CN-116935076-B - Detection positioning method and system for silicon wafer alignment mark, electronic equipment and medium

CN116935076BCN 116935076 BCN116935076 BCN 116935076BCN-116935076-B

Abstract

The invention provides a detection positioning method of a silicon wafer alignment mark, which comprises the steps of firstly establishing a knowledge base, wherein the knowledge base is provided with first characteristic information of a first detection image of a plurality of known alignment marks, then obtaining second characteristic information of a second detection image of the alignment mark to be detected, carrying out similarity comparison on the first characteristic information and the second characteristic information item by item, and obtaining position information of the alignment mark to be detected on the silicon wafer according to the plurality of known alignment marks obtained by comparison, so as to accurately find the known alignment mark, and improve the detection positioning precision and efficiency of the alignment mark to be detected. Correspondingly, the invention also provides a detection and positioning system for the silicon wafer alignment mark, electronic equipment and a non-transitory computer readable storage medium.

Inventors

YI BING
LIU TAO
ZHOU XUCHAO
ZHANG JICHEN
LU YANG
GAO GUANYI
WANG JINGXIAN

Assignees

上海微电子装备（集团）股份有限公司

Dates

Publication Date: 20260508
Application Date: 20220331

Claims (20)

1. The detection and positioning method of the silicon wafer alignment mark is characterized by comprising the following steps of: providing a knowledge base, wherein the knowledge base is provided with first characteristic information of a first detection image of a plurality of known alignment marks, and the first characteristic information comprises pixel characteristic statistical information of the first detection image and pixel characteristic information of a region of interest where the known alignment marks are located in the first detection image; Providing a second detection image of the alignment mark to be detected, and acquiring second characteristic information of the second detection image, wherein the second characteristic information comprises pixel characteristic statistical information of the second detection image and pixel characteristic information of a region of interest where the alignment mark to be detected is located in the second detection image, and Performing similarity comparison on the first characteristic information and the second characteristic information item by item, and acquiring the position information of the alignment mark to be detected on a silicon wafer according to a plurality of known alignment marks obtained by comparison; the step of carrying out similarity comparison on the first characteristic information and the second characteristic information item by item and obtaining the position information of the alignment mark to be detected on the silicon wafer according to a plurality of known alignment marks obtained by comparison comprises the following steps: Comparing the pixel characteristic statistical information of the second detection image with the pixel characteristic statistical information of the first detection image of the known alignment mark one by one to obtain a plurality of candidate known alignment marks with confidence degrees of similarity larger than a first set value; comparing the pixel characteristic information of the region of interest of the alignment mark to be detected in the second detection image with the pixel characteristic information of the region of interest of the known alignment mark in the candidate first detection image of the known alignment mark one by one to obtain a plurality of preferred known alignment marks with similarity larger than a second set value, and And acquiring the position information of the alignment mark to be detected on the silicon wafer based on a plurality of preferred known alignment marks.
2. The method for detecting and positioning a silicon wafer alignment mark according to claim 1, wherein the first detection image and the second detection image have the same size.
3. The method for detecting and positioning the alignment mark of the silicon wafer according to claim 1 or 2, wherein the silicon wafer having the known alignment mark is photographed and the photographed image is taken as the first detection image, or the silicon wafer having the known alignment mark is photographed and a portion of the photographed image having the known alignment mark is taken as the first detection image.
4. A method for inspecting and positioning an alignment mark on a silicon wafer as claimed in claim 3, wherein the portion of the captured image having the known alignment mark is captured by manual sketching as the first inspection image.
5. The method for detecting and positioning the alignment mark of the silicon wafer according to claim 1 or 2, wherein the silicon wafer having the alignment mark to be detected is photographed and the photographed image is used as the second detection image, or the silicon wafer having the alignment mark to be detected is photographed and a part of the photographed image having the alignment mark to be detected is taken as the second detection image.
6. The method for detecting and locating a silicon wafer alignment mark according to claim 5, wherein a portion of the photographed image having the alignment mark to be detected is cut out as the second detection image using predetermined position information and size information, or a portion of the photographed image having the alignment mark to be detected is cut out as the second detection image using image pixel feature processing.
7. The method of claim 6, wherein the image pixel feature processing method comprises an image segmentation positioning method or an image symmetry calculation method.
8. The method for detecting and positioning a silicon wafer alignment mark according to claim 1, wherein the step of acquiring the first feature information comprises: Acquiring pixel characteristic statistical information of the first detection image; Acquiring position information and size information of a region of interest where the known alignment mark is located in the first detection image based on pixel characteristic statistical information of the first detection image, and Acquiring pixel characteristic information of an area of interest where the known alignment mark is located in the first detection image based on the position information and the size information of the area of interest where the known alignment mark is located in the first detection image; and/or the step of obtaining the second characteristic information comprises: acquiring pixel characteristic statistical information of the second detection image; acquiring position information and size information of an area of interest where the alignment mark to be detected is located in the second detection image based on pixel characteristic statistical information of the second detection image, and And acquiring pixel characteristic information of the region of interest where the alignment mark to be detected is located in the second detection image based on the position information and the size information of the region of interest where the alignment mark to be detected is located in the second detection image.
