CN-116880020-B - Optical device coupling method

CN116880020BCN 116880020 BCN116880020 BCN 116880020BCN-116880020-B

Abstract

The invention discloses an optical device coupling method, which belongs to the technical field of chip mounting and comprises the steps of rotating a mounting piece along a third direction to enable the mounting piece to be parallel to the central connecting line of each photoelectric component on a mounting surface, rotating the mounting piece along a first direction to enable the mounting piece to be parallel to the mounting surface along a second direction, moving the mounting piece along the third direction if the distance between the second side edge and the mounting surface is larger than the distance between the first side edge and the mounting surface, enabling the first side edge of the mounting piece to be connected with the mounting surface to obtain an included angle between the mounting piece and the mounting surface, rotating the mounting piece by taking the second direction as an axis to finish the mounting of the mounting piece and the mounting surface, and reversely rotating the mounting piece by taking the second direction as an axis until the distance between the second side edge and the mounting surface is larger than the distance between the first side edge and the mounting surface. The optical device coupling method of the invention avoids the problem that the alignment condition of the mounting part and the mounting surface can not be obtained in the conventional identification mode by respectively adjusting the optical device coupling method in three directions, and improves the mounting precision of the optical device.

Inventors

XIONG MENG
BO SHENGWEI
LIANG FUYUN

Assignees

长芯盛（武汉）科技有限公司

Dates

Publication Date: 20260512
Application Date: 20230801

Claims (10)

1. An optical device coupling method, comprising the steps of: S1, obtaining projection of the mounting piece on a plane where the first direction and the second direction are located, and obtaining an outer contour of the projection along the first direction; S2, rotating the mounting piece by taking the first direction as an axis, so that the mounting piece is parallel to the mounting surface in the second direction; s3, moving the mounting part along a third direction to enable the mounting part to be connected with the mounting surface; S4, responding to the fact that the second side edge of the mounting piece is not attached to the mounting surface, and enabling the mounting piece to rotate by a first angle by taking the second direction as an axis; s5, repeating the steps S3 and S4 until the second side edge of the mounting piece is attached to the mounting surface; The position and the angle of the mounting part are acquired through a first identification component and a second identification component, the first identification component is arranged on one side, deviating from the mounting surface, of the mounting part, the first identification component is used for acquiring the projection condition of the mounting part and the mounting surface in a first direction and a second direction, the second identification component is arranged on one side, facing the first direction, of the mounting part, and the second identification component is used for acquiring the inclination angle of a plane formed by the mounting part and the first direction and the second direction from the side surface of the mounting part and the mounting surface.
2. The optical device coupling method according to claim 1, wherein S4 specifically comprises: identifying the distance h between the second side edge of the mounting piece and the mounting surface; if h is greater than the first threshold, rotating the mounting part by a first angle by taking the second direction as an axis; And if h is not greater than the first threshold, rotating the mounting part by a second angle by taking the second direction as an axis, wherein the first angle is greater than the second angle.
3. An optical device coupling method according to claim 1 or 2, wherein, In S4, whether the second side of the mounting member is attached to the mounting surface or not and/or the distance between the second side of the mounting member and the mounting surface is identified according to the visual recognition.
4. The method of coupling optical devices of claim 2, wherein, And if the h is smaller than the second threshold value and/or the included angle between the mounting part and the mounting surface is smaller than the fourth threshold value, judging that the mounting part is attached to the mounting surface.
5. An optical device coupling method, comprising the steps of: S1, obtaining projection of the mounting piece on a plane where the first direction and the second direction are located, and obtaining an outer contour of the projection along the first direction; S2, rotating the mounting piece by taking the first direction as an axis, so that the mounting piece is parallel to the mounting surface in the second direction; S3, moving the mounting piece along a third direction to enable the mounting piece to be connected with the mounting surface, wherein the S3 specifically comprises the following steps: s301, identifying the distance h from the second side edge of the mounting piece to the mounting surface; S302, if the distance h from the second side edge of the mounting part to the mounting surface is 0, moving the mounting part in the reverse direction of the third direction, and rotating the mounting part in the direction A by a fourth angle by taking the second direction as an axis; s303, moving the mounting part along a third direction so that the mounting part is connected with the mounting surface; s4, acquiring the included angle between the mounting part and the mounting surface as a third angle, and rotating the mounting part by the third angle along the direction B by taking the second direction as an axis; S5, moving the mounting part along the third direction so that the mounting part is connected with the mounting surface.
6. The method of claim 5, further comprising repeating S301-S303 until a distance from the second side of the submount to the submount surface is greater than 0 is detected in S301.
7. An optical device coupling method according to claim 5 or 6, wherein, The fourth angle is less than a fifth threshold.
8. A method of coupling an optical device according to claim 6, it is characterized in that the method comprises the steps of, Whether the distance between the mounting piece and the mounting surface is 0 is identified by a pressure sensor or a visual identification mechanism, and/or the distance between the second side edge of the mounting piece and the mounting surface is identified by the visual identification mechanism.
9. The method of claim 5, wherein said step S4 further comprises, Moving the mounting part reversely along the third direction, and rotating the mounting part along the A direction by a fifth angle by taking the second direction as an axis; and moving the mounting part along a third direction so that the mounting part is connected with the mounting surface.
10. An optical device coupling method, comprising the steps of: S1, obtaining projection of the mounting piece on a plane where the first direction and the second direction are located, and obtaining an outer contour of the projection along the first direction; S2, rotating the mounting piece by taking the first direction as an axis to enable the mounting piece to be parallel to the mounting surface in the second direction, and rotating the mounting piece clockwise by taking the second direction as an axis to enable the vertical distance between the second side edge of the mounting piece close to the second identification component and the mounting surface to be larger than the vertical distance between the first side edge of the mounting piece far away from the second identification component and the mounting surface; s3, moving the mounting part along a third direction to enable the mounting part to be connected with the mounting surface; S4, rotating the mounting piece by taking the third direction as an axis to finish the lamination of the mounting piece and the mounting surface; The position and the angle of the mounting part are acquired through a first identification component and a second identification component, the first identification component is arranged on one side, deviating from the mounting surface, of the mounting part, the first identification component is used for acquiring the projection condition of the mounting part and the mounting surface in a first direction and a second direction, the second identification component is arranged on one side, facing the first direction, of the mounting part, and the second identification component is used for acquiring the inclination angle of a plane formed by the mounting part and the first direction and the second direction from the side surface of the mounting part and the mounting surface.

