CN-116782530-B - Circuit board connection structure with high-length copper column and manufacturing method thereof

CN116782530BCN 116782530 BCN116782530 BCN 116782530BCN-116782530-B

Abstract

The application provides a manufacturing method of a circuit board connection structure with high-length copper columns, which is characterized in that the first copper column, the second copper column and the third copper column are manufactured respectively, and the high-length copper columns are manufactured in a splicing mode of the first copper column, the second copper column and the third copper column, so that the problem that empty bags or gaps are formed in the manufacturing process of the high-length copper columns is solved, the uniformity of the high-length copper columns is improved, and the stability of signal transmission between a to-be-connected piece and a first conductive circuit layer is improved. The application also provides a circuit board connecting structure with the high-length copper column manufactured by the method.

Inventors

ZHU CHANGHE
LI BAOJUN
LIU LIKUN
LI YANLU

Assignees

宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司

Dates

Publication Date: 20260508
Application Date: 20220310

Claims (10)

1. The manufacturing method of the circuit board connecting structure with the high-length copper column is characterized by comprising the following steps of: Providing a first substrate, wherein the first substrate comprises a first dielectric layer and a first copper foil layer positioned on the surface of the first dielectric layer, and a through hole is formed in the first dielectric layer; Forming a first copper column on the first copper foil layer, forming a second copper column in the through hole, and enabling the first copper column to be opposite to the second copper column to obtain a second substrate; providing a circuit substrate, wherein the circuit substrate comprises a first conductive circuit layer, a second dielectric layer, a second copper foil layer and a first copper plating layer which are sequentially stacked, and a third copper column is arranged on the first conductive circuit layer; Laminating the second substrate and the circuit substrate, and making the second copper column and the third copper column opposite; Hot-pressing the second substrate and the circuit substrate to electrically connect the second copper pillar and the third copper pillar; Etching the first copper foil layer to form a conductive member, positioning the conductive member between the first copper pillar and the second copper pillar, and etching the first copper foil layer and the second copper foil layer to form a second conductive trace layer; forming a containing groove in the first dielectric layer, wherein part of the first conductive circuit layer is exposed in the containing groove to form a welding pad; Arranging components in the accommodating groove through a first conductive paste and electrically connecting the components with the welding pads, and And electrically connecting the to-be-connected piece with the first copper column through the second conductive paste so as to electrically connect the to-be-connected piece with the first conductive circuit layer, thereby obtaining the circuit board connecting structure.
2. The method of manufacturing a circuit board connection structure according to claim 1, wherein after forming the second conductive line layer, the method further comprises: And grooves are formed in the first dielectric layer and close to the peripheries of the second copper column and the third copper column.
3. The method for manufacturing a circuit board connection structure according to claim 2, wherein after the recess is opened, the method further comprises: Forming a first surface treatment layer on the end part of the first copper column far away from the second copper column, the side wall of the first copper column, the side wall of the second copper column and the side wall of the third copper column; the second conductive paste is electrically connected with the first copper column through the first surface treatment layer.
4. The method for manufacturing a circuit board connection structure according to claim 1, wherein the to-be-connected member is a motherboard or a circuit board.
5. The method of manufacturing a circuit board connection structure according to claim 1, wherein the total height of the first copper pillar, the second copper pillar, and the third copper pillar is greater than 50 μm.
6. The circuit board connecting structure with the high-length copper column is characterized by comprising a to-be-connected piece, a first dielectric layer, a first conductive circuit layer, a second dielectric layer and a second conductive circuit layer which are sequentially stacked; The circuit board connecting structure is internally provided with a first copper column, a conductive piece, a second copper column and a third copper column which are coaxially and sequentially connected, wherein the first copper column, the conductive piece, the second copper column and the third copper column are positioned between the to-be-connected piece and the first dielectric layer, and the to-be-connected piece is electrically connected with the first copper column through a second conductive paste so that the to-be-connected piece is electrically connected with the first conductive circuit layer; the circuit board connecting structure further comprises a component, a containing groove is formed in the first medium layer, a part of the first conductive circuit layer is exposed in the containing groove to form a welding pad, the component is arranged in the containing groove through first conductive paste, and the component is electrically connected with the welding pad.
7. The circuit board connection structure of claim 6, wherein the first dielectric layer is recessed adjacent to the periphery of the second and third copper pillars, the third copper pillar being further located in the recess.
8. The wiring board connection structure of claim 7, further comprising: A first surface treatment layer located on an end of the first copper pillar away from the second copper pillar, a sidewall of the first copper pillar, a sidewall of the second copper pillar, and a sidewall of the third copper pillar; the second conductive paste is electrically connected with the first copper column through the first surface treatment layer.
9. The circuit board connecting structure according to claim 6, wherein the to-be-connected member is a motherboard or a circuit board.
10. The wiring board connection structure of claim 6, wherein the total height of the first copper pillar, the second copper pillar, and the third copper pillar is greater than 50 μm.

