CN-116690703-B - Processing waste chip cleaning method, system, intelligent terminal and storage medium

CN116690703BCN 116690703 BCN116690703 BCN 116690703BCN-116690703-B

Abstract

The application relates to a processing scrap cleaning method, a system, an intelligent terminal and a storage medium, and relates to the field of metal cutting processing, which comprises the steps of acquiring the processing procedure of a current processing workpiece and the processing position of the workpiece on a workbench; the method comprises the steps of determining a cleaning area based on a corresponding relation between a machining procedure and a machining position, indicating a preset material sucking device to suck waste scraps based on the cleaning area and obtain a cleaning image, determining a reference waste scraps amount according to comparison analysis of the cleaning image and preset waste scraps characteristics, determining an invalid cleaning position based on comparison analysis of the reference waste scraps amount and preset valid cleaning characteristics and obtaining a current position of the material sucking device, determining an air blowing moving path based on analysis of the current position of the material sucking device and the invalid cleaning position, and indicating the preset air blowing device to move to the invalid cleaning position along the air blowing moving path to perform air blowing cleaning. The application has the effect of improving the cleaning timeliness of the scraps so as to reduce the probability of workpiece deflection caused by subsequent workpiece installation.

Inventors

CHEN JIA
LI XIAOQUAN
LI YAFEI
LI ZHENGQIANG

Assignees

宁波润轴科技有限公司

Dates

Publication Date: 20260512
Application Date: 20230526

Claims (10)

