevent the heat conduction silica gel from deforming and improve the compression resistance, and meanwhile, the upper side and the lower side of the resin layer are provided with the insert strips and the limiting blocks which are inserted into the silica gel layers at the two sides to be fixed, so that the tightness between the upper side and the lower side of the resin layer is enhanced, the heat conduction effect is improved, the whole structure is simple, and the practicability is strong. Drawings FIG. 1 is a schematic view of the external structure of a high-strength heat-conducting silica gel according to the present invention; FIG. 2 is a schematic view of the internal cross-section structure of a high-strength heat-conductive silica gel according to the present invention; FIG. 3 is a schematic diagram of a high-strength heat-conducting silica gel copper wire mesh distribution structure according to the present invention; FIG. 4 is a schematic view of a high-strength heat-conducting silica gel containing tank according to the present invention; reference numerals in the drawings: The glass fiber reinforced plastic composite material comprises a 1-lower silica gel layer, a 2-lower glass fiber layer, a 3-resin layer, a 4-upper gl