CN-116791048-B - Bias sputtering coating device

CN116791048BCN 116791048 BCN116791048 BCN 116791048BCN-116791048-B

Abstract

The application discloses a bias sputtering coating device which comprises a reaction container, a substrate bearing mechanism, a sputtering coating mechanism, a rotating mechanism and a vacuum exhausting mechanism. The reaction vessel has a vacuum chamber. The substrate bearing mechanism is arranged in the vacuum cavity. The substrate bearing mechanism comprises a main body part and a hanging plate part which are connected, and the hanging plate part is arranged on the periphery side of the main body part. The main body portion includes a first conductive member and a rotary support member connected. The hanging plate part comprises a second conductive piece and a biasing block, wherein the second conductive piece is electrically connected with the first conductive piece, and the biasing block is used for placing the coating substrate. The bias block is made of conductive materials and is electrically connected with the second conductive piece. The sputtering coating mechanism is arranged in the vacuum cavity. The rotating mechanism is used for driving the main body part to drive the hanging plate part to rotate. The rotating mechanism is connected with the rotating support. The vacuum exhaust mechanism is communicated with the vacuum cavity and is used for exhausting and vacuumizing the vacuum cavity. The bias sputtering coating device provided by the specification can provide stable and reliable bias while meeting the high-speed rotation requirement of a coating process.

Inventors

WANG HUAIMIN
CHENG XULI
GE HELING
JIANG YOUSONG
YANG YUN

Assignees

安徽其芒光电科技有限公司

Dates

Publication Date: 20260512
Application Date: 20230628

Claims (9)

1. A bias sputtering coating device, comprising: a reaction vessel having a vacuum chamber; The substrate bearing mechanism is arranged in the vacuum cavity and used for bearing the film-coated substrate and comprises a main body part and a hanging plate part which are connected, wherein the hanging plate part is arranged on the periphery of the main body part; the hanging plate part comprises a second conductive piece and a biasing block, wherein the second conductive piece is electrically connected with the first conductive piece, the biasing block is used for placing the film plating substrate, the biasing block is made of conductive materials, and the biasing block is electrically connected with the second conductive piece; The sputtering coating mechanism is arranged in the vacuum cavity and used for performing sputtering coating on the coating substrate and comprises a sputtering cathode arranged in the vacuum cavity and connected with the side wall of the vacuum cavity, and a target material arranged on the sputtering cathode, wherein the target material is arranged towards the hanging plate part; The rotating mechanism is used for driving the main body part to drive the hanging plate part to rotate and is connected with the rotating support piece; The vacuum exhaust mechanism is communicated with the vacuum cavity and used for exhausting and vacuumizing the vacuum cavity, the first conductive piece and the second conductive piece are electrically connected through the conductive part, a first baffle is arranged at one end of the rotary support piece fixedly connected with the rotary mechanism, a second baffle is arranged at the other end of the rotary support piece, a hinge is arranged on the top surface of the second baffle, the hanging plate part is connected with the main body part through the hinge, one ends, far away from the rotary support piece, of the first baffle and the second baffle are in contact with the hanging plate part, one part of the conductive part penetrates through the second baffle and is connected with the first conductive piece, and the rest part of the conductive part is located in a containing space surrounded by the first baffle, the second baffle, the rotary support piece and the hanging plate part.
2. The bias sputtering coating device of claim 1, wherein the number of said sputtering coating mechanisms is two, and two of said sputtering coating mechanisms are symmetrically disposed about said substrate carrying mechanism.
3. The bias sputtering coating device according to claim 1, wherein the rotary support member has a cylindrical shape, one end of the rotary support member is fixedly connected to the rotary mechanism, and the other end is fixedly connected to the first conductive member via an insulating member.
4. The bias sputtering coating device of claim 3, wherein the first conductive member comprises a power receiving flange and the insulating member comprises an insulating flange.
5. The bias sputtering coating device according to claim 1, wherein the hanging plate portion comprises: A hanging plate main body having a receiving hole; a back plate ceramic located at a side of the hanging plate main body facing the rotary support member, and the second conductive member is located at a side of the back plate ceramic facing the rotary support member; And the clamping plate ceramic is positioned in the accommodating hole and between the biasing block and the back plate ceramic, the clamping plate ceramic is contacted with the hanging plate main body, and the biasing block is respectively contacted with the clamping plate ceramic and the coating substrate.
6. The bias sputtering coating device according to claim 5, wherein the back plate ceramic is provided with a first through hole, the clamping plate ceramic is provided with a second through hole, a conductive boss is arranged on one surface of the bias block facing the clamping plate ceramic, the conductive boss penetrates through the second through hole and the first through hole and then is connected with the second conductive member, and an insulating sleeve is sleeved on the rest part of the conductive boss except the part connected with the second conductive member.
7. The bias sputtering coating device according to claim 5, wherein a positioning boss is further provided on a surface of the bias block facing the clamping plate ceramic, and a recess corresponding to the positioning boss is provided on a surface of the clamping plate ceramic facing the bias block.
8. The bias sputtering coating device according to claim 5, wherein the hanger plate body is provided with two of the receiving holes distributed in a vertical direction, each of the hanger plate portions being for placing two of the coating substrates.
9. The bias sputtering coating device according to claim 8, wherein one end of the conductive portion is connected to the first conductive member, and the other end of the conductive portion includes two sub-ends respectively connected to the two second conductive members, which are distributed in a vertical direction.

