CN-116803707-B - Thermal management device

CN116803707BCN 116803707 BCN116803707 BCN 116803707BCN-116803707-B

Abstract

A heat management device comprises a control component, a compression component and a heat management component, wherein the control component is electrically connected with the compression component, the control component is electrically connected with the heat management component, the control component comprises a cooling component and a plurality of heating elements, the control component is provided with a mounting cavity, the cooling component is at least partially positioned in the mounting cavity, the heating elements are positioned in the mounting cavity, and the heating elements are in heat conduction connection with the cooling component. In the application, the control component is respectively and electrically connected with the compression component and the thermal management component, the cooling component is at least partially positioned in the mounting cavity of the control component, the heating element is in thermal conduction connection with the cooling component, and the cooling component is utilized to dissipate heat of the heating element, so that the heat dissipation effect is realized.

Inventors

Request for anonymity
ZHANG YUNFANG
XU YUNGEN
TAN YONGXIANG

Assignees

浙江三花智能控制股份有限公司

Dates

Publication Date: 20260505
Application Date: 20230203

Claims (10)

1. The heat management device is characterized by comprising a control component, a compression component and a heat management component, wherein the control component is electrically connected with the compression component, and the control component is electrically connected with the heat management component; the control assembly comprises a cooling component and a plurality of heating elements, the control assembly is provided with a mounting cavity, the cooling component is at least partially positioned in the mounting cavity, the heating elements are positioned in the mounting cavity, and the heating elements are in heat conduction connection with the cooling component; The control assembly integrates the electric control part of the compression assembly and the electric control part of the thermal management assembly, and comprises a shell, wherein the electric control part of the compression assembly and the electric control part of the thermal management assembly are positioned in the same shell.
2. The thermal management device of claim 1, wherein the cooling member has a cooling cavity, the cooling member including an inlet portion and an outlet portion, the inner cavity of the inlet portion and the inner cavity of the outlet portion each communicating with the cooling cavity, the inner cavity of the inlet portion and the inner cavity of the outlet portion each communicating with the control assembly exterior space.
3. The thermal management device according to claim 2, wherein said cooling member includes a partition plate, said inlet portion and said outlet portion are located on opposite sides of a thickness direction of said partition plate, respectively, said inlet portion and said outlet portion are located on the same side of said cooling member; The cooling cavity comprises a first cavity and a second cavity, the partition plate is located between the first cavity and the second cavity, the inner cavity of the inlet portion is communicated with the first cavity, the inner cavity of the outlet portion is communicated with the second cavity, and the first cavity is communicated with the second cavity on one side away from the inlet portion and the outlet portion.
4. A thermal management device according to claim 3, wherein said cooling member has a guide surface which is disposed obliquely with respect to said partition, said guide surface being oriented toward a communication between said first chamber and said second chamber, said guide surface being located at an end of said first chamber remote from said inlet portion, or said guide surface being located at an end of said second chamber remote from said outlet portion.
5. The thermal management device of claim 3, wherein said control assembly comprises a first housing and a second housing, said first housing and said second housing being mounted together, said mounting cavity being located between said first housing and said second housing; the cooling component comprises a cover body and a cavity body, the cooling cavity is located between the cover body and the cavity body, the inlet part and the outlet part are located in the cavity body, and the cover body is in sealing connection with the cavity body.
6. The thermal management device of claim 5, wherein said cooling member is of unitary construction, said cooling member being mounted with said first housing, said inlet portion and said outlet portion being sealingly connected with said first housing, respectively.
7. The thermal management device of claim 5, wherein said housing portion is of unitary construction with said first shell, and wherein said cover portion is mounted with said housing portion, or wherein said cover portion is mounted with said housing portion, The first shell, the cover body and the cavity body are respectively and independently formed, the first shell, the cover body and the cavity body are mutually installed, and the inlet part and the outlet part are respectively and hermetically connected with the first shell.
8. The thermal management device of claim 5, wherein said baffle is of unitary construction with said cover portion or with said cavity portion; The cooling component comprises fins, the fins are located in the cooling cavity and used for disturbing the fluid flow direction and increasing the heat exchange area, and the fins are connected with the cover body or the cavity body.
9. The thermal management device of claim 2, wherein the thermal management assembly comprises a first flow conduit plate having a first channel, a second flow conduit plate having a second channel, a plurality of first thermal management components mounted to the first flow conduit plate and a plurality of second thermal management components mounted to the second flow conduit plate, the lumens of the plurality of first thermal management components being in communication through the first channel, the lumens of the plurality of second thermal management components being in communication through the second channel, the first flow conduit plate and the second flow conduit plate being mounted together, the first channel for circulating a refrigerant and the second channel for circulating a cooling fluid; The control assembly is mounted with the thermal management assembly, the control assembly is electrically connected with both the first thermal management component and the second thermal management component, and the cooling cavity is communicated with the second channel; The compression assembly comprises a compression component and a driving component, the driving component drives the compression component to compress the refrigerant, the compression assembly is connected with the thermal management assembly or the control assembly, the control assembly is electrically connected with the driving component, and an inner cavity of the compression assembly is communicated with the first channel; The control assembly comprises a compression control module and a thermal management control module, wherein the compression control module is electrically connected with the driving part and used for adjusting the working state of the driving part, the thermal management control module is electrically connected with the thermal management part and used for adjusting the working state of the thermal management part, the control assembly is arranged separately from the compression assembly and is arranged separately from the thermal management assembly, and the compression control module and the thermal management control module are located in the same shell.
10. The thermal management device of claim 1, wherein said control assembly comprises a circuit board located in said mounting cavity, each of said heat generating elements comprising a body and a connection portion secured to and electrically connected to said circuit board, said connection portion secured to and electrically connected to said body, a portion of an outer surface of said body being in thermally conductive connection with said cooling member; the heating elements comprise at least one of insulated gate bipolar transistors, discharge resistors, thin film capacitors and common mode inductors; the control assembly is disposed separately from the compression assembly and the control assembly is disposed separately from the thermal management assembly.