9. The method for detecting and positioning a silicon wafer alignment mark according to claim 8, wherein the pixel characteristic statistical information is used for representing gray-scale projection signals in at least two directions, and the pixel characteristic statistical information of the first detection image and/or the second detection image is obtained by using an image gray-scale projection method.
10. The method for detecting and positioning a silicon wafer alignment mark according to claim 9, wherein the gray projection signal is subjected to autocorrelation calculation to obtain position information of the region of interest, size information of the region of interest is obtained based on the positions of peaks and troughs of the gray projection signal, or the gray projection signal is processed by using an image pixel feature processing method to obtain the position information and the size information of the region of interest.
11. The method for detecting and locating a silicon wafer alignment mark as recited in claim 10, wherein said image pixel feature processing method comprises an image segmentation locating method or an image symmetry calculating method.
12. The method of claim 9, wherein the neighborhood pixel feature calculation is performed on each pixel of the first inspection image before the pixel feature statistics of the first inspection image are obtained, and/or the neighborhood pixel feature calculation is performed on each pixel of the second inspection image before the pixel feature statistics of the second inspection image are obtained.
13. The method for detecting and locating a silicon wafer alignment mark according to claim 12, wherein the neighborhood pixel feature calculation comprises in-neighborhood pixel mean calculation, pixel weighted mean calculation, pixel gradient calculation, or pixel extremum range calculation.
14. The method of claim 1, wherein the knowledge base classifies the known alignment marks into at least two categories based on pixel feature statistics of the first inspection image and obtains center pixel feature statistics of the first inspection image for all the known alignment marks in each category, and And when the pixel characteristic statistical information of the second detection image is compared with the pixel characteristic statistical information of the first detection image of the known alignment mark one by one in a similarity mode, the pixel characteristic statistical information of the second detection image is compared with the central pixel characteristic statistical information of each category in a similarity mode, a plurality of candidate categories with the confidence degree of similarity larger than a third set value are obtained, and all the known alignment marks in the candidate categories are used as the known alignment marks of the candidates.
15. The method for detecting and positioning a silicon wafer alignment mark according to claim 1 or 14, wherein the pixel characteristic statistical information of the second detection image is compared with the pixel characteristic statistical information of the first detection image of the known alignment mark one by using a phase correlation method or a template matching search method based on fast fourier transform.
16. The method of detecting and locating silicon wafer alignment marks as set forth in claim 1 wherein after obtaining a plurality of said known alignment marks of a candidate, performing a cross-correlation calculation on pixel characteristic statistics of said second detection image and pixel characteristic statistics of a first detection image of said known alignment marks of a candidate one by one to obtain said known alignment marks of a best candidate from said known alignment marks of a candidate, and And carrying out similarity comparison on the pixel characteristic information of the region of interest where the alignment mark to be detected is located in the second detection image and the pixel characteristic information of the region of interest where the known alignment mark is located in the first detection image of the best candidate known alignment mark, so as to obtain the preferred known alignment mark.
17. The method of claim 14, wherein after obtaining a plurality of candidate classes, performing a cross-correlation calculation on the pixel characteristic statistics of the second detection image and the central pixel characteristic statistics of the candidate classes one by one to obtain a best candidate class from the candidate classes, and And carrying out similarity comparison on the pixel characteristic information of the region of interest where the alignment mark to be detected is located in the second detection image and the pixel characteristic information of the region of interest where all the known alignment marks are located in the best candidate category, so as to obtain the preferred known alignment mark.
18. The method for detecting and positioning a silicon wafer alignment mark according to claim 1 or 14, wherein the pixel characteristic information comprises one or more of a whole pixel value, geometric characteristic information and gray characteristic information of a rectangular region, and the geometric characteristic information comprises gradient information and/or edge information of the rectangular region.
19. The method for detecting and positioning alignment marks of silicon wafers according to claim 18, wherein the pixel characteristic information of the region of interest where the alignment mark to be detected is located in the second detection image is compared with the pixel characteristic information of the region of interest where the known alignment mark is located in the first detection image of the known alignment mark candidate one by using a pixel gray scale template alignment method and/or a geometric template alignment method.
20. The method for detecting and positioning a silicon wafer alignment mark according to claim 19, wherein the pixel gray scale template alignment method comprises a standard optical flow method or an inverse synthetic image alignment algorithm.