1. A method of cleaning processing swarf, comprising: acquiring the current machining procedure of a workpiece to be machined and the machining position of the workpiece on a workbench; Determining a cleaning area based on the corresponding relation between the processing procedure and the processing position; a material sucking device preset based on the cleaning area indication sucks the scraps through air suction and acquires a cleaning image; analyzing according to the comparison of the cleaning image and the preset scrap characteristics to determine a reference scrap amount; the method comprises the steps of establishing an effective cleaning characteristic database, acquiring a current cleaning image in a cleaning area through a camera arranged in a machining center, carrying out matching analysis on the current cleaning image and the effective cleaning characteristic database, judging whether an ineffective cleaning position exists or not, continuously acquiring the cleaning image if the ineffective cleaning position does not exist, and acquiring coordinates of the ineffective cleaning position and the current position of a suction position if the ineffective cleaning position exists; Determining an air blowing moving path based on the analysis of the current position of the material sucking device and the invalid cleaning position, wherein the air blowing moving path comprises the steps of determining the moving direction of the air blowing device and the shortest moving path by connecting a coordinate point of the invalid cleaning position with the current position coordinate of the material sucking device, and defining the shortest moving path as the air blowing moving path; and indicating the preset blowing device to move to an ineffective cleaning position along the blowing moving path to perform blowing cleaning.
2. The method of cleaning process swarf according to claim 1, wherein the method of cleaning swarf from the suction device comprises: Before processing a workpiece, analyzing the processing procedure and the processing position of the workpiece to determine a moving area of a preset processing mechanism; Analyzing the cleaning area and the moving area to determine a covering area and splicing parameters corresponding to the covering area; indicating a preset shielding plate combination to form a shielding cover based on the splicing parameters, and indicating the shielding cover to cover the covering area with a preset covering distance; before processing the workpiece, determining the processing end time of the current workpiece based on the processing procedure; When a workpiece is processed, the material sucking device is instructed to suck scraps in the covering area, and the preset scrap collecting groove position and the current blowing position of the material blowing device are obtained; determining a blowing moving path based on the scrap collecting tank position and the current blowing position analysis of the blowing device; And indicating the blowing device to move along the blowing moving path at the processing ending time, and blowing and cleaning the invalid cleaning position.
3. The method of cleaning process sweeps according to claim 2 wherein the method of combining the splice parameters to form the shroud comprises: determining a splice location based on the movement zone analysis of the processing mechanism; analyzing the splicing position and the corresponding processing procedure to determine the splicing shape of the shielding cover; analyzing the splicing shape and the splicing position of the shielding cover to determine the splicing moving path of the shielding plate; the indication shielding plate moves along the splicing moving path and is spliced to form a shielding cover; After the shielding plates are spliced to form a shielding cover, obtaining the ejection distance of the scraps between the shielding cover and the processing position; comparing and analyzing based on the ejection distance of the scraps and a preset reference distance to determine an adjustment parameter; the shroud distance is modified based on the adjustment parameter.
4. A method of cleaning processing scraps as claimed in claim 3, wherein the method of cleaning scraps after the shielding cover shields the shielding area comprises: acquiring a workpiece material of a currently processed workpiece; determining a scrap size based on the cleaning image analysis; Analyzing to determine a cleaning type based on the size of the scraps and a preset suction condition; starting a suction device or an electromagnetic adsorption device based on the cleaning type analysis; when the electromagnetic adsorption device is started, analyzing based on the preset magnetic field intensity and the size of the scraps to determine magnetic field intensity adjusting parameters; and the electromagnetic adsorption device is instructed to adjust the magnetic strength based on the magnetic field strength adjusting parameter, and the electromagnetic adsorption device is instructed to adsorb the scraps.
5. The method for cleaning processing scraps as recited in claim 4, wherein the control method of the electromagnetic adsorption device comprises: acquiring a current adsorption image of the electromagnetic adsorption device; based on the comparison and analysis of the current adsorption image and preset adsorption uniformity characteristics, the adsorption condition of the adsorption surface is determined; Analyzing based on the adsorption condition of the adsorption surface and the preset magnetic field distribution condition to determine the adsorption surface deviation adjusting parameter of the electromagnetic adsorption device; When the electromagnetic adsorption device adsorbs scraps, the electromagnetic adsorption device is instructed to carry out offset adjustment based on the offset adjustment parameters.
6. The process debris cleaning method of claim 5, wherein the method of controlling the electromagnetic adsorption device to adsorb debris further comprises: determining the residual quantity of the adsorption surface and the current position of the adsorption surface based on the adsorption image and the overload adsorption characteristic analysis; determining a suction steering parameter based on the remaining amount of the suction surface and the current suction surface position comparison analysis; indicating the electromagnetic adsorption device to turn based on the turning parameter, and updating the current adsorption surface; After the current adsorption surface is updated, counting the residual quantity of the adsorption surface; determining a discharge adsorption surface based on the remaining amount count analysis; determining unloading time based on the unloading adsorption surface and the preset material sucking characteristic analysis; and (5) indicating the electromagnetic adsorption device to move into the scrap collecting tank for unloading at the unloading time.
7. The method for cleaning processing scraps as recited in claim 6, wherein the control method of the electromagnetic adsorption device before unloading the electromagnetic adsorption device further comprises: determining a stay position and an air suction position according to the processing procedure and the processing position when the discharging time is determined; The material sucking device is instructed to move according to the stay position, and a first trigger instruction is acquired; based on the first trigger instruction and a preset first trigger condition analysis, determining a replacement condition; indicating the electromagnetic adsorption device to move from the covering area to a preset blanking area based on the replacement condition; The material sucking device is instructed to move from the stay position to the air sucking position based on the replacement condition, waste scraps are sucked, and a second trigger instruction is obtained; Based on the second trigger characteristics and a preset second trigger condition analysis, determining a regression condition; Indicating the electromagnetic adsorption device to move to the covering area based on the regression condition; and indicating the suction device to move from the suction position to the stay position based on the regression condition and re-triggering the first trigger instruction.
8. A process scrap cleaning system, comprising: the acquisition module is used for acquiring the current processing procedure of the processed workpiece and the processing position of the workpiece on the workbench; The judging module is used for determining a cleaning area based on the corresponding relation between the processing procedure and the processing position; The processing module is connected with the acquisition module and the judging module, and is used for indicating a preset absorbing device based on the cleaning area to absorb the scraps through air suction and acquire a cleaning image; The processing module is used for comparing and analyzing the cleaning image with preset scrap characteristics so as to determine a reference scrap amount; The processing module is used for comparing and analyzing the reference scrap amount with a preset effective cleaning characteristic to determine an ineffective cleaning position and acquiring the current position of the suction device, and comprises the steps of establishing an effective cleaning characteristic database, acquiring a current cleaning image in a cleaning area through a camera arranged in a machining center, carrying out matching analysis on the current cleaning image and the effective cleaning characteristic database, judging whether the ineffective cleaning position exists or not, continuously acquiring the cleaning image if the ineffective cleaning position does not exist, and acquiring coordinates of the ineffective cleaning position and acquiring the current position of the suction position if the ineffective cleaning position exists; the processing module is used for determining a blowing moving path based on the analysis of the current position and the invalid cleaning position of the material sucking device, and comprises the steps of determining the moving direction and the shortest moving path of the blowing device by connecting a coordinate point of the invalid cleaning position with the current position coordinate of the material sucking device, and defining the shortest moving path as the blowing moving path; And the processing module is used for indicating the preset blowing device to move to an invalid cleaning position along the blowing moving path to perform blowing cleaning.
9. An intelligent terminal comprising a memory and a processor, the memory having stored thereon a computer program capable of being loaded by the processor and performing the method according to any of claims 1 to 7.
10. A computer readable storage medium, characterized in that a computer program is stored which can be loaded by a processor and which performs the method according to any one of claims 1to 7.