Description

Thermal management device Technical Field The present disclosure relates to thermal management, and particularly to a thermal management device. Background The vehicle thermal management system comprises a compressor integrated with an electric control part, and thermal management equipment integrated with components such as an expansion valve and a water pump, wherein the electric control part of the thermal management equipment generates less heat, the cooling requirement can be met through natural heat dissipation, the electric control part of the compressor comprises a plurality of heating elements, the heating problem of the heating elements can lead the heating elements to damage and lose efficacy, and therefore a cooling flow passage for cooling is arranged in the compressor. In the related art, an electric control part of the compressor and an electric control part of the thermal management equipment are integrated together, and the integrated control assembly has the problem of serious heat generation and has a heat dissipation requirement. Disclosure of Invention In view of the above problems of the related art, the present application provides a thermal management device having a heat dissipation effect. In order to achieve the purpose, the heat management device comprises a control component, a compression component and a heat management component, wherein the control component is electrically connected with the compression component, the control component is electrically connected with the heat management component, the control component comprises a cooling component and a plurality of heating elements, the control component is provided with a mounting cavity, the cooling component is at least partially positioned in the mounting cavity, the heating elements are positioned in the mounting cavity, and the heating elements are in heat conduction connection with the cooling component. In the application, the control component is electrically connected with the compression component and the thermal management component, the cooling component is at least partially positioned in the mounting cavity of the control component, the heating element is in thermal conduction connection with the cooling component, and the cooling component is used for radiating heat of the heating element to realize the radiating effect. Drawings FIG. 1 is a schematic perspective view of an embodiment of a thermal management device of the present application; FIG. 2 is an exploded schematic view of an embodiment of a thermal management device of the present application; FIG. 3 is a further exploded schematic view of an embodiment of a thermal management device of the present application; FIG. 4 is an exploded schematic view of the cooling component and heating element assembly of the present application; FIG. 5 is an exploded schematic view of the cooling component and heating element assembly of the present application; FIG. 6 is a schematic cross-sectional view of an embodiment of a thermal management device of the present application; FIG. 7 is an enlarged partial schematic view of portion A shown in FIG. 6; FIG. 8 is an exploded view of another embodiment of the control assembly of the present application; FIG. 9 is a schematic cut-away view of the control assembly shown in FIG. 8; FIG. 10 is an enlarged partial schematic view of B shown in FIG. 9; FIG. 11 is a schematic perspective view of another embodiment of a thermal management device of the present application; FIG. 12 is a schematic diagram of an electronically controlled connection of a thermal management device of the present application. Detailed Description Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be understood that the terms first, second and the like used in the description and the claims do not denote any order, quantity or importance, but rather are used to distinguish one element from another. Also, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item, and "a plurality" denotes two or more of the r