Search

CN-116791046-B - Composite copper foil and preparation method thereof, current collector, electrode plate, secondary battery and power utilization device

CN116791046BCN 116791046 BCN116791046 BCN 116791046BCN-116791046-B

Abstract

The application relates to a composite copper foil and a preparation method thereof, a current collector, an electrode plate, a secondary battery and an electric device. The preparation method comprises the steps of preparing a copper alloy coating by sputtering on a surface of a base material through a pulse direct current power supply, preparing a pure copper coating by sputtering on the surface of the copper alloy coating through a direct current power supply, wherein the total current of the direct current power supply is 300A-400A, the voltage is 400V-550V, the thickness of the pure copper coating is 950 nm-1000 nm, and preparing a copper nickel coating by sputtering on the surface of the pure copper coating through the direct current power supply. The preparation method of the composite copper foil is prepared by a sputtering coating method in one step, so that the hydropower plating process of the traditional preparation method is avoided, and the preparation process is simple and environment-friendly. The composite copper foil prepared by the preparation method has good surface adhesion, oxidation resistance and low sheet resistance, and is particularly suitable for preparing battery current collectors.

Inventors

  • YI WEIHUA
  • ZHANG XUN
  • LI JINGYAN
  • YANG WEI
  • PENG SHUNMING

Assignees

  • 江西沃格光电股份有限公司

Dates

Publication Date
20260508
Application Date
20230609

Claims (12)

  1. 1. The preparation method of the composite copper foil is characterized by comprising the following steps of: Sputtering a copper alloy target by adopting a pulse direct current power supply, and depositing a copper alloy coating on the surface of a substrate, wherein the current of the pulse direct current power supply is 10A-15A, the voltage is 350V-450V, the duty ratio is 40% -70%, and the thickness of the copper alloy coating is 10 nm-15 nm; Sputtering a pure copper target by using a first direct current power supply, and depositing a pure copper coating on the surface of the copper alloy coating, wherein the total current of the first direct current power supply is 300-400A, the voltage is 400-550V, and the thickness of the pure copper coating is 950-1000 nm; Sputtering a copper-nickel alloy target by adopting a second direct current power supply, and depositing a copper-nickel coating on the surface of the pure copper coating, wherein the thickness of the copper-nickel coating is 15 nm-20 nm; fang Zu 25 of the composite copper foil is m omega.
  2. 2. The method for producing a composite copper foil according to claim 1, wherein the cooling temperature is 10 ℃ to 20 ℃.
  3. 3. The method for manufacturing a composite copper foil according to claim 1, wherein the second direct current power supply has a current of 5A to 15A and a voltage of 360V to 430V.
  4. 4. The method for preparing a composite copper foil according to claim 1, wherein the copper alloy target comprises one of copper-nickel alloy, copper-zinc alloy and copper-silver alloy.
  5. 5. The method for preparing the composite copper foil according to claim 1, wherein the copper alloy target is copper-nickel alloy, and the mass content of nickel element in the copper-nickel alloy is 5% -15%.
  6. 6. The method for preparing a composite copper foil according to claim 1, wherein the mass content of nickel element in the copper-nickel plating layer is 5% -15%.
  7. 7. The method for producing a composite copper foil according to any one of claims 1 to 6, wherein the base material satisfies at least one of the conditions (1) to (2): (1) The thickness of the base material is 3-6 mu m; (2) The material of the base material comprises at least one of polypropylene, polyethylene terephthalate, polybutylene terephthalate, polystyrene and polyethylene.
  8. 8. A composite copper foil characterized by being produced by the method for producing a composite copper foil according to any one of claims 1 to 7.
  9. 9. A current collector comprising the composite copper foil of claim 8.
  10. 10. An electrode sheet comprising the current collector of claim 9.
  11. 11. A secondary battery comprising the electrode sheet according to claim 10.
  12. 12. An electric device comprising the secondary battery according to claim 11.

