CN-116809534-B - Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus according to one embodiment includes a substrate holding unit having a stage for holding a substrate substantially horizontally, a frozen liquid supply unit for supplying frozen liquid to the substrate, a cooling unit for cooling the frozen liquid to form a frozen film, and a nozzle extending in a first direction including a center portion of the stage in a plan view, one end in the first direction and an outer peripheral portion located outside the center portion on the other end opposite to the one end, the substrate processing apparatus including a thawed liquid supply unit for supplying the thawed liquid to the substrate in at least one of different amounts, temperatures, and supply timings at the center portion and the outer peripheral portion, and thawing the frozen film.

Inventors

• Kenji Zenai
• TERAYAMA MASATOSHI

Assignees

• 铠侠股份有限公司

Dates

Publication Date

20260512

Application Date

20220708

Priority Date

20220322

Claims (10)

1. 1. A substrate processing apparatus is provided with: The substrate holding unit includes a stage for holding a substrate substantially horizontally, a frozen liquid supply unit for supplying frozen liquid to the substrate, a cooling unit for cooling the frozen liquid to form a frozen film, and a nozzle extending in a first direction including a center portion of the stage in a plan view, one end of the first direction and an outer peripheral portion located outside the center portion at the other end opposite to the one end, The substrate processing apparatus includes a thawing-solution supply unit, The thawing liquid supply unit supplies at least one thawing liquid having different amounts and temperatures to the substrate at the center portion and the outer peripheral portion at the same time, thawing the frozen film, The nozzle includes a plurality of liquid supply ports, a width in a longitudinal direction of a region where the plurality of liquid supply ports are arranged is substantially equal to a diameter of the substrate, and a width in a short side direction of a region where the plurality of liquid supply ports are arranged is greater at both ends of the long side than at a center of the long side, so that the number of liquid supply ports at both ends of the long side is greater than the number of liquid supply ports at the center of the long side, and a supply amount of the thawing liquid is greater at the outer peripheral portion than at the center portion.
2. 2. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply part is provided with a liquid supply port which is opposite to the substrate and extends along the radial direction of the substrate, and the width of the liquid supply port orthogonal to the radial direction is larger at the peripheral part than at the central part.
3. 3. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply part includes a plurality of liquid supply ports facing the substrate and distributed in a radial direction of the substrate, and the number of the plurality of liquid supply ports is greater in the outer peripheral portion than in the center portion.
4. 4. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply part includes a plurality of liquid supply ports facing the substrate and distributed in a radial direction of the substrate, and the plurality of liquid supply ports have a larger diameter at the outer peripheral portion than at the center portion.
5. 5. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply unit includes a plurality of liquid supply ports facing the substrate and distributed in a radial direction of the substrate, and a flow rate control mechanism connected to each of the plurality of liquid supply ports.
6. 6. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply unit includes a plurality of liquid supply ports facing the substrate and distributed in a radial direction of the substrate, and a timing control mechanism connected to each of the plurality of liquid supply ports.
7. 7. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply unit is provided with a temperature control mechanism that controls the temperature of the thawing liquid supplied to the substrate.
8. 8. The substrate processing apparatus according to claim 7, wherein, The temperature control mechanism is provided with a cooler or a heater.
9. 9. The substrate processing apparatus according to claim 1, wherein, The thawing liquid supply unit includes a plurality of liquid supply ports facing the substrate and distributed in a radial direction of the substrate, and a temperature control mechanism connected to each of the plurality of liquid supply ports.
10. 10. A substrate processing method, comprising: Supplying a freezing liquid to a substrate kept substantially horizontal, cooling the freezing liquid to form a frozen film, simultaneously supplying a different amount of at least one of a supply amount and a temperature of the thawing liquid to the substrate at a center portion and an outer peripheral portion of the substrate, thereby thawing the frozen film, The width in the longitudinal direction of the region where the plurality of liquid supply ports are arranged is set to be substantially equal to the diameter of the substrate, and the width in the short side direction of the region where the plurality of liquid supply ports are arranged is set to be larger at both ends of the long side than at the center of the long side, so that the number of liquid supply ports at both ends of the long side is set to be larger at the center of the long side than at the center of the long side, and the supply amount of the thawing liquid is set to be larger at the outer peripheral portion than at the center of the long side.

