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CN-116914397-B - High-directivity multilayer dielectric substrate coupler

CN116914397BCN 116914397 BCN116914397 BCN 116914397BCN-116914397-B

Abstract

The invention discloses a high-directivity multilayer dielectric substrate coupler, which belongs to the technical field of electronics and comprises a dielectric substrate body, an external electrode and an internal conductor, wherein the dielectric substrate body is formed by superposing multilayer dielectric substrates, the external electrode comprises a port electrode and a grounding electrode, the internal conductor comprises a first transmission line, a second transmission line, a counteracting rod, a grounding strip and a conductor column, the two transmission lines are in a broadside coupling mode, the invention creatively provides a counteracting rod structure based on the traditional coupler, the counteracting rod is coupled with the second transmission line near a coupling port in parallel to generate a signal, the counteracting rod is coupled with the second transmission line near an isolation port in parallel to generate the signal, the signal is finally counteracted with the leaked signal in opposite phase, the isolation degree is effectively improved, the directivity is further improved, the grounding strip and the conductor column are used for adjusting the coupling degree by directly influencing the coupling window sizes of the first transmission line and the second transmission line, and the device miniaturization can be realized through the three-dimensional wiring of the multilayer dielectric substrate.

Inventors

  • HUANG YONG
  • CHEN AO
  • WANG XUCHANG
  • WANG XIAO
  • WANG DONGLIANG

Assignees

  • 苏州市博海元件电子科技有限公司

Dates

Publication Date
20260508
Application Date
20230717

Claims (7)

  1. 1. A high directivity multilayer dielectric substrate coupler is characterized by comprising a dielectric substrate body, an external electrode and an internal conductor; the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates; The external electrode is printed on the outer surface of the dielectric substrate body and comprises a grounding electrode and four port electrodes; the coupler is provided with four ports, namely an input port, a through port, a coupling port and an isolation port; The inner conductor comprises a counteracting rod, a first transmission line, a second transmission line and more than two grounding bars; the device comprises a dielectric substrate, a counter rod, a first transmission line, a second transmission line, more than two grounding bars, a plurality of groups of grounding bars, a plurality of counter rods and a plurality of counter rods, wherein the first transmission line and the second transmission line are respectively arranged on the two dielectric substrates of different layers; the two ends of the first transmission line are respectively connected with an input port and a through port of the coupler, the two ends of the second transmission line are respectively connected with a coupling port and an isolation port of the coupler, and the first transmission line and the second transmission line are in a broadside coupling mode; the counteracting rod is made of a conductor material, acts between the coupling port and the isolation port, and is used for counteracting the signal leaked by the isolation port, so that the directivity is improved; the two ends of each grounding strip are connected with the grounding electrode and are positioned between the first transmission line and the second transmission line for adjusting the coupling degree deviation of the coupler.
  2. 2. The high directivity multilayer dielectric substrate coupler of claim 1, wherein the dielectric substrate body is composed of a stack of dielectric substrates of different layer thicknesses.
  3. 3. The highly directional multi-layer dielectric substrate coupler of claim 1 wherein the distance between the first transmission line and the second transmission line is adjusted by adjusting the number of layers of the dielectric substrate.
  4. 4. The highly directional multi-layer dielectric substrate coupler of claim 1 wherein the distance of the cancellation lever from the second transmission line is less than the distance of the cancellation lever from the first transmission line.
  5. 5. The high directivity multilayer dielectric substrate coupler of claim 4, wherein the two ends of the cancellation lever are respectively an a end and a B end, wherein the distance between the a end and the isolation port is smaller than the distance between the a end and the coupling port, and the distance between the B end and the coupling port is smaller than the distance between the B end and the isolation port; the line segment at the end A of the counteracting rod is parallel to the line segment at the isolation port of the second transmission line and generates coupling, and the line segment at the end B of the counteracting rod is parallel to the line segment at the coupling port of the second transmission line and generates coupling.
  6. 6. The high directivity multilayer dielectric substrate coupler according to claim 1, wherein the size of the coupling window of the two transmission lines can be adjusted and the degree of coupling between the two transmission lines can be adjusted by changing the position and the line width of the grounding bar; Wherein the position of the grounding bars is the distance between every two adjacent grounding bars in each group of grounding bars or the distance between grounding bars in different groups.
  7. 7. The high directivity multilayer dielectric substrate coupler according to any one of claims 1-6, wherein the inner conductor further comprises at least one conductor post, the conductor posts are arranged in the thickness direction of the multilayer dielectric substrate, the grounding strips of different groups are connected by the conductor posts, and the conductor posts are used for enhancing the effect of the grounding strips.

