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CN-116940078-B - Electronic equipment

CN116940078BCN 116940078 BCN116940078 BCN 116940078BCN-116940078-B

Abstract

The embodiment of the application discloses electronic equipment, which comprises a first shell, a second shell, a hinge assembly and a liquid cooling assembly, wherein the first shell and the second shell are rotationally connected through the hinge assembly so as to enable the electronic equipment to be switched between an unfolding state and a folding state, the liquid cooling assembly comprises a cooling pipeline and a first liquid bag which are mutually communicated, the cooling pipeline is arranged on the first shell or the second shell, the first liquid bag is connected with the hinge assembly, and in the process that the first shell and the second shell relatively rotate, the hinge assembly extrudes the first liquid bag so as to enable liquid in the cooling pipeline to circularly flow.

Inventors

  • LI YUHONG
  • HE JIN
  • SU QIAN
  • ZHOU PAN

Assignees

  • 维沃移动通信有限公司

Dates

Publication Date
20260512
Application Date
20230727

Claims (11)

  1. 1. An electronic device is characterized by comprising a first shell, a second shell, a hinge assembly and a liquid cooling assembly; The first shell and the second shell are rotationally connected through the hinge assembly so as to enable the electronic equipment to be switched between an unfolding state and a folding state; The liquid cooling assembly comprises a cooling pipeline and a first liquid bag which are communicated with each other, the first liquid bag comprises a first port and a second port, the first port and the second port are both connected to the cooling pipeline, the cooling pipeline is arranged in the first shell or the second shell, and the first liquid bag is connected with the hinge assembly; The electronic device further comprises a pushing member which is in sliding connection with the hinge assembly, and the pushing member slides relative to the hinge assembly and presses the first liquid sac to enable liquid in the cooling pipeline to circularly flow in the process of switching the electronic device between the unfolded state and the folded state.
  2. 2. The electronic device of claim 1, wherein the hinge assembly has a fixed slot, the first fluid bladder being disposed within the fixed slot; the pushing piece is at least partially positioned in the fixing groove.
  3. 3. The electronic device of claim 2, wherein the hinge assembly comprises a base and rotating assemblies rotatably connected to two sides of the base, the rotating assemblies comprise a swing arm and a bracket, the swing arm is rotatably connected with the base, the bracket is slidably connected with the swing arm, and the first shell and the second shell are respectively connected with the brackets on two sides of the base; the fixing groove is arranged on the bracket; The pushing piece comprises a pushing plate and a pushing rod connected with the pushing plate, and the pushing plate forms the side wall of the fixed groove; The swing arm is provided with a protruding portion, and the protruding portion pushes the push plate to move so as to squeeze the first liquid bag along with the movement of the swing arm.
  4. 4. The electronic device of claim 2, wherein liquid within the first bladder flows out through the second port with the pushing member pressing the first bladder; With the pushing member releasing the first liquid bladder, liquid in the cooling conduit flows back into the first liquid bladder through the first port.
  5. 5. The electronic device according to claim 4, wherein a first check valve is provided at a connection position of the first port and the cooling pipe, or a second check valve is provided at a connection position of the second port and the cooling pipe.
  6. 6. The electronic device of claim 4, wherein the liquid cooling assembly further comprises a second liquid bladder disposed on the cooling conduit, and wherein the second liquid bladder is in communication with the first liquid bladder through the cooling conduit; when the pushing piece presses the first liquid bag, liquid in the first liquid bag flows into the second liquid bag through the cooling pipeline.
  7. 7. The electronic device of claim 6, wherein the liquid cooling assembly further comprises a temperature controlled switch comprising a spring and a driver; The elastic sheet presses the cooling pipeline, the elastic sheet is connected with the driving piece, and the driving piece can deform and is used for driving the elastic sheet to be far away from the cooling pipeline.
  8. 8. The electronic device of claim 7, wherein at least a portion of the cooling conduit segment is in contact with a circuit board of the electronic device, the circuit board having a heating element disposed thereon; the temperature control switch is arranged on the circuit board, wherein the first end of the elastic sheet is fixed on the circuit board, and the second end of the elastic sheet is connected with the driving piece.
  9. 9. The electronic device of claim 8, wherein the circuit board is provided with a recess, and the driver is at least partially embedded in the recess.
  10. 10. The electronic device according to claim 3, wherein an elastic member is provided between the holder and the push plate, and one end of the elastic member is connected to the holder and the other end is connected to the push plate.
  11. 11. The electronic device of claim 10, wherein the elastic element is a spring, the first fluid bladder is in a contracted state after the push plate presses the first fluid bladder, and the push plate is reset under the action of the elastic element.

