CN-116804888-B - Heat dissipation device

CN116804888BCN 116804888 BCN116804888 BCN 116804888BCN-116804888-B

Abstract

A heat dissipating device comprises a main fixing substrate, a main heat pipe set, a lower heat dissipating fin set and an upper heat dissipating module. The main heat pipe group is fixed on the main fixed base plate, the lower layer heat radiation fin group is also fixed on the main fixed base plate, the main heat pipe group penetrates through the lower layer heat radiation fin group and is exposed out of the upper side of the lower layer heat radiation fin group, and the upper layer heat radiation module is detachably arranged above the lower layer heat radiation fin group and contacts the main heat pipe group so as to improve heat radiation efficiency.

Inventors

ZHANG ZHENGRU
LIN WANXUAN
SU ZHONGQIAN

Assignees

春鸿电子科技(重庆)有限公司

Dates

Publication Date: 20260505
Application Date: 20230224
Priority Date: 20220324

Claims (11)

1. A heat sink, comprising: A main fixed substrate; a main heat pipe group fixed on the main fixing base plate; The lower layer heat radiation fin group is fixed on the main fixed substrate, and the main heat pipe group penetrates through the lower layer heat radiation fin group and is exposed from the upper side of the lower layer heat radiation fin group; An upper heat dissipation module detachably mounted above the lower heat dissipation fin set and contacting the main heat pipe set, wherein the upper heat dissipation module comprises an upper heat pipe set and an upper fixing substrate for fixing the upper heat pipe set, and The fixing cross bars are arranged on the lower layer radiating fin groups and are positioned between the main heat pipe groups and used for fixing the upper layer radiating modules, wherein the fixing cross bars comprise fixing holes, the upper layer fixing base plate comprises a plurality of through holes, fixing screws penetrate through the upper layer fixing base plate, and the upper layer fixing base plate is fixed in the fixing holes of the fixing cross bars.
2. The heat dissipating device of claim 1, wherein the upper layer heat dissipating module further comprises: an upper main heat radiation fin group and At least one first auxiliary radiating fin group is arranged at the side edge of the upper layer main radiating fin group.
3. The heat dissipating device of claim 2, wherein the first set of auxiliary heat dissipating fins comprises: The first auxiliary radiating fin group and the second auxiliary radiating fin group are respectively positioned at two sides of the upper layer main radiating fin group, and the thickness of the upper layer main radiating fin group is smaller than or equal to the thickness of the first auxiliary radiating fin group and the thickness of the second auxiliary radiating fin group.
4. The heat dissipating device of claim 3, wherein the upper heat pipe group is disposed through the first auxiliary heat dissipating fin group, the upper main heat dissipating fin group, and the second auxiliary heat dissipating fin group.
5. The heat sink of claim 4, wherein the upper mounting substrate comprises a plurality of openings.
6. The heat dissipating apparatus of claim 5, wherein the upper layer heat pipe group comprises: the upper heat pipes comprise a first part, a second part and a third part, wherein the second parts of the upper heat pipes are distributed on the upper fixed substrate at equal intervals and are exposed out of the openings.
7. The heat sink of claim 6, wherein the upper layer heat sink module further comprises: an upper heat conduction block directly contacting the upper heat pipes through the openings, and And the heat conducting pad is arranged between the upper layer heat conducting block and the main heat pipe group so as to transfer heat in the main heat pipe group to the upper layer heat conducting block.
8. The heat sink of claim 1, wherein the primary heat pipe set comprises: The heat pipes comprise a first part, a second part and a third part, wherein the first part is fixed on the main fixing substrate, the second part is a rising section so as to transfer the heat absorbed by the first part upwards to the third part, and the third part is exposed out of the lower-layer radiating fin group and contacts the upper-layer radiating module.
9. The heat sink of claim 8, wherein the plurality of primary heat pipes comprises: a first main heat pipe, and And the first part of the second main heat pipe is fixed on one side of the first part of the first main heat pipe, and forms a U shape.
10. The heat sink of claim 9, wherein the plurality of primary heat pipes further comprises: And the first part of the third main heat pipe is arranged in the U-shaped structure formed by the first part of the second main heat pipe.
11. The heat sink of claim 1, further comprising: And the main heat conduction block is fixed below the main fixing base plate and is contacted with the main heat pipe group through the opening of the main fixing base plate.

