CN-116770246-B - Method for enhancing adhesion of composite copper foil and composite copper foil

Abstract

The invention relates to the technical field of metal films, in particular to a method for enhancing adhesion of a composite copper foil and the composite copper foil. The method for enhancing the adhesion of the composite copper foil comprises the following steps of plating a partial oxidation metal film layer on at least one surface of a base material by adopting magnetron sputtering, and plating a copper film layer on the partial oxidation metal film layer by adopting magnetron sputtering or water electrolysis plating to prepare the composite copper foil. The method can effectively improve the adhesive force between the film layer and the substrate, improve the film coating efficiency, finish the preparation of the composite copper foil with the thickness of 1-2 mu m of the single-sided film at one time, and realize the large-scale mass production by enabling the adhesive force between the film layer and the substrate to reach 5B.

Inventors

• ZHANG XUN
• YI WEIHUA
• LI JINGYAN
• YANG WEI
• PENG SHUNMING

Assignees

• 江西沃格光电股份有限公司

Dates

Publication Date

20260508

Application Date

20230614

Claims (9)

1. 1. A method for enhancing adhesion of a composite copper foil comprising the steps of: plating a partial oxidation metal film layer on at least one surface of a base material by adopting magnetron sputtering, wherein the partial oxidation metal film layer comprises a metal simple substance and a metal oxide compound, and the content of the metal oxide is 40% -60% in terms of mole percent; and plating a copper film layer on the partial oxidized metal film layer by adopting magnetron sputtering or water electrolytic plating to prepare the composite copper foil.
2. 2. The method of enhancing adhesion of a composite copper foil of claim 1, wherein the partially oxidized metal film is plated with a metal target comprising one or more of titanium, niobium, nickel, molybdenum, chromium, zirconium, aluminum, and silver.
3. 3. The method for enhancing adhesion of a composite copper foil according to claim 2, wherein oxygen of 5sccm to 10sccm is introduced at the position of the metal target in the process of plating the partially oxidized metal film layer.
4. 4. The method for enhancing adhesion of a composite copper foil according to claim 1, wherein the total thickness of the partially oxidized metal film layer and the copper film layer is 1 μm to 2 μm.
5. 5. The method for enhancing adhesion of a composite copper foil according to claim 1, wherein the thickness of the partially oxidized metal film layer is 10nm to 20nm.
6. 6. The method for enhancing adhesion of a composite copper foil according to claim 1, wherein the partially oxidized metal film layer is plated by an intermediate frequency power supply, wherein the power of the intermediate frequency power supply is 10kw to 20kw, and the voltage is 500v to 550v.
7. 7. The method for enhancing adhesion of a composite copper foil according to claim 1, wherein the magnetron sputtering power used for plating the copper film layer is 150 kw-200 kw and the voltage is 400 v-550 v.
8. 8. A composite copper foil characterized by being obtained by the method for enhancing adhesion of a composite copper foil according to any one of claims 1 to 7.
9. 9. Use of the composite copper foil of claim 8 in the manufacture of lithium batteries.

Description

Method for enhancing adhesion of composite copper foil and composite copper foil Technical Field The invention relates to the technical field of metal films, in particular to a method for enhancing adhesion of a composite copper foil and the composite copper foil. Background The composite copper foil is not only a carrier of a negative electrode active substance in a lithium battery, but also a collector and a conductor of negative electrode electrons, and is a key base material of a negative electrode of the lithium battery. With the wide application of lithium batteries, the market demand of composite copper foil is growing, and the production equipment and process are also changed and upgraded. The preparation process of the composite copper foil comprises chemical electrolytic deposition, evaporation coating, magnetron sputtering coating and the like, wherein the magnetron sputtering coating can achieve the balance of benefits of environmental protection and production efficiency and is widely applied. The traditional film plating equipment has limited film plating thickness, when the thickness of a single film exceeds 1 mu m, the one-time film plating production is difficult to realize, the film thickening process and the surface oxidation prevention treatment process are required to be repeated for a plurality of times, the process is complex and complicated, the film adhesion is lower, the production efficiency and the equipment utilization rate are low, the product yield is not easy to control, and the large-scale production of the composite copper foil is not facilitated. Disclosure of Invention Based on this, it is necessary to provide a method for enhancing the adhesion of a composite copper foil, by which the film adhesion of the composite copper foil obtained is high. In one aspect of the present application, there is provided a method for enhancing adhesion of a composite copper foil, comprising the steps of: plating a part of oxidized metal film layer on at least one surface of the base material by adopting magnetron sputtering; and plating a copper film layer on the partial oxidized metal film layer by adopting magnetron sputtering or water electrolytic plating to prepare the composite copper foil. In one embodiment, the component of the partially oxidized metal film layer is a composite of a metal simple substance and a metal oxide, and the content of the metal oxide is 40% -60% in terms of mole percent. In one embodiment, the partially oxidized metal film is plated with a metal target comprising one or more of titanium, niobium, nickel, molybdenum, chromium, zirconium, aluminum, and silver. In one embodiment, in the process of plating the partially oxidized metal film layer, 5 sccm-10 sccm of oxygen is introduced into the position of the metal target. In one embodiment, the total thickness of the partially oxidized metal film layer and the copper film layer is 1 μm to 2 μm. In one embodiment, the thickness of the partially oxidized metal film layer is 10 nm-20 nm. In one embodiment, the partial oxidation metal film layer is plated by adopting an intermediate frequency power supply, wherein the power of the intermediate frequency power supply is 10 kW-20 kW, and the voltage is 500V-550V. In one embodiment, the magnetron sputtering power used for plating the copper film layer is 150 kW-200 kW, and the voltage is 400V-550V. In yet another aspect of the present application, there is provided a composite copper foil obtained by the method of enhancing adhesion of a composite copper foil. In still another aspect of the present application, there is provided an application of the composite copper foil in the preparation of lithium batteries. The method for enhancing the adhesion of the composite copper foil provided by the application is characterized in that a part of oxide metal film layer is plated on at least one surface of a base material by adopting magnetron sputtering, and the copper film layer is plated on the part of oxide metal film layer by adopting magnetron sputtering or water electrolysis plating, so that the composite copper foil is prepared. The method can effectively improve the adhesive force between the film layer and the substrate, improve the coating efficiency, finish the preparation of the composite copper foil with the thickness of 1-2 mu m or thicker of the single-sided film at one time, and realize the large-scale mass production, wherein the adhesive force between the film layer and the substrate reaches 5B. Drawings FIG. 1 is a schematic diagram of a composite copper foil according to an embodiment. Reference numerals: 100 parts of base material, 110 parts of partial oxidation metal film layer and 120 parts of copper film layer. Detailed Description In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the embodiments that are illustrated below. This invention may, however, be embodied in m