Description

Composite copper foil and preparation method thereof, current collector, electrode plate, secondary battery and power utilization device Technical Field The application relates to the technical field of new material preparation, in particular to a composite copper foil and a preparation method thereof, a current collector, an electrode slice, a secondary battery and an electric device. Background The composite copper foil is a material having a sandwich structure of copper-polymer material-copper, and can be used as a current collector of a secondary battery. Specifically, the composite copper foil takes materials such as polymer insulating resin and the like as a sandwich layer, and metal copper is deposited on the surface of the composite copper foil, so that compared with the traditional copper foil, the composite copper foil can improve the energy density of the secondary battery and reduce the cost. However, the conventional composite copper foil is generally prepared by a two-step method, wherein an ultrathin copper film is prepared on the surface of a substrate by vacuum coating, then a copper layer is thickened by adopting a water electroplating mode, the process is complex, and the pollution of a water electroplating process is serious. Disclosure of Invention Based on the above, it is necessary to provide a composite copper foil with simple preparation process and environmental protection and a preparation method thereof. In addition, a current collector, an electrode sheet, a secondary battery and an electric device comprising the composite copper foil are also provided. In one aspect of the present application, there is provided a method for preparing a composite copper foil, comprising the steps of: sputtering a copper alloy target material by adopting a pulse direct current power supply, and depositing a copper alloy coating on the surface of the base material; Sputtering a pure copper target by using a first direct current power supply, and depositing a pure copper coating on the surface of the copper alloy coating, wherein the total current of the first direct current power supply is 300A-400A, the voltage is 400V-550V, and the thickness of the pure copper coating is 950 nm-1000 nm; and sputtering a copper-nickel alloy target by adopting a second direct current power supply, and depositing a copper-nickel coating on the surface of the pure copper coating. According to the preparation method of the composite copper foil, the copper alloy plating layer, the pure copper plating layer and the copper-nickel plating layer are sequentially prepared on the surface of the base material to obtain the composite copper foil, the copper alloy plating layer prepared by pulse direct current power supply sputtering is good in overall compactness, the adhesive force between the plating layer and the base material can be improved, the pure copper plating layer with the thickness of 950-1000 nm is prepared by high-power direct current power supply sputtering, the compactness and the adhesive force of the pure copper plating layer are good, then the copper-nickel plating layer is prepared by direct current power supply sputtering, the copper-nickel plating layer has good oxidation resistance, and adverse chemical reaction with battery materials is avoided. The preparation method of the composite copper foil is prepared by a sputtering coating method in one step, so that the water electroplating process of the traditional preparation method of the composite copper foil is avoided, and the preparation process is simple and environment-friendly. The composite copper foil prepared by the preparation method has good surface adhesion, oxidation resistance and low sheet resistance, and is particularly suitable for preparing battery current collectors. In some embodiments, the cooling temperature is 10 ℃ to 20 ℃. In some embodiments, the current of the pulse direct current power supply is 10-15A, the voltage is 350-450V, and the duty ratio is 40-70%. In some embodiments, the second dc power supply has a current of 5a to 15a and a voltage of 360v to 430v. In some embodiments, the thickness of the copper alloy plating layer is 10 nm-15 nm. In some of these embodiments, the copper alloy target comprises one of a copper nickel alloy, a copper zinc alloy, and a copper silver alloy; optionally, the copper alloy target is copper-nickel alloy, and the mass content of nickel element in the copper-nickel alloy is 5% -15%. In some embodiments, the thickness of the copper-nickel plating layer is 15 nm-20 nm. In some embodiments, the mass content of nickel element in the copper-nickel plating layer is 5% -15%. In some embodiments, the substrate satisfies at least one of conditions (1) - (2): (1) The thickness of the base material is 3-6 mu m; (2) The material of the base material comprises at least one of polypropylene, polyethylene terephthalate, polybutylene terephthalate, polystyrene and polyethylene. In a second aspect, the app