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CN-116887940-B - Method for operating an ultrasonic connection device

CN116887940BCN 116887940 BCN116887940 BCN 116887940BCN-116887940-B

Abstract

The invention relates to a method for operating an ultrasonic connection device, wherein the ultrasonic connection device is provided with an ultrasonic head (1) which is movable in the z-direction and is provided with a support (2), an ultrasonic generation device (3) which is held movably relative to the support (2) and an ultrasonic tool (4) which can be excited by the ultrasonic generation device (3) to vibrate ultrasonically, comprising the steps of positioning an electrically conductive connection conductor (6) above an electrically conductive connection region (8) which is arranged on a connection element (7) such that a gap (10) having a gap dimension(s) which is determined in the z-direction is formed between the connection conductor and a connection surface (9) of the connection region (8) which faces the connection conductor (6), positioning the ultrasonic head (1) relative to the connection conductor (6) and the connection element (7) such that a contact surface (5) of the ultrasonic tool (4) which is configured to rest against the connection conductor (6) faces the connection conductor (6), and applying a force to the support (7) and then pressing the ultrasonic head (1) in the z-direction, and determining a movement position (Z) of the ultrasonic head (1) in the Z-direction and a relative position (Z NL ) of the ultrasonic wave generating device (3) relative to the support (2) in the Z-direction, and determining a contact point (t 1 ) at which the connecting conductor (6) is lowered by the ultrasonic tool (4) to such an extent that it contacts the connecting region (8) of the connecting member (7) taking into account the movement position (Z) and the relative position (Z NL ) and a corresponding closing force (F G ).

Inventors

  • A. Jorkheim
  • M. Huntig
  • M. Brocolman

Assignees

  • 黑塞有限公司

Dates

Publication Date
20260512
Application Date
20211220
Priority Date
20210126

Claims (17)

  1. 1. Method for operating an ultrasonic connection device, wherein the ultrasonic connection device is provided with an ultrasonic head (1) movable in the z-direction, which ultrasonic head is provided with a holder (2), an ultrasonic generation device (3) which is held on the holder movably relative to the holder (2), and an ultrasonic tool (4) which can be excited by the ultrasonic generation device (3) to vibrate ultrasonically, comprising the steps of: The electrically conductive connecting conductor (6) is positioned above an electrically conductive connecting region (8) provided on the connecting component (7) such that a gap (10) having a gap dimension(s) determined in the z-direction is formed between the connecting conductor and a connecting surface (9) of the connecting region (8) facing the connecting conductor (6), Positioning the ultrasound head (1) relative to the connection conductor (6) and the connection element (7) such that a contact surface (5) of the ultrasound tool (4) which is configured for abutting against the connection conductor (6) faces the connection conductor (6), Applying a bonding force acting in the z-direction to the ultrasonic wave generating device (3) ) And pressing it against the support (2), Then -Lowering the ultrasonic head (1) in the z-direction and determining the position of movement (z) of the ultrasonic head (1) in the z-direction and the relative position of the ultrasonic generating device (3) with respect to the support (2) in the z-direction ) A kind of electronic device -Taking into account said movement position (z) and said relative position ) At a contact point (t 1 ) at which the connecting conductor (6) is lowered by the ultrasonic tool (4) to such an extent that it contacts the connecting region (8) of the connecting element (7).
  2. 2. A method according to claim 1, characterized in that the time variation at the moving position (z) is determined to be @ to the relative position ) Is determined, and a zero value of the difference (Deltav) is identified to determine the contact moment (t 1 ).
  3. 3. The method according to claim 1 or 2, wherein the bonding force is [ ] ) Determining the relative position of the ultrasonic wave generating device (3) relative to the bracket (2) ) And comprises a function dependent on the relative position of the ultrasonic wave generating means (3) with respect to the support (2) ) Is provided.
  4. 4. A method according to claim 3, wherein the bonding force ± ) A bonding basic force component applied to the ultrasonic head (1) ) And the bonding displacement force component.
  5. 5. A method according to claim 3, characterized in that on the one hand the bonding force is given ) And/or the relative position of the bonding displacement force component and the ultrasonic wave generating device (3) relative to the bracket (2) ) Known correlation between.
  6. 6. A method according to claim 3, characterized in that on the one hand the bonding force is given ) And/or the relative position of the bonding displacement force component and the ultrasonic wave generating device (3) relative to the bracket (2) ) Known and linear correlation between.
  7. 7. A method according to claim 3, wherein the bonding displacement force component is applied and/or adjustable by an actuator.
  8. 8. Method according to claim 1 or 2, characterized in that the supporting force is determined for the contact moment (t 1 ) ) The ultrasonic wave generating device (3) is pressed against the bracket (2) by the supporting force.
  9. 9. The method according to claim 8, characterized in that the supporting force is measured at least at the contact moment (t 1 ) )。
  10. 10. The method according to claim 8, characterized in that the supporting force is measured continuously at least at the contact moment (t 1 ) )。
  11. 11. A method according to claim 1 or 2, characterized in that the closing force is determined for the contact moment (t 1 ) ) The closing force is applied for closing a gap (10) between the connection conductor (6) and the connection member (7).
  12. 12. The method according to claim 4, characterized in that a closing force is determined for the contact moment (t 1 ) ) The closing force is applied to close the gap (10) between the connection conductor (6) and the connection member (7), the closing force is applied ) Determining the bonding basic force component in the contact time (t 1 ) ) And a sum of the bond displacement force components.
  13. 13. The method according to claim 8, wherein the bonding force is calculated from one aspect ) And on the other hand the supporting force determined for the contact moment (t 1 ) ) And/or closing force ) Determining a process force acting during the production of an ultrasonic connection between the connection conductor (6) and the connection component (7) )。
  14. 14. The method of claim 13, wherein the process force is ± ) Determining the bonding force as [ ] ) And said closing force ) Is a difference in (c).
  15. 15. A method according to claim 1 or 2, characterized in that the relative position is detected by measuring techniques ) And/or the movement position (z).
  16. 16. Method according to claim 1 or 2, characterized in that the ultrasonic wave generating means (3) are activated after the contact moment (t 1 ) and the ultrasonic tool (4) is excited to vibrate ultrasonically.
  17. 17. Use of a method according to any one of claims 1 to 16 for electrically conductively connecting a load current connection conductor (6) with a connection region (8) of a power electronics structure assembly as connection member (7).

