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CN-116799608-B - Laser chip assembly position correction and mounting equipment and correction method

CN116799608BCN 116799608 BCN116799608 BCN 116799608BCN-116799608-B

Abstract

The invention discloses a laser chip assembling position correction and mounting device and a using method thereof, comprises a mechanical arm, a grabbing device, a CCD camera, a point laser emitter, a photoelectric detector, a TO tube seat and a tube tongue. The gripping device and the CCD camera are vertically arranged and are adjacently fixed on the mechanical arm, the CCD camera is positioned on the right side of the gripping device, and the gripping device can horizontally rotate. The two sides of the point laser transmitter in the horizontal direction are symmetrically provided with a plurality of photoelectric detectors, and the photoelectric detectors on each side are sequentially arranged and extend outwards. The laser emitted by the point laser emitter is vertical TO the vertical plane where the photoelectric detector is located, the pipe tongue is fixed on the TO pipe seat, and the horizontal pipe tongue and the point laser emitter are positioned on the same axis. The invention can effectively solve the problems of low efficiency and high cost of the existing packaging technology that the manual calibration of COS mounting position is easy to cause tube core pollution.

Inventors

  • QU ZHI
  • GUO JIAN
  • QIN LI

Assignees

  • 潍坊华光光电子有限公司

Dates

Publication Date
20260505
Application Date
20230625

Claims (9)

  1. 1. The correction and mounting method for the laser chip assembly position is characterized in that the correction and mounting device for the laser chip assembly position is used as an operation device and comprises a mechanical arm, a grabbing device, a CCD camera, point laser transmitters, photoelectric detectors, a TO tube seat and a tube tongue, wherein the grabbing device and the CCD camera are vertically arranged and are adjacently fixed on the mechanical arm, the CCD camera is positioned on the right side of the grabbing device and can horizontally rotate, the setting of the point laser transmitters is based on the fact that laser emitted by the point laser transmitters can irradiate on a light-emitting cavity surface of a tube core or COS (chip) grabbed on the grabbing device, a plurality of the photoelectric detectors are symmetrically distributed on two sides of the point laser transmitters in the horizontal direction, the photoelectric detectors on each side are sequentially arranged and extend outwards, and the laser emitted by the point laser transmitters is perpendicular TO a vertical plane where the photoelectric detectors are located; The correction and racking method comprises the following steps: (1) The gripping device is driven by the mechanical arm to move to the area where the COS is located and grip the COS, and then the gripped COS is transferred to the position right in front of the point laser emitter; (2) Starting the point laser emitter to irradiate the laser emitted by the point laser emitter on the light emitting cavity surface of the tube core on the COS, irradiating the reflected laser beam generated by the point laser emitter on the photoelectric detector, judging the irradiation position of the reflected laser beam, and judging that the coaxiality meets the product packaging requirement when the irradiation position is positioned in a set area without adjustment; (3) For the COS with the fixed coaxiality not meeting the requirement, the grabbing device rotates in the horizontal direction until the irradiation position of the reflected laser beam regulated to the COS is located in a set area, so that coaxiality adjustment is completed; (4) And then the gripping device moves linearly leftwards to a pipe tongue part adhered with an adhesive under the drive of a mechanical arm, the position of the COS is regulated through the left and right movements of the gripping device, the relative positions of the light-emitting cavity surface and two vertical surfaces of the end surface of the pipe tongue are ensured to be consistent, namely the die extraction amount is consistent, and the gripping device releases the COS to be adhered with the pipe tongue through the adhesive, so that the loading is completed.
  2. 2. The method for correcting and mounting a laser chip assembly position according to claim 1, wherein the gripping means is a vacuum nozzle having a suction port at a lower end thereof.
  3. 3. The method of calibrating and mounting a laser chip assembly according to claim 1, wherein photodetectors on both sides of the spot laser transmitter are fixed to a mounting board.
  4. 4. A method of calibrating a mounting position of a laser chip according TO any of claims 1-3, characterized in that the TO header and the tongue are located TO the left of the gripping device at this time, with reference TO the movement of the gripping device carrying the die or COS directly in front of the spot laser transmitter.
  5. 5. The method of calibrating a mounting position of a laser chip as recited in claim 1 wherein in step (1) the COS includes a die and a heat sink, and wherein the die is bonded to an upper surface of the heat sink.
  6. 6. The method for aligning and mounting a laser chip assembly position according to claim 5, wherein the heat sink comprises any one of a prefabricated single-sided gold-tin heat sink with gold-tin solder on an upper surface and a prefabricated double-sided gold-tin heat sink with gold-tin solder on both upper and lower surfaces.
  7. 7. The method of calibrating and mounting a laser chip according to claim 6, wherein when the heat sink is a prefabricated double-sided gold-tin heat sink having gold-tin solder on both upper and lower surfaces, the tongue is located in a eutectic table, and the adhesive in step (4) is not applied to the tongue.
  8. 8. The method of calibrating a mounting position of a laser chip according to any one of claims 1 to 7, wherein in the step (4), the adhesive includes any one of silver paste, tin paste, and epoxy resin.
  9. 9. The method of calibrating and mounting a laser chip assembly position according to any of claims 1-7, wherein in step (2) calibration of different coaxiality requirements is achieved by varying the area size of the photodetector.