Description

Circuit board connection structure with high-length copper column and manufacturing method thereof Technical Field The application relates to the field of circuit boards, in particular to a circuit board connection structure with high-length copper columns and a manufacturing method thereof. Background With the progress of technology, electronic products such as mobile phones and notebook computers are developing to high density and high integration. In the process of manufacturing electronic products, it is generally required to connect a circuit board with a to-be-connected member through a copper pillar with a high length. Currently copper pillars are generally produced by electroplating. Because the length of the copper column is longer, the problems of empty bags or gaps and the like easily appear in the copper column when the copper column is manufactured, and the homogeneity of the copper column is reduced, so that the signal transmission between the circuit board and the to-be-connected piece is influenced. Disclosure of Invention In view of the above, the present application provides a method for manufacturing a circuit board connection structure with high-length copper pillars having high uniformity. In addition, it is also necessary to provide a circuit board connection structure with high-length copper pillars manufactured by the method. An embodiment of the application provides a method for manufacturing a circuit board connection structure with a high-length copper column, which comprises the following steps: Providing a first substrate, wherein the first substrate comprises a first dielectric layer and a first copper foil layer positioned on the surface of the first dielectric layer, and a through hole is formed in the first dielectric layer; Forming a first copper column on the first copper foil layer, forming a second copper column in the through hole, and enabling the first copper column to be opposite to the second copper column to obtain a second substrate; providing a circuit substrate, wherein the circuit substrate comprises a first conductive circuit layer, a second dielectric layer, a second copper foil layer and a first copper plating layer which are sequentially stacked, and a third copper column is arranged on the first conductive circuit layer; Laminating the second substrate and the circuit substrate, and making the second copper column and the third copper column opposite; Hot-pressing the second substrate and the circuit substrate to electrically connect the second copper pillar and the third copper pillar; Etching the first copper foil layer to form a conductive member, positioning the conductive member between the first copper pillar and the second copper pillar, and etching the first copper foil layer and the second copper foil layer to form a second conductive trace layer; forming a containing groove in the first dielectric layer, wherein part of the first conductive circuit layer is exposed in the containing groove to form a welding pad; Arranging components in the accommodating groove through a first conductive paste and electrically connecting the components with the welding pads, and And electrically connecting the to-be-connected piece with the first copper column through the second conductive paste so as to electrically connect the to-be-connected piece with the first conductive circuit layer, thereby obtaining the circuit board connecting structure. The embodiment of the application also provides a circuit board connecting structure with a high-length copper column, which comprises a to-be-connected piece, a first dielectric layer, a first conductive circuit layer, a second dielectric layer and a second conductive circuit layer which are sequentially stacked; The circuit board connecting structure is internally provided with a first copper column, a conductive piece, a second copper column and a third copper column which are coaxially and sequentially connected, wherein the first copper column, the conductive piece, the second copper column and the third copper column are positioned between the to-be-connected piece and the first dielectric layer, and the to-be-connected piece is electrically connected with the first copper column through a second conductive paste so that the to-be-connected piece is electrically connected with the first conductive circuit layer; the circuit board connecting structure further comprises a component, a containing groove is formed in the first medium layer, a part of the first conductive circuit layer is exposed in the containing groove to form a welding pad, the component is arranged in the containing groove through first conductive paste, and the component is electrically connected with the welding pad. According to the application, the first copper column, the second copper column and the third copper column are manufactured respectively, and the high-length copper column is manufactured in a manner of splicing the first copper colu