Description

Electronic equipment Technical Field The application belongs to the technical field of mobile terminals, and particularly relates to electronic equipment. Background The existing folding electronic equipment is high in configuration, and the high configuration brings about performance improvement and more heating value. In a folding electronic device, if heat of a functional device is not timely transferred, performance of the electronic device is reduced. When the electronic equipment is scalded, the experience of holding the electronic equipment is directly affected, and the potential safety hazard of a battery can be brought by the high temperature of the electronic equipment. In the related art, the main stream of heat dissipation method is to use solid heat conduction such as graphene, a VC vapor chamber, a heat pipe, and the like, and the heat dissipation principle is mainly to conduct heat from a device with serious heat generation such as a CPU to the whole electronic equipment, and then to dissipate the heat through air. But the speed at which solids transfer heat is slow, and the ability to lower the temperature of the entire electronic device is limited. Disclosure of Invention The application aims to provide electronic equipment, which solves the problem of low heat dissipation performance of the existing folding electronic equipment. In order to solve the technical problems, the application is realized as follows: The embodiment of the application provides electronic equipment. The electronic device comprises a first shell, a second shell, a hinge assembly and a liquid cooling assembly; The first shell and the second shell are rotationally connected through the hinge assembly so as to enable the electronic equipment to be switched between an unfolding state and a folding state; the liquid cooling assembly comprises a cooling pipeline and a first liquid bag which are communicated with each other, the cooling pipeline is arranged on the first shell or the second shell, and the first liquid bag is connected with the hinge assembly; during relative rotation of the first and second housings, the hinge assembly squeezes the first bladder to circulate the liquid in the cooling conduit. According to the electronic equipment provided by the embodiment of the application, the liquid cooling component is added in the electronic equipment, so that heat in the electronic equipment can be transferred to liquid in the cooling pipeline, and the heat is taken away through liquid circulation, so that the liquid cooling has higher heat capacity, higher heat conduction coefficient and higher heat conduction efficiency, better heat dissipation performance can be provided, and the hinge component can be used as a driving source to drive the liquid cooling component to work when the electronic equipment is switched between the folded state and the unfolded state, so that the driving mode is simple, and the power source is not required to be reintroduced. The scheme provided by the embodiment of the application improves the heat radiation capability of the electronic equipment, can enable the electronic equipment to work at a proper temperature, and ensures stable performance and good use experience of the electronic equipment during working. Drawings The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which: fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application; fig. 2 is a partially exploded schematic view of an electronic device according to an embodiment of the present application; FIG. 3 is one of the assembly diagrams of the heat dissipation mechanism and the hinge assembly provided in accordance with an embodiment of the present application; FIG. 4 is a second assembly view of a heat dissipating mechanism and a hinge assembly according to an embodiment of the present application; FIG. 5 is a schematic view of a power bladder according to an embodiment of the present application; FIG. 6 is a schematic diagram of a power bladder and an energy storage bladder in different states provided in accordance with an embodiment of the present application; FIG. 7 is a schematic diagram of a closed state of a temperature controlled switch provided according to an embodiment of the present application; FIG. 8 is a schematic diagram of an open state of a temperature controlled switch provided according to an embodiment of the present application; fig. 9 is a schematic workflow diagram of a heat dissipation mechanism according to an embodiment of the present application. Reference numerals: 1. a first housing; 2, a second shell, 3, a hinge assembly, 4, a pushing piece, 5, a liquid cooling assembly, 6, a circuit board, 7, and an elastic element; 31. Base 32, swing arm 321, protruding part 33, b