Description

Substrate processing apparatus and substrate processing method RELATED APPLICATIONS The present application is based on the benefit of priority produced by the prior japanese patent application No. 2022-46097 filed on 3/22 of 2022, the entire content of which is incorporated by reference herein, and requests its benefit. Technical Field Embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method. Background As one of cleaning techniques for removing the adhering matter such as particles adhering to the surface of the substrate, a freeze cleaning technique is known. In this technique, after freezing a frozen liquid supplied to the substrate surface, a defrosting liquid is supplied to defrost the frozen film, thereby removing particles and the like from the substrate surface. Disclosure of Invention Embodiments of the present disclosure provide a substrate processing apparatus and a substrate processing method that improve the freeze cleaning efficiency of a substrate. A substrate processing apparatus according to one embodiment includes a substrate holding unit having a stage for holding a substrate substantially horizontally, a frozen liquid supply unit for supplying frozen liquid to the substrate, a cooling unit for cooling the frozen liquid to form a frozen film, and a nozzle extending in a first direction including a center portion of the stage in a plan view, one end in the first direction and an outer peripheral portion located outside the center portion on the other end opposite to the one end, the substrate processing apparatus including a thawed liquid supply unit for supplying the thawed liquid to the substrate in which at least one of a supply amount, a temperature, and a supply timing is different between the center portion and the outer peripheral portion, and thawing the frozen film. According to the above configuration, a substrate processing apparatus and a substrate processing method for improving the freeze cleaning efficiency of a substrate can be provided. Drawings Fig. 1 is a diagram schematically showing the overall configuration of a substrate processing apparatus according to one embodiment. Fig. 2 is a bottom view schematically showing the structure of a nozzle according to one embodiment. Fig. 3 is a YZ cross-sectional view of a nozzle according to one embodiment at a long side end (position a in fig. 2). Fig. 4 is a YZ cross-sectional view of a nozzle according to one embodiment at a long-side central portion (position a' in fig. 2). Fig. 5 is an XZ cross-sectional view of a nozzle according to an embodiment at a short-side central portion (position B in fig. 2). Fig. 6 is a diagram schematically showing a substrate processing method according to an embodiment. Fig. 7 is a bottom view schematically showing a structure of a nozzle according to a modification. Fig. 8 is a bottom view schematically showing a structure of a nozzle according to an embodiment. Fig. 9 is a YZ cross-sectional view of a nozzle according to one embodiment at a long side end (position a in fig. 8). Fig. 10 is a YZ cross-sectional view of a nozzle according to one embodiment at a long-side central portion (position a' in fig. 8). Fig. 11 is an XZ cross-sectional view of a nozzle according to an embodiment at a short-side central portion (position B in fig. 8). Fig. 12 schematically illustrates an overall configuration of the liquid supply unit according to one embodiment. Fig. 13 is a bottom view schematically showing a structure of a nozzle according to one embodiment. Fig. 14 shows conditions of a substrate processing method according to an embodiment. Fig. 15 is a diagram showing a substrate processing method according to an embodiment. Detailed Description The substrate processing apparatus and the substrate processing method according to the present embodiment will be described in detail below with reference to the drawings. In the following description, elements having substantially the same functions and structures are denoted by the same reference numerals or numerals added with letters after the same reference numerals, and the description is repeated only when necessary. The embodiments shown below illustrate apparatuses and methods for embodying the technical concept of the embodiments. The embodiment may be modified variously within a range not departing from the gist of the invention. The present invention and its modifications are included in the scope of the invention described in the claims and equivalents thereof. For the sake of clarity of the description, the drawings may schematically show the width, thickness, shape, etc. of each part in comparison with the actual embodiment, but this is merely an example and does not limit the explanation of the present invention. In the present specification and the drawings, elements having the same functions as those already described based on the drawings are denoted by the same reference numerals,