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CN-116774537-B - Substrate processing apparatus

CN116774537BCN 116774537 BCN116774537 BCN 116774537BCN-116774537-B

Abstract

The present invention relates to a substrate processing apparatus. The developing device includes a housing, an airflow forming portion, and a substrate holding device. The airflow forming part forms a clean downdraft in the inner space of the housing. The developing device further includes a plurality of nozzles and a dividing mechanism. The plurality of nozzles supply the processing liquid to the substrate held by the substrate holding device. The dividing mechanism divides the internal space of the housing into a processing space and a non-processing space in a state where the substrate is held by the substrate holding device. The processing space is a space containing a substrate held by the substrate holding device. The dividing mechanism includes a cup for receiving the processing liquid scattered from the substrate, a dividing plate having a nozzle opening and a plurality of through holes and provided above the cup, and a cover member for covering the nozzle opening.

Inventors

  • Jia shengzhun

Assignees

  • 株式会社斯库林集团

Dates

Publication Date
20260508
Application Date
20230310
Priority Date
20220318

Claims (10)

  1. 1. A substrate processing apparatus includes: a chamber having an interior space; a gas flow forming unit configured to supply a gas into the chamber to form a downdraft; A substrate holding portion for holding a substrate in the chamber; a nozzle for supplying a processing liquid to the substrate from a processing position above the substrate held by the substrate holding portion, and A dividing mechanism for dividing an internal space of the chamber into a processing space including the substrate held by the substrate holding portion and a non-processing space surrounding at least a part of the processing space in a state where the substrate is held by the substrate holding portion, and The dividing mechanism includes: A processing cup which is provided so as to surround the substrate held by the substrate holding portion in a plan view and to overlap the substrate held by the substrate holding portion in a side view, and which forms the processing space; A dividing plate provided at a position above the processing cup and having a plurality of through holes for guiding a part of the descending air flow to the processing space and a nozzle opening formed so as to overlap the processing position in a plan view, and And a cover member configured to allow the nozzle to supply the processing liquid to the substrate and cover the nozzle opening in a state where the substrate is held by the substrate holding portion and the nozzle is positioned at the processing position.
  2. 2. The substrate processing apparatus according to claim 1, further comprising a nozzle driving unit that moves the nozzle between the processing position and a standby position laterally of the substrate held by the substrate holding unit.
  3. 3. The substrate processing apparatus according to claim 2, further comprising a support body that supports the nozzle and the cover member, and The nozzle driving unit moves the nozzle and the cover member by moving or rotating the support body.
  4. 4. A substrate processing apparatus according to any one of claims 1 to 3, further comprising an exhaust portion that exhausts an atmosphere of the processing space to an outside of the chamber.
  5. 5. The substrate processing apparatus according to any one of claims 1 to 4, wherein The partition plate has a1 st wall portion extending upward from the inner edge of the nozzle opening and The cover member has: a cap body portion larger than the nozzle opening in a plan view, and a2 nd wall portion extending downward from an outer edge of the cap body portion; When the nozzle opening is covered with the cover member, the 2 nd wall portion is held so as to surround at least a part of the 1 st wall portion in a plan view, and is overlapped with at least a part of the 1 st wall portion in a side view without being in contact with the partition plate.
  6. 6. The substrate processing apparatus according to any one of claims 1 to 5, wherein The dividing mechanism further includes a tube member formed so as to surround the dividing plate in a plan view, extend downward from an outer edge of the dividing plate, and surround an upper portion of the processing cup in a plan view, and The processing cup is configured to be capable of being lifted and lowered in the vertical direction so as to be shifted to a 1 st state in which the upper portion of the processing cup is separated from the tubular member in a side view and a2 nd state in which the upper portion of the processing cup is overlapped with the tubular member in a side view.
  7. 7. The substrate processing apparatus according to any one of claims 1 to 6, wherein The substrate holding unit is configured to rotate the held substrate in a horizontal posture when the processing liquid is supplied from the nozzle to the substrate; the dividing plate has a circular plate shape larger than the substrate held by the substrate holding portion, and When the dividing plate defines a central region having a circular shape with one radius including a center of the dividing plate in a plan view and an outer peripheral region having a circular shape with a width equal to the one radius in a radial direction of the dividing plate including an outer peripheral end of the dividing plate in a plan view, The plurality of through holes are formed in the dividing plate in a scattered manner; The number of through holes formed in the outer peripheral region of the dividing plate is greater than the number of through holes formed in the central region of the dividing plate.
  8. 8. The substrate processing apparatus according to any one of claims 1 to 6, wherein The substrate holding unit is configured to rotate the held substrate in a horizontal posture when the processing liquid is supplied from the nozzle to the substrate; The dividing plate has a circular plate shape larger than the substrate held by the substrate holding portion; The nozzle opening of the dividing plate is opposed to a central portion of the substrate held by the substrate holding portion, and In the case where the dividing plate defines an imaginary circle that surrounds the nozzle opening with reference to the center of the dividing plate in a plan view, The plurality of through holes are distributed and arranged in such a manner that a part of the through holes are spaced apart from the entire virtual circle at a fixed or substantially fixed interval.
  9. 9. The substrate processing apparatus according to any one of claims 1 to 8, wherein the nozzle comprises a two-fluid nozzle that ejects a mixed fluid comprising a gas and droplets of the processing liquid toward a substrate held by the substrate holding portion.
  10. 10. The substrate processing apparatus according to any one of claims 1 to 9, wherein a processing liquid supplied from the nozzle to the substrate contains an organic solvent.