Description

High-directivity multilayer dielectric substrate coupler Technical Field The invention belongs to the technical field of electronics, and particularly relates to a high-directivity multilayer dielectric substrate coupler. Background The coupler is an important passive device in the radio frequency circuit, is a non-equal power distribution device and has the main function of extracting a part of signals from the signal main channel. A good coupler not only requires small standing waves and low loss, but also has the characteristics of high directivity and the like, and the coupling degree meets the design index. As shown in fig. 1, the prototype circuit of the coupler is two transmission lines that are close to each other, and coupling occurs when the two transmission lines are close. The two transmission lines are respectively connected with the input port and the through port, the isolation port and the coupling port, and most of signals at the input end in the coupler flow into the through port, one part of signals are coupled to the coupling port, and the other part of signals leak to the isolation port. Although in theory the isolated port has no signal, the greater the amount of leakage, the worse the isolation due to signal leakage that is unavoidable through the effects of non-ideal factors such as coupling port and pass-through port reflections, transmission line bends, end vias, line radiation, etc. The directivity of the coupler is obtained by subtracting the coupling degree from the isolation degree, the traditional coupler generally adopts a coupling transmission line mode, and when a weak coupler is required to be designed, the isolation degree cannot be improved only by a method of repairing a prototype circuit, so that high directivity is difficult to realize. In addition, the miniaturization design of the microwave device has become a development trend, the layout design of the multi-layer dielectric substrate is an effective way for realizing the miniaturization design, and the transmission line or the reactance element can be integrated in three dimensions by the technology, so that the purpose of miniaturization is realized. Disclosure of Invention In view of the above, the present invention provides a high-directivity multi-layer dielectric substrate coupler, in which a part of signals of a coupling port are led out through a cancellation rod, and the led out signals and signals leaked from an isolation port are reversely cancelled, so that isolation is effectively improved, directivity of the low-directivity multi-layer dielectric substrate coupler is further improved, and miniaturization is realized through three-dimensional wiring of the multi-layer dielectric substrate. The invention is realized by the following technical scheme: A high directivity multilayer dielectric substrate coupler comprises a dielectric substrate body, an external electrode and an internal conductor; the dielectric substrate body is formed by overlapping a plurality of layers of dielectric substrates; The external electrode is printed on the outer surface of the dielectric substrate body and comprises a grounding electrode and four port electrodes; the coupler is provided with four ports, namely an input port, a through port, a coupling port and an isolation port; The inner conductor comprises a counteracting rod, a first transmission line, a second transmission line and more than two grounding bars; the device comprises a dielectric substrate, a counter rod, a first transmission line, a second transmission line, more than two grounding bars, a plurality of groups of grounding bars, a plurality of counter rods and a plurality of counter rods, wherein the first transmission line and the second transmission line are respectively arranged on the two dielectric substrates of different layers; the two ends of the first transmission line are respectively connected with an input port and a through port of the coupler, the two ends of the second transmission line are respectively connected with a coupling port and an isolation port of the coupler, and the first transmission line and the second transmission line are in a broadside coupling mode; the counteracting rod is made of a conductor material, acts between the coupling port and the isolation port, and is used for counteracting the signal leaked by the isolation port, so that the directivity is improved; the two ends of each grounding strip are connected with the grounding electrode and are positioned between the first transmission line and the second transmission line for adjusting the coupling degree deviation of the coupler. Furthermore, the dielectric substrate body is formed by overlapping a plurality of dielectric substrates with different layer thicknesses. Further, the distance between the two transmission lines is adjusted by adjusting the number of layers of the dielectric substrate. Further, the distance between the counteracting rod and the second tra