CN-116786976-B - Repair device

CN116786976BCN 116786976 BCN116786976 BCN 116786976BCN-116786976-B

Abstract

The invention discloses repair equipment, which comprises a base, a first bearing device, a second bearing device and a laser repair device. The base comprises a first installation area, a second installation area, a first track, a second track and a third track. The second installation area extends upwards from the first installation area, and the first track and the second track are fixedly arranged in the first installation area. The third track is disposed in the second mounting region. The first bearing device is connected with the first track and is used for bearing a material tray. The tray includes a semiconductor device. The second bearing device is connected with the second track and is used for bearing a circuit substrate. The laser repairing device is connected with the third track and can move above the first bearing device and the second bearing device, and the laser repairing device is used for electrically connecting the semiconductor element to the circuit substrate.

Inventors

CHEN ZANREN
LI MENGLIN
LIN QITING
YANG SHENGMIN

Assignees

东捷科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20220318

Claims (4)

1. A repair device, comprising: The base comprises a first installation area, a second installation area, a first track, a second track and a third track, wherein the second installation area extends upwards from the first installation area, the first track and the second track are fixedly arranged in the first installation area, and the third track is fixedly arranged in the second installation area; A first carrying device connected with the first track and used for carrying a tray, wherein the tray comprises a semiconductor element; A second bearing device connected with the second track and capable of bearing a circuit substrate, and The laser repairing device is connected with the third track and can move above the first bearing device and the second bearing device, and the laser repairing device can electrically connect the semiconductor element to the circuit substrate; the laser repairing device comprises a mounting seat, a laser system and a material taking system, wherein the mounting seat is connected with the third track, the laser system is connected with the mounting seat and is used for projecting a laser beam, the material taking system is connected with the mounting seat and comprises an adhesive tape, a conveying module and a pushing module, the adhesive tape can be used for adhering the semiconductor element, the conveying module is connected with the adhesive tape and can be used for conveying the adhesive tape, the pushing module can be used for pushing the adhesive tape on the conveying module, and the laser beam passes through the pushing module and the adhesive tape so as to weld the semiconductor element on the circuit substrate; the pushing module comprises a lifting unit and a pressing piece, wherein the pressing piece is connected with the lifting unit and faces the leveling area, and can push the adhesive tape downwards; The pressing piece comprises a combining block and a contact block, wherein the combining block is connected with the lifting unit, the contact block is connected with the combining block and protrudes from the side edge of the combining block, the pressing piece comprises a head and a window, the head is formed at the protruding end of the contact block, and the window is formed at the head for the laser beam to pass through.
2. The prosthetic device of claim 1, wherein the head comprises a top bevel, a bottom surface, and at least one protrusion, the window extending through the top bevel and the bottom surface, the at least one protrusion protruding downward from the bottom surface.
3. The repair facility of claim 1, wherein the transport module comprises two positioning rollers, the leveling zone being located between the two positioning rollers.
4. The repair apparatus of claim 1, wherein the second carrier device is capable of testing the circuit substrate.

Description

Repair device Technical Field The present invention relates to a repair apparatus, and more particularly, to a repair apparatus for a semiconductor device. Background The panel formed by the photoelectric elements needs to use a large number of Light Emitting Diodes (LEDs) which are densely arranged in a matrix, so that the abnormal function of the LEDs and the positions thereof can be found after the function of the panel is tested, but the current electrical test and repair are performed by different devices, so that more moving process time is wasted in conveying, taking out and repairing. Further, since the leds are small in size and the leds are closely arranged, it is very difficult to maintain the leds. Disclosure of Invention In view of the foregoing, it is an object of the present invention to provide a repair apparatus in which a circuit board and a tray are placed on the same apparatus, and the movable laser repairing device moves on the circuit substrate and the material tray to repair the positions of the semiconductor elements with abnormal functions or missing on the circuit substrate. In order to achieve the above objective, the present invention provides a repairing apparatus, which includes a base, a first carrying device, a second carrying device, and a laser repairing device. The base comprises a first installation area, a second installation area, a first track, a second track and a third track. The second installation area extends upwards from the first installation area, and the first track and the second track are fixedly arranged in the first installation area. The third track is disposed in the second mounting region. The first bearing device is connected with the first track and is used for bearing a material tray. The tray includes a semiconductor device. The second bearing device is connected with the second track and is used for bearing a circuit substrate. The laser repairing device is connected with the third track and can move above the first bearing device and the second bearing device, and the laser repairing device is used for electrically connecting the semiconductor element to the circuit substrate. The laser repairing device comprises a mounting seat, a laser system and a material taking system, wherein the mounting seat is connected with the third track, the laser system is connected with the mounting seat and is used for projecting a laser beam, the material taking system is connected with the mounting seat and comprises an adhesive tape, a conveying module and a pushing module, the adhesive tape can be used for adhering the semiconductor element, the conveying module is connected with the adhesive tape and can be used for conveying the adhesive tape, the pushing module can be used for pushing the adhesive tape on the conveying module, and the laser beam passes through the pushing module and the adhesive tape so as to weld the semiconductor element on the circuit substrate. The pushing module comprises a lifting unit and a pressing piece, wherein the pressing piece is connected with the lifting unit, faces the leveling area and can push the adhesive tape downwards. The pressing piece comprises a combining block and a contact block, the combining block is connected with the lifting unit, the contact block is connected with the combining block and protrudes from the side edge of the combining block, the pressing piece comprises a head and a window, the head is formed at the protruding end of the contact block, and the window is formed at the head for the laser beam to pass through. The head comprises a top inclined plane, a bottom surface and at least one convex part, the window penetrates through the top inclined plane and the bottom surface, and the at least one convex part protrudes downwards from the bottom surface and is adjacent to the window. The conveying module comprises two positioning rollers, and the leveling area is positioned between the two positioning rollers. The second bearing device can test the circuit substrate. Therefore, the repairing device disclosed by the invention can be used for synchronously placing the material tray and the circuit substrate on the same device, so that the time consumed by movement is shortened, and the repairing efficiency is further improved. The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto. Drawings The detailed construction, features and methods of making the repair apparatus will be described in the following examples, however, it should be understood that the examples described below and the drawings are illustrative only and should not be construed as limiting the scope of the invention in any way, wherein: fig. 1 is a perspective view of a repair device of the present invention. Fig. 2 is an enlarged view of a laser repairing apparatus of the repairing apparatus of fig. 1. Fig. 3 is a perspective view of a