Description

Laser chip assembly position correction and mounting equipment and correction method Technical Field The invention relates to the technical field of chip assembly position correction equipment, in particular to laser chip assembly position correction and mounting equipment and a correction method. Background The information disclosed in the background of the invention is only for enhancement of understanding of the general background of the invention and is not necessarily to be taken as an admission or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art. Through decades of development, the semiconductor laser has the advantages of small volume, light weight, high electro-optical conversion efficiency, long service life, high reliability and the like, is becoming more and more familiar to society, and gradually replaces traditional gas and solid lasers in the fields of communication, medical treatment, display, industrial manufacture, security protection and the like, and the popularization and diversification of application make the packaging quality requirements of the semiconductor laser in the market higher and higher, but at the same time, the expected price of the semiconductor laser is increasingly reduced by end users, and the improvement of quality and the reduction of price provide great challenges for the semiconductor packaging technology. The packaging forms of the semiconductor laser packaged coaxially in TO at present are mainly divided into silver paste packaging technology and gold tin packaging technology. The silver paste frame-loading process package is that firstly, a heat sink with indium solder on one surface or a heat sink with gold-tin solder on one surface is used for evaporating, under specific process conditions, the solid phase from a chip to the heat sink is formed into COS, then the COS is adhered to a tube seat through silver paste, and finally, the package is completed through baking and solidification. The gold-tin mounting process packaging means that the chip, the heat sink and the tube seat are subjected to die bonding under specific process conditions through heat sinks with gold-tin solder on both sides. Patent document CN 208753723U discloses a correcting device for semiconductor laser chip, which is implemented by bonding COS to a pipe tongue of a pipe seat through silver paste, correcting the assembly position of a pipe core and the pipe seat by manual light, and finally baking and solidifying to finish loading of COS. However, on one hand, the technology is only suitable for indium process packaging, but not Jin Xigong process packaging, and the application field is narrow. On the other hand, according to the technology, after COS is adhered to the pipe socket pipe tongue through silver paste, position correction is manually carried out through manpower, and as the silver paste is not baked and solidified, in the correction process, the silver paste easily pollutes the cavity surface of the laser chip pipe core, so that the product failure influences the product yield, and in addition, the efficiency is lower and the cost is higher due to the fact that manual correction is adopted. Disclosure of Invention In view of the above, the invention provides a calibration and loading device and a calibration method for the assembly position of a laser chip, which can effectively solve the problems of easy tube core pollution, low efficiency and high cost caused by manually calibrating the loading position of COS in the prior packaging technology. Specifically, the invention discloses the following technical scheme. In a first aspect, the invention discloses laser chip assembly position correction and racking equipment which comprises a mechanical arm, a grabbing device, a CCD camera, a point laser emitter, a photoelectric detector, a TO tube seat and a tube tongue. The gripping device and the CCD camera are vertically arranged and are adjacently fixed on the mechanical arm, the CCD camera is positioned on the right side of the gripping device, and the gripping device can horizontally rotate. The point laser transmitters are arranged in such a way that the laser emitted by the point laser transmitters can irradiate on the light-emitting cavity surface of the tube core or COS which is grabbed on the grabbing device. The two sides of the point laser transmitter in the horizontal direction are symmetrically provided with a plurality of photoelectric detectors, and the photoelectric detectors on each side are sequentially arranged and extend outwards. And the laser emitted by the point laser emitter is vertical to the vertical plane where the photoelectric detector is positioned. The pipe tongue is fixed on the TO pipe seat, and the horizontal pipe tongue and the point laser transmitter are positioned on the same axis. Further, the grabbing device is a vacuum suction nozzle, the lower end of the grabbing device