Description

Optical device coupling method Technical Field The invention belongs to the technical field of chip mounting, and particularly relates to an optical device coupling method. Background COB packaging is a packaging technology for directly mounting a chip on a substrate, unlike conventional chip packaging methods, in COB packaging, a housing or a pin is not used, but a gold wire of the chip is soldered on a metallized pad on the substrate. COB package has the characteristics of small chip size, low cost, high reliability, good heat dissipation effect and the like, and can provide higher mounting density. In the COB mounting process, the mounting precision of the chip is required to be higher, and in the coupling process of the optical device, two plane structures with larger areas are usually bonded, for example, when the arrayed waveguide grating is coupled with the photodiode, the lower surface of the arrayed waveguide grating is required to be bonded with the upper surface of the PCB, so that the two bonding surfaces are required to be leveled. When the array waveguide grating is bonded with the PCB, as other components are attached to the PCB, the position relation of the bonding surfaces of the array waveguide grating and the PCB cannot be confirmed, the bonding condition of the two bonding surfaces is difficult to monitor in a conventional camera shooting mode, so that the bonding of the array waveguide grating and the PCB is caused to have position and angle deviation, the quality of COB packaging finished products is low, and the communication quality is influenced. Disclosure of Invention Aiming at one or more of the defects or improvement demands in the prior art, the invention provides an optical device coupling method which is used for solving the problems that COB packaging finished products are low in quality and communication quality are affected due to position and angle deviation existing in bonding of an existing array waveguide grating and a PCB. In order to achieve the above object, the present invention provides an optical device coupling method, comprising the steps of: S1, obtaining projection of the mounting piece on a plane where the first direction and the second direction are located, and obtaining an outer contour of the projection along the first direction; S2, rotating the mounting piece by taking the first direction as an axis, so that the mounting piece is parallel to the mounting surface in the second direction; s3, moving the mounting part along a third direction to enable the mounting part to be connected with the mounting surface. As a further improvement of the present invention, it further comprises, S4, responding to the fact that the second side edge of the mounting piece is not attached to the mounting surface, and enabling the mounting piece to rotate by a first angle by taking the second direction as an axis; s5, repeating the steps S3 and S4 until the second side edge of the mounting piece is attached to the mounting surface. As a further improvement of the present invention, the S4 specifically includes: identifying the distance h between the second side edge of the mounting piece and the mounting surface; if h is greater than the first threshold, rotating the mounting part by a first angle by taking the second direction as an axis; And if h is not greater than the first threshold, rotating the mounting part by a second angle by taking the second direction as an axis, wherein the first angle is greater than the second angle. As a further improvement of the present invention, in S4, whether the second side edge of the mounting member is attached to the mounting surface or not and/or the distance between the second side edge of the mounting member and the mounting surface is identified according to the vision. As a further improvement of the invention, if h is smaller than the second threshold value and/or the included angle between the mounting part and the mounting surface is smaller than the fourth threshold value, the mounting part is judged to be attached to the mounting surface. The invention also provides another optical device coupling method, which comprises the following steps: S1, obtaining projection of the mounting piece on a plane where the first direction and the second direction are located, and obtaining an outer contour of the projection along the first direction; S2, rotating the mounting piece by taking the first direction as an axis, so that the mounting piece is parallel to the mounting surface in the second direction; s3, moving the mounting part along a third direction to enable the mounting part to be connected with the mounting surface; s4, acquiring the included angle between the mounting part and the mounting surface as a third angle, and rotating the mounting part by the third angle along the direction B by taking the second direction as an axis; S5, moving the mounting part along the third direction so that the mounting part is connected