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CN-116790091-B - Temperature-control flexible piezoresistive sensing material, preparation method and application thereof

CN116790091BCN 116790091 BCN116790091 BCN 116790091BCN-116790091-B

Abstract

The invention belongs to the field of intelligent materials, and particularly discloses a temperature control flexible piezoresistive sensing material with piezoresistive performance adapted to temperature environment change. The temperature-control flexible piezoresistive sensing material comprises matrix resin and conductive foam filler, wherein the conductive foam filler accounts for 1-50% of the matrix resin in percentage by weight, and the T g of the matrix resin is at-30-35 ℃, preferably at 0-33 ℃, and more preferably at 15-30 ℃. The temperature-control flexible piezoresistive sensing material is based on a specific T g , realizes adjustable pressure detection range, can be stable in response to RCR with large pressure of 500 kPa-1500 kPa at an environmental temperature lower than T g , is stable in response to small pressure after the temperature is increased, and can accurately detect the pressure to 10kPa, and compared with the pressure detection range under the condition, the temperature is increased by 50 times. The invention also discloses a preparation method and application of the temperature-control flexible piezoresistive sensing material, and the temperature-control flexible piezoresistive sensing material can be used as a component comprising intelligent, wearable, life monitoring or movement monitoring equipment.

Inventors

  • HUANG PEI
  • LI ZHENGXIN
  • LI YUANQING
  • FU SHAOYUN

Assignees

  • 重庆大学

Dates

Publication Date
20260508
Application Date
20220314

Claims (11)

  1. 1. The temperature-control flexible piezoresistive sensing material is characterized by comprising matrix resin and conductive foam filler, wherein the conductive foam filler accounts for 1-50% of the matrix resin in weight percent, and the T g of the matrix resin is at a temperature of-30-35 ℃; The matrix resin is an epoxy glass body, and the epoxy glass body comprises a thermosetting resin prepared by reacting an epoxy component selected from glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, phenolic epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin or a combination thereof with a curing agent, wherein the curing agent is selected from one or more of adducts of alkane diacid, alkene nitrile compounds and amine compounds and polyamine compounds; The conductive foam filler is selected from carbonized plastic foam or sponge, and the plastic foam or sponge is selected from one or more of polyolefin foam, polyester foam, polyurethane foam, polyphenyl foam, polyether foam, starch plastic foam, phenolic foam, melamine sponge and rubber cotton.
  2. 2. The temperature-controlled flexible piezoresistive sensing material according to claim 1, wherein the matrix resin has a T g of 0-33 ℃.
  3. 3. The temperature-controlled flexible piezoresistive sensing material according to claim 2, wherein the matrix resin has a T g of 15-30 ℃.
  4. 4. A temperature-controlled flexible piezoresistive sensing material according to any of claims 1-3, wherein the epoxy component is selected from bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, cycloaliphatic glycidyl ester multifunctional epoxy resin.
  5. 5. The temperature-controlled flexible piezoresistive sensing material according to claim 4, wherein the epoxy component is selected from the group consisting of 4, 5-epoxyhexane-1, 2-dicarboxylic acid diglycidyl ester, 1, 4-cyclohexanedimethanol diglycidyl ether.
  6. 6. A temperature-controlled flexible piezoresistive sensing material according to any of claims 1-3, further comprising an elastomer layer between the interface of the matrix resin and the conductive foam filler.
  7. 7. The temperature-controlled flexible piezoresistive sensing material according to claim 6, wherein the elastomer is selected from one or more of silicone rubber, fluororubber, polyurethane, ethylene propylene rubber, nitrile rubber, neoprene, polyisobutylene, polysulfide rubber, natural rubber.
  8. 8. A method for preparing a temperature-controlled flexible piezoresistive sensing material according to any one of claims 1 to 7, wherein the temperature-controlled flexible piezoresistive sensing material is obtained by immersing the conductive foam filler in a precursor of the matrix resin, defoaming, and solidifying.
  9. 9. The method of claim 8, wherein the precursor of the matrix resin comprises monomers, oligomers, and solutions.
  10. 10. The method of preparing as claimed in claim 8, further comprising the step of applying an elastomer to the surface of the conductive foam by dip-drying.
  11. 11. Use of a temperature-controlled flexible piezoresistive sensing material according to any of the claims 1-7, as a component comprising an intelligent, wearable, life-monitoring or movement-monitoring device.