Description

Heat dissipation device Technical Field The invention relates to a heat dissipation device. And more particularly to a heat sink having a removable upper heat dissipating module. Background With the progress of technology, electronic products are becoming popular, and the living or working modes of many people are gradually changed. With the increasing computing power of computers, temperature control is increasingly important when electronic devices such as a cpu are operated. Electronic components such as a cpu generate heat during operation and require proper cooling to achieve optimum performance. In order to keep the electronic components such as the cpu operating at a desired temperature, it is generally performed by liquid cooling or air cooling. Furthermore, as the number of cores of a cpu is now increasing, the memory capacity is also increasing and fast. As the heat generated by the cpu increases, the volume and performance of the heat sink are also increased. Therefore, the heat dissipation area of the heat dissipation fins required by the computer device is gradually increased. Generally, the increase of the memory capacity of the computer can effectively improve the overall performance of the computer. Therefore, when the computer is stuck or flashed back, the user often has to upgrade or replace the memory. The computer memory is generally mounted beside the cpu, so that too large heat dissipation fins will affect the replacement of the memory, while too small heat dissipation fins will affect the heat dissipation efficiency of the cpu. Therefore, how to improve the heat dissipation efficiency of the central processing unit, and facilitate the user to replace the computer memory, the working temperature of the central processing unit can be reduced, and the working efficiency of the whole computer can be improved. Disclosure of Invention This summary is intended to provide a simplified summary of the disclosure so that the reader is a basic understanding of the disclosure. This summary is not an extensive overview of the disclosure and is intended to neither identify key/critical elements of the embodiments of the invention nor delineate the scope of the invention. An objective of the present invention is to provide a heat dissipating device, which can improve the heat dissipating efficiency of the heat dissipating device, thereby improving the overall heat dissipating efficiency of the computer device. In order to achieve the above objective, according to one embodiment of the present disclosure, a heat dissipating device includes a main fixing substrate, a main heat pipe set, a lower heat dissipating fin set, and an upper heat dissipating module. The main heat pipe group is fixed on the main fixed base plate, the lower layer heat radiation fin group is also fixed on the main fixed base plate, the main heat pipe group penetrates through the lower layer heat radiation fin group and is exposed out of the upper side of the lower layer heat radiation fin group, and the upper layer heat radiation module is detachably arranged above the lower layer heat radiation fin group and contacts the main heat pipe group. In some embodiments, the upper heat dissipation module includes an upper main heat dissipation fin set and at least one first auxiliary heat dissipation fin set disposed at a side of the upper main heat dissipation fin set. In some embodiments, the first auxiliary radiator fin group includes a first auxiliary radiator fin group and a second auxiliary radiator fin group, which are respectively located at two sides of the upper layer main radiator fin group, and the thickness of the upper layer main radiator fin group is smaller than or equal to the thickness of the first auxiliary radiator fin group and the thickness of the second auxiliary radiator fin group. In some embodiments, the upper heat dissipation module further includes an upper heat pipe set penetrating among the first auxiliary heat dissipation fin set, the upper main heat dissipation fin set and the second auxiliary heat dissipation fin set. In some embodiments, the upper heat dissipation module further includes an upper fixing substrate for fixing the upper heat pipe group, wherein the upper fixing substrate includes a plurality of openings. In some embodiments, the upper heat pipe group includes a plurality of upper heat pipes, and each upper heat pipe includes a first portion, a second portion and a third portion, wherein the second portions of the upper heat pipes are distributed on the upper fixed substrate at equal intervals and are exposed from the openings. In some embodiments, the upper heat dissipation module further comprises an upper heat conduction block and a heat conduction pad. The upper heat conduction block is directly contacted with the upper heat pipe through the opening, and the heat conduction pad is arranged between the upper heat conduction block and the main heat pipe group so as to transfer heat in the