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CN-116685534-B - Sheet for packaging electronic parts

CN116685534BCN 116685534 BCN116685534 BCN 116685534BCN-116685534-B

Abstract

The present invention provides a sheet for packaging electronic parts, which can effectively inhibit the generation of fuzzing and burrs, and comprises a base sheet having at least one base layer, wherein the base layer comprises a thermoplastic resin (I) and a resin (II) comprising at least 1 copolymer selected from (methyl) acrylic acid alkyl ester copolymer (A) and styrene-acrylonitrile copolymer (B) with a weight average molecular weight of 700000-4300000.

Inventors

  • MUTO TAKESHI
  • Ida ikka
  • Taninaka Ryo

Assignees

  • 电化株式会社

Dates

Publication Date
20260508
Application Date
20211214
Priority Date
20210108

Claims (9)

  1. 1. A sheet for packaging electronic parts, comprising a base sheet having at least one base layer comprising a thermoplastic resin (I) and a resin (II) comprising at least one copolymer selected from the group consisting of an alkyl (meth) acrylate copolymer (A) and a styrene-acrylonitrile copolymer (B) having a weight average molecular weight of 700000 to 4300000, The thermoplastic resin (I) is contained in the base layer in a proportion of 70 to 99 mass% and the resin (II) is contained in a proportion of 1 to 30 mass% relative to the total mass of the resin composition constituting the base layer.
  2. 2. The sheet for electronic part packaging according to claim 1, wherein the alkyl (meth) acrylate copolymer (a) comprises an alkyl acrylate monomer unit (a 1) having an alkyl group having 4 to 8 carbon atoms.
  3. 3. The sheet for electronic part packaging according to claim 1 or 2, wherein the thermoplastic resin (I) comprises at least 1 thermoplastic resin selected from ABS-based resins and PC-based resins.
  4. 4. The sheet for packaging electronic parts according to claim 1 or 2, wherein the thermoplastic resin (I) contains 70 to 100 mass% of ABS resin based on the total mass of the thermoplastic resin (I).
  5. 5. The sheet for electronic part packaging according to claim 1 or 2, wherein the base sheet has at least one partition layer that partitions the base layer.
  6. 6. The sheet for packaging electronic parts according to claim 5, wherein an average value of thicknesses of the layers of the base material layer is equal to or greater than an average value of thicknesses of the layers of the separator layer.
  7. 7. A molded body comprising the sheet for electronic part packaging described in any one of claims 1 to 6.
  8. 8. The molded article according to claim 7, which is a container.
  9. 9. The molded article according to claim 7, which is a carrier tape.

Description

Sheet for packaging electronic parts Technical Field The present invention relates to a sheet for packaging electronic parts. Background As packaging containers for semiconductors, electronic components, particularly Integrated Circuits (ICs), electronic components provided with ICs, and the like, trays (injection trays, vacuum molding trays, and the like), magazines (magazine), carrier tapes (embossed carrier tapes), and the like are used. As thermoplastic resins constituting the packaging containers of these electronic parts, polystyrene-based resins, ABS-based resins, polyvinyl chloride-based resins, polypropylene-based resins, polyester-based resins, polyphenylene ether-based resins, polycarbonate-based resins, and the like are used. In addition, from the viewpoint of avoiding failure and destruction of ICs due to static electricity, for example, packaging containers and the like have been proposed in which a conductive layer containing a resin in which a conductive agent such as conductive carbon black is blended is provided on the surface of a base layer containing an ABS resin (patent documents 1 and 2 and the like). The tray and carrier tape are obtained by molding a sheet for packaging electronic parts by a known method, and may cause fuzzing and burrs during molding, particularly when cutting an original sheet, punching sprocket holes, and the like. Such burrs and fuzzes may cause defects in the electronic component when they come off from the storage portion (pocket) and adhere to the electronic component. In recent years, along with miniaturization of electronic parts, there is a strong demand for reduction of defects caused by adhesion of burrs and fuzzing. To solve this problem, there has been proposed a sheet in which a base layer and a conductive layer are blended with a polyolefin, a styrene-butadiene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer, or the like to reduce burrs and fuzzing (for example, patent documents 3 and 4). However, the conventional method is insufficient in suppression of burrs and fuzzing. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 9-174769 Patent document 2 Japanese patent laid-open No. 2002-292805 Patent document 3 International publication No. 2006/030871 Patent document 4 Japanese patent laid-open publication No. 2003-170547 Disclosure of Invention Problems to be solved by the invention Accordingly, an object of the present invention is to provide a sheet for packaging electronic parts, which can effectively suppress the generation of fuzzing and burrs, and a molded body comprising the sheet. Solution for solving the problem The present inventors have studied the above problems and as a result, have found that the above problems can be solved if a sheet for packaging electronic parts is provided with a base sheet having at least one base layer comprising a thermoplastic resin (I) and a resin (II) comprising at least 1 copolymer selected from the group consisting of a high molecular weight (meth) acrylate copolymer and a styrene-acrylonitrile copolymer, and completed the present application. Namely, the present invention has the following configurations. [1] A sheet for packaging electronic parts, comprising a base sheet having at least one base layer, wherein the base layer comprises a thermoplastic resin (I) and a resin (II) comprising at least 1 copolymer selected from the group consisting of an alkyl (meth) acrylate copolymer (A) and a styrene-acrylonitrile copolymer (B) having a weight average molecular weight of 700000 to 4300000. [2] The sheet for packaging electronic parts according to [1], wherein the base sheet has at least one base layer comprising 70 to 99 mass% of the thermoplastic resin (I) and 1 to 30 mass% of the resin (II). [3] The sheet for packaging electronic parts according to [1] or [2], wherein the alkyl (meth) acrylate copolymer (A) comprises an alkyl acrylate monomer unit (a 1) having an alkyl group having 4 to 8 carbon atoms. [4] The sheet for electronic part packaging of any one of [1] to [3], wherein the thermoplastic resin (I) comprises at least 1 thermoplastic resin selected from the group consisting of an ABS-based resin and a PC-based resin. [5] The sheet for packaging electronic parts according to any one of [1] to [4], wherein the thermoplastic resin (I) contains 70 to 100 mass% of an ABS-based resin with respect to the total mass of the thermoplastic resin (I). [6] The sheet for electronic part packaging of any one of [1] to [5], wherein the base sheet has at least one partition layer that partitions the base layer. [7] The sheet for packaging electronic parts according to [6], wherein an average value of thicknesses of the layers of the base material layer is equal to or more than an average value of thicknesses of the layers of the separator layer. [8] A molded body comprising the sheet for packaging electronic parts of any one of [1] to [7 ]. [9] The mold