Description

Processing waste chip cleaning method, system, intelligent terminal and storage medium Technical Field The application relates to the technical field of metal cutting processing, in particular to a processing scrap cleaning method, a processing scrap cleaning system, an intelligent terminal and a storage medium. Background When the metal workpiece is processed by the numerical control machining center, certain scraps can be generated under the cutting action of the cutter, and the metal workpiece needs to be cleaned in time after the processing is finished, so that the scraps are not easy to cause blockage to the normal use of the numerical control machining center. In the related art, a processing chamber is formed in a numerical control machining center, a clamp is arranged in the processing chamber to clamp and fix a workpiece, when a cutting mechanism finishes cutting the workpiece, scraps are scattered on a workbench near the clamp, a high-pressure air gun is arranged on the outer side wall of the numerical control machining center, and a worker blows after aligning the high-pressure air gun with the scraps so as to blow the scraps off the numerical control machining center and intensively clean the scraps. In view of the above-mentioned related art, the inventors consider that the amounts of the scraps produced when different workpieces are processed are inconsistent, and the scattering areas of the scraps in the processing processes of different steps are also inconsistent, so that the process of cleaning the scraps is complicated, if the scraps are not cleaned timely, the scraps are accumulated on the mounting positions of the workpieces, and the abutting pad is raised when the workpieces are mounted, so that the processing positions of the workpieces are offset, the processing quality is affected, and there is room for improvement. Disclosure of Invention The application provides a processing scrap cleaning method, a processing scrap cleaning system, an intelligent terminal and a storage medium, which are used for improving the cleaning timeliness of scraps so as to reduce the probability of workpiece deflection caused by subsequent workpiece installation. In a first aspect, the application provides a method for cleaning processing scraps, which adopts the following technical scheme: a process waste cleaning method comprising: acquiring the current machining procedure of a workpiece to be machined and the machining position of the workpiece on a workbench; Determining a cleaning area based on the corresponding relation between the processing procedure and the processing position; a material sucking device preset based on the cleaning area indication sucks the scraps through air suction and acquires a cleaning image; analyzing according to the comparison of the cleaning image and the preset scrap characteristics to determine a reference scrap amount; comparing and analyzing the reference scrap amount with a preset effective cleaning characteristic to determine an ineffective cleaning position and obtain the current position of the suction device; based on the analysis of the current position and the invalid cleaning position of the suction device, determining a blowing moving path; and indicating the preset blowing device to move to an ineffective cleaning position along the blowing moving path to perform blowing cleaning. Through adopting above-mentioned technical scheme, carry out the analysis to the different processes on the processing position to divide according to the sweeps sputtering zone that forms in the corresponding process course of working, make the suction device can accurately absorb the clearance to the sweeps, after processing, to some sweeps that fail to clear up through inhaling, carry out same clearance through the mode that adopts blowing, make the sweeps be difficult for piling up on the processing position, when reducing follow-up work piece and installing on the processing position, the work piece is because of the sweeps is filled up or fill up the inclined to one side and cause the probability of gesture skew, help improving the accuracy when the work piece carries out processing. Optionally, the method for cleaning the scraps of the material sucking device comprises the following steps: Before processing a workpiece, analyzing the processing procedure and the processing position of the workpiece to determine a moving area of a preset processing mechanism; Analyzing the cleaning area and the moving area to determine a covering area and splicing parameters corresponding to the covering area; indicating a preset shielding plate combination to form a shielding cover based on the splicing parameters, and indicating the shielding cover to cover the covering area with a preset covering distance; before processing the workpiece, determining the processing end time of the current workpiece based on the processing procedure; When a workpiece is processed, the material sucking devi