CN-116657124-B - Film forming auxiliary agent for water-based solder ball surface treating agent

Abstract

The invention provides a film forming additive for a water-based solder ball surface treatment agent, and relates to the technical field of metal surface treatment. The film forming auxiliary agent is composed of diethylene glycol methyl ether, diethylene glycol monoallyl ether and benzyl glycidyl ether, and the water-based solder ball surface treating agent prepared by the film forming auxiliary agent and raw materials such as an azole film forming agent, a dispersing agent, a complexing agent, a nonionic surfactant, a penetrating agent, deionized water and the like can form a layer of oxidation resistant film on the surface of a solder ball, the oxidation resistant film is not easy to fall off in the collision process, the problem that the surface of the solder ball is easy to yellow and black due to oxidation is solved, meanwhile, the film forming speed is high, the efficiency is high, the oxidation resistance of the surface of the solder ball can be effectively improved, and the storage and the service life of the solder ball are prolonged. The water-based solder ball surface treating agent has simple preparation process, convenient use and good physical stability after film formation.

Inventors

• ZHANG WENQIAN
• WANG TONGJU
• LIN ZIPENG
• LEI YONGPING

Assignees

• 北华航天工业学院

Dates

Publication Date

20260512

Application Date

20230508

Claims (8)

1. 1. A film-forming auxiliary agent is characterized by comprising diethylene glycol methyl ether, diethylene glycol monoallyl ether and benzyl glycidyl ether in a weight ratio of 1 (0.1-0.3) to 0.5-2.
2. 2. A water-based solder ball surface treatment agent composed of the film forming auxiliary agent of claim 1 is characterized by comprising the following raw materials, by weight, 1-5wt% of an azole film forming agent, 1-2wt% of a film forming auxiliary agent, 0.1-3wt% of a dispersing agent, 0.01-1wt% of a complexing agent, 0-1wt% of a nonionic surfactant, 0.01-0.5wt% of a penetrating agent and the balance of deionized water.
3. 3. The water-based solder ball surface treatment agent according to claim 2, wherein the azole film forming agent is one or more of benzotriazole, 1,2, 4-triazole, pyrazole, 5-phenyl-1H-tetrazole, benzimidazole, benzothiazole, 2-mercaptobenzimidazole, 2-aminobenzimidazole, 2-mercaptobenzothiazole, 5-aminotetrazole, methylbenzotriazole, 3-amino-1, 2, 4-triazole, 3, 5-diamino-1, 2, 4-triazole.
4. 4. The water-based solder ball surface treatment agent according to claim 2, wherein the dispersing agent is one or more of polyacrylic acid, polyacrylamide, fatty acid polyethylene glycol ester, polyethylene glycol 8000, polyethylene glycol oleate, 4-methyl-2-pentanol, simethicone, oxidized polyethylene and sodium dodecyl sulfate.
5. 5. The water-based solder ball surface treatment agent according to claim 2, wherein the complexing agent is one or more of citric acid, azelaic acid, succinic acid, oxalic acid, aminotrimethylene phosphonic acid, sodium ethylene triamine pentamethylene phosphate, diethylene triamine pentamethylene phosphate, glutamic acid, arginine, glycine, triethanolamine, tetraethylammonium hydroxide, ethylenediamine tetramethylene sodium phosphate.
6. 6. The water-based solder ball surface treatment agent according to claim 2, wherein the nonionic surfactant is one or more of fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, nonylphenol polyoxyethylene ether, sorbitan monooleate, alkyl alcohol amide, coco diethanolamide, glycerol stearate, lauric acid diethanolamide, and isotridecyl alcohol polyoxyethylene ether.
7. 7. The water-based solder ball surface treatment agent according to claim 2, wherein the penetrating agent is one or more of isooctanol polyoxyethylene ether phosphate AEP, isooctanol polyoxyethylene ether sodium phosphate OEP70, fatty alcohol polyoxyethylene ether JFC, diisooctyl maleate sulfonate T, and dibutyl sodium naphthalene sulfonate.
8. 8. The method for preparing a water-based solder ball surface treatment agent according to any one of claims 2 to 7, comprising the steps of: S1, mixing diethylene glycol methyl ether, diethylene glycol monoallyl ether and benzyl glycidyl ether in proportion to obtain a mixed solution A; s2, dissolving the complexing agent and the nonionic surfactant with a proper amount of deionized water to obtain a mixed solution B; s3, adding the mixed solution B into the mixed solution A, continuously stirring, heating the solution to 55 ℃, adding an azole film forming agent, uniformly mixing, and standing to room temperature to obtain a mixed solution C; And S4, sequentially adding a dispersing agent, a penetrating agent and the rest deionized water into the solution C, and uniformly mixing to obtain the water-based solder ball surface treating agent.