Description

Temperature-control flexible piezoresistive sensing material, preparation method and application thereof Technical Field The invention relates to a flexible piezoresistive sensing material, belongs to the field of intelligent materials, in particular to a material for a sensor with piezoresistive performance adapting to temperature environment change, and also relates to a preparation method and application of the flexible piezoresistive sensing material. Background The flexible piezoresistive sensing material is an intelligent material which deforms under the action of external force and then causes the resistance change. The sensor is a core sensing material of a stress strain sensor, and has wide application prospects in the fields of wearable electronic equipment, sports fitness tracking, robot sensing and the like. In order to prevent the sensor from being damaged due to the fact that the external pressure exceeds the application range of the sensor, the piezoresistive sensor is generally required to have the properties of high sensitivity and wide pressure detection range. At present, the piezoresistive sensing material is researched, the effect that the piezoresistive performance of the piezoresistive sensing material is adjustable according to the influence of application scenes is achieved, but influence factors of different application scenes are various. Obviously, the piezoresistive performance of the piezoresistive sensing material is controlled by the temperature environment change, so that the piezoresistive sensing material is wider in applicability and simpler to control, but no piezoresistive sensing material for controlling the piezoresistive performance by the temperature environment change exists at present. Disclosure of Invention In view of the above, a main object of the present invention is to provide a temperature-controlled flexible piezoresistive sensing material, and a preparation method and application thereof, so as to increase the diversity of the flexible piezoresistive sensing material in terms of regulatory factors. The invention provides a flexible piezoresistive sensing material based on glass transition performance, which is adjustable in pressure detection range based on the value of specific glass transition temperature (T g), stable in RCR response to large pressure (500 kPa-1500 kPa) at the environment temperature lower than T g, stable in response to small pressure after the temperature is increased, and capable of accurately detecting the pressure to 10kPa, and is improved by 50 times compared with the condition. In order to achieve the aim of the invention, the invention adopts the following technical scheme: As one scheme of the invention, the temperature-control flexible piezoresistive sensing material comprises matrix resin and conductive foam filler, wherein the conductive foam filler accounts for 1-50% of the matrix resin in percentage by weight, and the T g of the matrix resin is-30-35 ℃, preferably 0-33 ℃, and more preferably 15-30 ℃. Further, the matrix resin is selected from the group consisting of cured epoxy, phenolic, urea-formaldehyde, alkyd, urethane, furan, allyl resins, or combinations thereof. Still further, the matrix resin is preferably an epoxy-based glass body including a thermosetting resin prepared by reacting an epoxy component selected from the group consisting of a glycidyl ether-based epoxy resin, a glycidyl ester-based epoxy resin, a glycidyl amine-based epoxy resin, a linear aliphatic-based epoxy resin, an alicyclic-based epoxy resin, a phenolic epoxy resin, a biphenyl-based epoxy resin, a naphthalene-based epoxy resin, or a combination thereof with a curing agent. Further, the epoxy component is selected from the group consisting of flat bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic glycidyl ester multifunctional epoxy resin, preferably from the group consisting of diglycidyl 4, 5-epoxyhexane-1, 2-dicarboxylate (TDE-85), 1, 4-cyclohexanedimethanol diglycidyl ether. Further, the curing agent is selected from one or more of alkane diacid, adducts of alkene nitrile compounds and amine compounds, polyamine compounds. Wherein the acrylonitrile compound can be one or more of acrylonitrile, 3-butenenitrile, 2-pentenenitrile, 3-pentenenitrile and 4-pentenenitrile, and is preferably acrylonitrile, and the amine compound can be one or more of diethylenetriamine, triethylenetetramine, polyetheramine, 1, 3-cyclohexyldimethylamine, isofriedel-crafts diamine, 4' -diamino dicyclohexylmethane, diaminomethylcyclohexyl methane and diphenylmethane diamine, and is preferably isofriedel-crafts diamine. Further, the conductive foam filler is carbonized plastic foam or sponge, preferably one or more of polyolefin foam, polyester foam, polyurethane foam, polyphenyl foam, polyether foam, starch plastic, phenolic foam, melamine sponge and rubber foam. Further, an elastomer layer is also included between th