Description

Bias sputtering coating device Technical Field The specification relates to the field of vacuum technology, and in particular relates to a bias sputtering coating device. Background The sputtering coating technique is to bombard the surface of the target material with ions, and the phenomenon that atoms of the target material are knocked out is called sputtering. The deposition of atoms generated by sputtering on the surface of a substrate is called sputter coating. Gas ionization is usually generated by gas discharge, and positive ions bombard a cathode target body at high speed under the action of an electric field to strike atoms or molecules of the cathode target body, fly to the surface of a plated substrate and deposit into a film. The bias sputtering coating is based on the common sputtering coating device, the potential on the substrate and the potential of the grounding anode of the vacuum chamber are set separately, a bias voltage with a certain size is applied between the substrate and the plasma according to different requirements, thereby attracting part of ion flow to the surface of the substrate, and the microstructure and performance of the film are changed by changing the number and energy of charged particles incident to the surface of the substrate. However, the substrate carrying device of the existing sputter coating device rotates around its center, and the bias voltage cannot be conveniently and safely loaded onto the substrate. Disclosure of Invention In view of the shortcomings of the prior art, it is an object of the present disclosure to provide a bias sputtering coating device that provides a stable and reliable bias while meeting the high-speed rotation requirements of the coating process. In order to achieve the above object, embodiments of the present disclosure provide a bias sputtering coating device, including: a reaction vessel having a vacuum chamber; the substrate bearing mechanism is arranged in the vacuum cavity and used for bearing the film-coated substrate and comprises a main body part and a hanging plate part which are connected, wherein the hanging plate part is arranged on the periphery of the main body part; the main body part comprises a first conductive piece and a rotary supporting piece which are connected, the hanging plate part comprises a second conductive piece which is electrically connected with the first conductive piece and a biasing block for placing the film-coated substrate, the biasing block is made of conductive materials, and the biasing block is electrically connected with the second conductive piece; The sputtering coating mechanism is arranged in the vacuum cavity and used for performing sputtering coating on the coating substrate and comprises a sputtering cathode arranged in the vacuum cavity and connected with the side wall of the vacuum cavity, and a target material arranged on the sputtering cathode, wherein the target material is arranged towards the hanging plate part; The rotating mechanism is used for driving the main body part to drive the hanging plate part to rotate and is connected with the rotating support piece; And the vacuum exhausting mechanism is communicated with the vacuum cavity and is used for exhausting and vacuumizing the vacuum cavity. As a preferred embodiment, the number of the sputtering coating mechanisms is two, and the two sputtering coating mechanisms are symmetrically arranged with respect to the substrate carrying mechanism. As a preferred embodiment, the rotary support member is cylindrical, and one end of the rotary support member is fixedly connected to the rotary mechanism, and the other end is fixedly connected to the first conductive member through an insulating member. As a preferred embodiment, the first conductive member includes a power receiving flange, and the insulating member includes an insulating flange. As a preferred embodiment, the hanging plate part includes: A hanging plate main body having a receiving hole; a back plate ceramic located at a side of the hanging plate main body facing the rotary support member, and the second conductive member is located at a side of the back plate ceramic facing the rotary support member; And the clamping plate ceramic is positioned in the accommodating hole and between the biasing block and the back plate ceramic, the clamping plate ceramic is contacted with the hanging plate main body, and the biasing block is respectively contacted with the clamping plate ceramic and the coating substrate. As a preferable implementation mode, the backboard ceramic is provided with a first through hole, the splint ceramic is provided with a second through hole, one surface of the biasing block facing the splint ceramic is provided with a conductive boss, the conductive boss penetrates through the second through hole and the first through hole and then is connected with the second conductive piece, and the rest parts of the conductive boss except the part connected wit