Description

Substrate processing apparatus Technical Field The present invention relates to a substrate processing apparatus for processing a substrate using a processing liquid. Background Conventionally, a substrate processing apparatus has been used for performing a specific process using a processing liquid for various substrates such as a substrate for FPD (FLAT PANEL DISPLAY: flat panel display) used for a liquid crystal display device, an organic EL (Electro Luminescence: electroluminescence) display device, etc., a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, etc. As such a substrate processing apparatus, there is a developing apparatus that performs a developing process of a photosensitive film using a developer. In the case where the developer has a strong odor, when the atmosphere containing the developer leaks to the outside of the developing device, the comfort of the working environment around the developing device is lowered. In order to suppress the decrease in comfort of the working environment, a structure for suppressing the leakage of the atmosphere containing the developer is proposed (for example, refer to japanese patent application laid-open No. 2021-86994). The developing device described in japanese patent application laid-open No. 2021-86994 has a structure in which a substrate holding portion, a nozzle cover, a container, and a cup are accommodated in a casing. The substrate holding section is configured to hold the substrate in a horizontal posture. The nozzle is provided at a position above the substrate holding portion, and is configured to be capable of supplying a developer to the substrate held by the substrate holding portion. The nozzle cover has a cylindrical shape, and is provided so as to surround the nozzle in a plan view and overlap at least a part of the nozzle in a side view. The container is provided so as to be separated from the nozzle cover at a position below the nozzle cover, and accommodates a lower portion of the substrate holding portion. The container further includes an exhaust unit for exhausting the atmosphere in the case to the outside of the case. The cup has a cylindrical shape surrounding the substrate holding portion in a plan view and is provided so as to be movable up and down. In the developing process of the substrate, the cup is held so as to overlap the lower end of the nozzle cover and the upper end of the container in a side view. Thus, a processing space surrounded by the nozzle cover, the cup and the container is formed in the housing, and a non-processing space is formed so as to surround the processing space. In this state, a downdraft is formed within the housing. Disclosure of Invention [ Problem to be solved by the invention ] In the developing device of japanese patent application laid-open No. 2021-86994 having the above-described configuration, the pressure in the processing space is made lower than the pressure in the non-processing space inside the casing, so that leakage of the atmosphere containing the developer to the outside of the casing through the non-processing space can be suppressed. However, in the developing device described in japanese patent application laid-open No. 2021-86994, it is actually difficult to make the pressure in the process space lower than the pressure in the non-process space to such an extent that the atmosphere in the process space does not leak out to the non-process space. The invention aims to provide a substrate processing device capable of inhibiting the comfort of the working environment around the substrate processing device from being reduced. [ Means of solving the problems ] (1) A substrate processing apparatus according to one aspect of the present invention includes a chamber having an internal space, a gas flow forming portion configured to supply a gas into the chamber to form a downflow, a substrate holding portion configured to hold a substrate in the chamber, a nozzle configured to supply a processing liquid to the substrate from a processing position above the substrate held by the substrate holding portion, a dividing mechanism configured to divide the internal space of the chamber into a processing space including the substrate held by the substrate holding portion and a non-processing space surrounding at least a part of the processing space in a state where the substrate is held by the substrate holding portion, and the dividing mechanism includes a processing cup configured to surround the substrate held by the substrate holding portion in a plan view and to be disposed so as to overlap the substrate held by the substrate holding portion in a side view to form a processing space, a dividing plate configured to be disposed at a position above the processing cup and having a nozzle opening configured to guide a part of the