Description

Film forming auxiliary agent for water-based solder ball surface treating agent Technical Field The invention relates to the technical field of metal surface treatment, in particular to a film forming additive for a water-based solder ball surface treatment agent. Background With the development of integrated circuits in the directions of high density, high integration, miniaturization and thinning, solder balls are used as key materials in advanced packaging processes such as Ball grid array packaging (Ball GRID ARRAY, BGA), chip level packaging (CHIP SCALE PACKAGE, CSP) and the like, can meet the packaging requirements of increasing I/O quantity, increasing wiring density and increasing substrate layer number of the integrated circuits, and are widely applied to packaging of high-order IC chips such as CPU (Central processing Unit), GPU (graphics processing Unit) and the like. The solder ball has the function of realizing the electrical and mechanical connection of the chip element, and the quality of the solder ball directly influences the reliability of the electronic product package, so that the solder ball has higher quality requirements on the brightness, the roundness, the conductivity, the mechanical connection performance and the like. However, in practical production and application, the surface of the solder ball is extremely easy to oxidize, and further phenomena such as yellowing, blackening and the like occur, so that the reliability of assembly is seriously affected. Therefore, the prepared solder balls need to be protected so as to ensure the storage, transportation and use stability of the high-quality solder balls. In the prior art, three methods are mainly used for the antioxidation treatment of the solder ball surface. Firstly, the oxidation resistance of the solder ball is increased by adding microelements such as Ge, P and the like, but the method can cause the liquid phase temperature of the alloy to rise, and has adverse effects on the organization structure and the welding performance of the solder ball. Secondly, the inert gas protection method is utilized, namely, the prepared solder balls are filled with nitrogen for sealing treatment, but if the solder balls cannot be used up in time after deblocking, the surfaces of the solder balls can be oxidized quickly, and material waste is caused. Thirdly, a surface treatment agent method is utilized, namely, a layer of organic film which is easy to volatilize when heated is formed on the surface of the soldering tin ball through an organic surface treatment agent, the surface of the soldering tin ball is isolated from air, and the purpose of antioxidation is achieved, however, the viscosity of an organic solvent is very high, the soldering tin ball is easy to adhere, and the formed organic film mainly utilizes the physical adhesion effect of the surface treatment agent, so that the soldering tin ball is easy to fall off in severe collision, and cannot play a good role in antioxidation. Therefore, how to overcome the above problems, to provide a solder ball surface treating agent which has higher film forming speed, higher efficiency and more convenient use, can prevent the solder ball surface from adhering after treatment, can realize the purpose of antioxidation of the solder ball surface, and can improve the storage, transportation and use stability of the solder ball is one of the important problems to be solved at present. Disclosure of Invention In order to overcome the problems, the invention provides a film forming additive, and the water-based solder ball surface treatment agent prepared by taking the film forming additive as a raw material can effectively improve the oxidation resistance of the solder ball surface, prolong the storage and service life of the solder ball, simplify the preparation process, facilitate the use, maintain a higher film forming speed and ensure that the solder ball surface treatment agent has good physical stability. The film forming additive consists of diethylene glycol methyl ether, diethylene glycol monoallyl ether and benzyl glycidyl ether in the weight ratio of 1 (0.1-0.3) to 0.5-2. The invention further provides a water-based solder ball surface treatment agent prepared by taking the film forming auxiliary agent as a main raw material, wherein the surface treatment agent comprises the following raw materials of 1-5wt% of an azole film forming agent, 1-2wt% of the film forming auxiliary agent, 0.1-3wt% of a dispersing agent, 0.01-1wt% of a complexing agent, 0-1wt% of a nonionic surfactant, 0.01-0.5wt% of a penetrating agent and the balance of deionized water. Further, the azole film forming agent is one or more of benzotriazole, 1,2, 4-triazole, pyrazole, 5-phenyl-1H-tetrazole, benzimidazole, benzothiazole, 2-mercaptobenzimidazole, 2-aminobenzimidazole, 2-mercaptobenzothiazole, 5-aminotetrazole, methylbenzotriazole, 3-amino-1, 2, 4-triazole and 3, 5-diamino-1, 2, 4-triazole. Preferably, the azol