CN-116888233-B - Adhesive, rotating electrical machine, electronic component, and aircraft

Abstract

An epoxy resin matrix adhesive is composed of an epoxy resin compound having an allyl group with a functionality of 2 or more as a main agent and an amine-based curing agent having a bisphenol A-type resin skeleton, and a stress-relieving adhesive (101) is composed such that at least one of an ethylene-acrylic acid copolymer and an ethylene-propylene copolymer having an average particle diameter of 10 [ mu ] m or less is contained in a range of 20wt% or less with respect to the matrix adhesive as a stress-relieving agent.

Inventors

• KAMO YOSHIYUKI

Assignees

• 三菱电机株式会社

Dates

Publication Date

20260508

Application Date

20210315

Claims (7)

1. 1. An adhesive agent for the production of a plastic film, An epoxy resin compound having an allyl group having 2 or more functions is used as a main agent, An epoxy resin matrix adhesive is formed by using an amine curing agent having a bisphenol A resin skeleton, At least one of an ethylene-acrylic acid copolymer and an ethylene-propylene copolymer having an average particle diameter of 10 μm or less is contained as a stress-relieving agent in a range of 20wt% or less with respect to the base adhesive.
2. 2. The adhesive according to claim 1, wherein, In the case where the stress-relieving agent is an ethylene-acrylic acid copolymer, at least 1 selected from the group consisting of ethylene dimethacrylate, hexamethylene diacrylate, tetramethylene dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate and 1, 3-butylene glycol diacrylate, In the case where the stress-relieving agent is an ethylene-propylene copolymer, it is at least 1 selected from propylene glycol diacrylate, tripropylene glycol diacrylate, 2-hydroxypropyl methacrylate, dipropylene glycol diacrylate and tripropyl acrylate.
3. 3. The adhesive according to claim 1 or 2, wherein, The filler is contained in a proportion of 20wt% or more and 85wt% or less with respect to the matrix binder.
4. 4. The adhesive according to claim 3, wherein, The filler is at least 1 selected from glass, mineral species composed of silicate, engineering polymer materials, ceramics, silver and carbon.
5. 5. A rotary electric machine having constituent members bonded by the adhesive according to any one of claims 1 to 4.
6. 6. An electronic component having constituent members bonded by the adhesive according to any one of claims 1 to 4.
7. 7. An aircraft having constituent members bonded by the adhesive according to any one of claims 1 to 4.

Description

Adhesive, rotating electrical machine, electronic component, and aircraft Technical Field The present application relates to an adhesive, a rotating electrical machine, an electronic component, and an aircraft. Background In general, if an adhesive having high heat resistance is cured, the adhesive becomes brittle, and there is a problem that the adhesive strength is not high. Further, if thermal stress is applied due to temperature cycle or the like, there is a problem that the adhesion is reduced to generate cracks or the adherend is peeled off. Even epoxy resin adhesives having heat resistance, which is known as heat resistance, have only about 180 ℃, but in recent years, adhesives having heat resistance exceeding 200 ℃ have come into the market. In contrast, for use in automobile members and the like, an epoxy resin adhesive is disclosed which has excellent heat resistance and combines both of overlap shear adhesion strength and peel strength (for example, see patent document 1). Further, a cured product composition having a high glass transition temperature, that is, high heat resistance and excellent adhesion, and effective for an adhesive is disclosed (for example, refer to patent document 2). Patent document 1 Japanese patent No. 6612498 Patent document 2 International publication No. 2017/170881 Disclosure of Invention On the other hand, high-temperature heat resistance of driving members such as electronic materials and motors has been studied, and adhesives for bonding constituent members have been required to have higher heat resistance and stability against a wider environmental temperature change (temperature cycle). The epoxy resin adhesive described in patent document 1 constitutes a matrix containing at least 50 mass% of a liquid epoxy resin having 3 or more functional epoxy resins, and the core-shell toughening agent added as a stress relaxation agent also contains a substance having a low glass transition temperature Tg (-110 to-30 ℃), and therefore cannot be said to have a sufficient heat resistance, and it is not clear that the resin adhesive has a sufficient heat resistance (heat shock resistance) against temperature cycling. The cured product composition described in patent document 2 has high heat resistance for applications or permissions of various films for optical materials, display elements, electronic parts, and the like, which are objects of application, described in the literature (paragraph 0099). However, the glass transition temperature Tg is about 80 to 100 ℃ (Table 1 to Table 3), and it is not known that the glass transition temperature Tg has sufficiently high heat resistance, and the resistance to temperature cycle (thermal shock resistance) is not described. The present application has been made to solve the above problems, and an object thereof is to provide a stress-relieving adhesive which has high heat resistance and is resistant to stress even at the time of temperature cycling. The adhesive disclosed in the present application is an epoxy resin based matrix adhesive comprising an epoxy resin compound having an allyl group with a functionality of 2 or more as a main agent and an amine-based hardener having a bisphenol A-type resin skeleton, wherein at least one of an ethylene-acrylic acid copolymer and an ethylene-propylene copolymer having an average particle diameter of 10 [ mu ] m or less is contained in an amount of 20wt% or less with respect to the matrix adhesive as a stress-relaxing agent. ADVANTAGEOUS EFFECTS OF INVENTION According to the adhesive disclosed in the present application, in the combination of the adhesive of the base and the stress relaxation agent added to the adhesive, the young's modulus on the low temperature side can be reduced, and the glass transition temperature does not change, so that the adhesive is configured to have resistance so as to maintain high heat resistance of the base adhesive and alleviate stress at the time of temperature change, and by using the adhesive, the reliability of the bonded portion is improved. Drawings Fig. 1 is a schematic view showing a structure of a stress relaxation type adhesive according to embodiment 1. Fig. 2 is a diagram illustrating a method of evaluating the adhesive strength of the stress relaxation type adhesive according to embodiment 1. Fig. 3 is a diagram showing a relationship between the amount of the stress relaxation agent added and the adhesive strength of the stress relaxation adhesive according to embodiment 1. Fig. 4A is a schematic diagram showing a fracture mode after the shear test of fig. 2. Fig. 4B is a schematic diagram showing another fracture mode after the shear test of fig. 2. Fig. 5 is a graph showing the change in adhesive strength when different stress reducers are added to 3 kinds of base adhesives. Fig. 6 is a graph showing the temperature dependence of tan δ when the amount of the stress-alleviating agent added is changed in the stress-alleviating adhesive accordin