Description

Method for operating an ultrasonic connection device Technical Field The invention relates to a method for operating an ultrasonic connection device and to the use of the method for electrically contacting components of a power electronics. Background The known methods for connecting electrically conductive components by means of ultrasound often provide that the components to be connected are placed against one another and pressed against one another. At least one component is then excited to vibrate in the ultrasonic range by means of an ultrasonic tool, so that a material-locking connection is formed between the components. The quality and quality of the electrical connection established in this way is determined here decisively by the vibration parameters, in particular the frequency and the vibration amplitude, and the process forces with which the components are pressed against one another when the connection is established. Depending on the nature and configuration of the components and the connection assembly provided for establishing an electrically conductive connection of the components, the components to be connected do not first directly lie against one another or have contact. As long as, for example, a connection conductor, in particular a load current connection conductor which is formed with a relatively thick cross section, has to be connected to the power electronics structure assembly, the connection conductor is first positioned above the connection region of the power electronics component. In this case, a gap of unknown size is typically formed between the connection conductor and the connection region due to the manufacturing tolerance value. The connecting conductor is pressed against the connecting surface of the connecting region by the ultrasonic tool only when the ultrasonic tool is lowered and is elastically deformed in this case. Therefore, a part of the bonding force applied by the ultrasonic tool is necessary in order to still deform the connection conductor before the material-locking connection is produced. In order to ensure that the ultrasound connection is produced reliably in a short time and with a constant high quality, it is important to know and monitor the process parameters accurately. In order to be able to determine the process time of, for example, an ultrasound action, it is necessary to know when the gap between the connection conductor and the connection region is closed and when the two components are in contact with each other. Furthermore, knowledge of the time profile of the process forces acting between the components enables an influence on the connection process and the connection process to be monitored in such a way that the quality or quality of the ultrasound connection can be deduced from the process parameters. Disclosure of Invention The object of the present invention is therefore to provide an improved operating method for an ultrasonic connection device. In order to solve this object, the invention proposes a method for operating an ultrasonic connection device, wherein the ultrasonic connection device is provided with an ultrasonic head movable in the z-direction, which ultrasonic head is provided with a carrier, an ultrasonic generating device which is held on the carrier movably relative to the carrier, and an ultrasonic tool which can be excited by the ultrasonic generating device to vibrate ultrasonically, the method comprising the following steps: the electrically conductive connecting conductor is positioned above the electrically conductive connecting region provided on the connecting component, such that a gap having a gap dimension determined in the z-direction is formed between the connecting conductor and a connecting surface of the connecting region facing the connecting conductor, Positioning the ultrasonic head relative to the connection conductor and the connection member such that a contact surface of the ultrasonic tool configured to bear against the connection conductor faces the connection conductor, Loading the ultrasonic wave generating means with a bonding force acting in the z-direction and pressing it against the support, Then -Lowering the ultrasound head in the z-direction and determining the position of movement of the ultrasound head in the z-direction and the determined relative position of the ultrasound generating means with respect to the support in the z-direction, and -Determining a contact moment in consideration of the movement position and the relative position, at which the connection conductor is lowered by the ultrasonic tool to such an extent that it contacts the connection region of the connection member. A method for operating an ultrasonic connection device provided with an ultrasonic head movable in the z-direction, the ultrasonic head being provided with a carrier, an ultrasonic-wave generating device held on the carrier movably relative to the carrier, and an ultrasonic tool which can be excit