Description

Detection positioning method and system for silicon wafer alignment mark, electronic equipment and medium Technical Field The present invention relates to the field of semiconductor manufacturing technologies, and in particular, to a method, a system, an electronic device, and a medium for detecting and positioning a silicon wafer alignment mark. Background Currently, the position of an alignment mark on a silicon wafer needs to be obtained during the detection alignment process after the ADI (after develop inspection, post-development inspection) process or the CMP (CHEMICAL MECHANICAL polishing) process. The reflectivity of the alignment mark in the silicon wafer is low, the alignment mark is easy to be interfered by pattern reflection or scattering signals, the error rate of the existing detection positioning method of the silicon wafer alignment mark is high, the alignment precision can be influenced, and the detection efficiency is low. Disclosure of Invention The invention aims to provide a method, a system, electronic equipment and a medium for detecting and positioning a silicon wafer alignment mark, which are used for solving the problems of high error rate, low efficiency and the like of the existing method for detecting and positioning the silicon wafer alignment mark. In order to achieve the above purpose, the present invention provides a method for detecting and positioning a silicon wafer alignment mark, comprising: providing a knowledge base, wherein the knowledge base is provided with first characteristic information of a first detection image of a plurality of known alignment marks, and the first characteristic information comprises pixel characteristic statistical information of the first detection image and pixel characteristic information of a region of interest where the known alignment marks are located in the first detection image; Providing a second detection image of the alignment mark to be detected, acquiring second characteristic information of the second detection image, wherein the second characteristic information comprises pixel characteristic statistical information of the second detection image and pixel characteristic information of a region of interest where the alignment mark to be detected is located in the second detection image, and And carrying out similarity comparison on the first characteristic information and the second characteristic information item by item, and acquiring the position information of the alignment mark to be detected on the silicon wafer according to a plurality of known alignment marks obtained by comparison. Optionally, the first detection image and the second detection image have the same size. Optionally, photographing the silicon wafer with the known alignment mark and taking the photographed image as the first detection image, or photographing the silicon wafer with the known alignment mark and taking the part with the known alignment mark in the photographed image as the first detection image. Optionally, a part with the known alignment mark in the photographed image is taken as the first detection image by adopting a manual sketching mode. Optionally, photographing the silicon wafer with the alignment mark to be detected and taking the photographed image as the second detection image, or photographing the silicon wafer with the alignment mark to be detected and taking the part with the alignment mark to be detected in the photographed image as the second detection image. Optionally, the part with the alignment mark to be detected in the shot image is cut out by using the preset position information and the preset size information to be used as the second detection image, or the part with the alignment mark to be detected in the shot image is cut out by using an image pixel characteristic processing method to be used as the second detection image. Optionally, the image pixel feature processing method comprises an image segmentation positioning method or an image symmetry calculation method. Optionally, the step of acquiring the first feature information includes: Acquiring pixel characteristic statistical information of the first detection image; Acquiring position information and size information of a region of interest where the known alignment mark is located in the first detection image based on pixel characteristic statistical information of the first detection image, and Acquiring pixel characteristic information of an area of interest where the known alignment mark is located in the first detection image based on the position information and the size information of the area of interest where the known alignment mark is located in the first detection image; and/or the step of obtaining the second characteristic information comprises: acquiring pixel characteristic statistical information of the second detection image; acquiring position information and size information of an area of interest where the alignment mark to be detected i