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CN-116964152-B - Polyamide resin composition and polyamide molded body

CN116964152BCN 116964152 BCN116964152 BCN 116964152BCN-116964152-B

Abstract

The invention provides a polyamide resin composition, which can inhibit the tensile strength from being reduced due to the addition of a copper-based heat stabilizer at high temperature and can maintain the preset tensile strength for a longer time under the high-temperature environment. The polyamide resin composition contains a polyamide resin and a copper-based heat stabilizer. The polyamide resin comprises a component unit (a) derived from a dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid, and a component unit (b 2) derived from 1, 3-bis (aminomethyl) cyclohexane which is 10 mol% or more and less than 50 mol% relative to the total mole number of the component units (b) derived from a diamine. The copper content of the copper stabilizer is 0.001 to 0.050 parts by mass based on 100 total parts by mass of the polyamide resin.

Inventors

  • DOI HARUKA
  • Mu Kouhang
  • NISHINO KOHEI
  • Iwao Isao

Assignees

  • 三井化学株式会社

Dates

Publication Date
20260505
Application Date
20220316
Priority Date
20210318

Claims (10)

  1. 1. A polyamide resin composition comprising a polyamide resin and a copper-based heat stabilizer, The polyamide resin comprises a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The dicarboxylic acid-derived component unit (a) comprises a component unit derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid, The diamine-derived constituent unit (b) comprises: A component unit (b 1) derived from an alkylene diamine having 4 to 18 carbon atoms in an amount of more than 50 mol% and 90 mol% or less based on the total mole number of the component unit (b) derived from a diamine, and A component unit (b 2) derived from 1, 3-bis (aminomethyl) cyclohexane in an amount of 10 mol% or more and less than 50 mol% based on the total mole number of the component units (b) derived from diamine, The copper content of the copper-based heat stabilizer is 0.001 to 0.050 parts by mass relative to 100 parts by mass of the polyamide resin contained in the polyamide resin composition.
  2. 2. The polyamide resin composition according to claim 1, comprising 1 to 300 parts by mass of glass fiber containing a surface treatment agent having an acidic group, relative to 100 parts by mass of the polyamide resin contained in the polyamide resin composition.
  3. 3. The polyamide resin composition according to claim 2, wherein the acidic group is a carboxyl group, an acid anhydride group or an ester group.
  4. 4. The polyamide resin composition according to any one of claims 1 to 3, wherein the polyamide resin comprises 15 mol% or more and less than 45 mol% of the constituent unit (b 2) derived from 1, 3-bis (aminomethyl) cyclohexane based on the total mole number of the constituent units (b) derived from diamine.
  5. 5. The polyamide resin composition according to any one of claims 1 to 3, wherein the constituent unit (b 1) derived from an alkylene diamine having 4 to 18 carbon atoms comprises constituent units derived from a linear alkylene diamine or a branched alkylene diamine.
  6. 6. The polyamide resin composition according to claim 5, wherein the linear or branched alkylene diamine is a diamine selected from the group consisting of 1, 4-diaminobutane, 1, 6-diaminohexane, 1, 9-nonanediamine, 1, 10-decanediamine, 2-methyl-1, 5-pentanediamine and 2-methyl-1, 8-octanediamine.
  7. 7. The polyamide resin composition according to any one of claims 1 to 3, wherein the aromatic dicarboxylic acid or alicyclic dicarboxylic acid is terephthalic acid, naphthalenedicarboxylic acid or cyclohexanedicarboxylic acid.
  8. 8. The polyamide resin composition according to any one of claims 1 to 3, which is a resin composition for vehicle-mounted members.
  9. 9. A polyamide molded article comprising the polyamide resin composition according to any one of claims 1 to 8.
  10. 10. The polyamide molded body according to claim 9, which is a vehicle-mounted member.

Description

Polyamide resin composition and polyamide molded body Technical Field The present invention relates to a polyamide resin composition and a polyamide molded body. Background Polyamide resin compositions have been widely used as materials for various parts such as clothing, industrial materials, automobiles, electric/electronic and industrial parts because of their excellent moldability, mechanical properties and chemical resistance. In order to exhibit characteristics corresponding to respective uses, various additives are added to the polyamide resin composition for these uses. For example, it is known to add a copper-based heat stabilizer in order to improve the heat aging resistance and the like of a polyamide resin composition. For example, patent document 1 describes that the time required for heat treatment at 180 ℃ until the tensile strength is halved is prolonged to several hundred hours by adding a copper-based heat stabilizer. Further, attempts have been made to change the raw material of the polyamide resin so as to change the physical properties of the polyamide resin. For example, patent documents 2 and 3 describe a polyamide resin using 1, 3-bis (aminomethyl) cyclohexane as a diamine component for producing a polyamide by polycondensing a diamine component with a dicarboxylic acid component. Patent document 2 describes that the polyamide resin described in the document has high transparency, and patent document 3 describes that the polyamide resin described in the document has high glass transition point and improved crystallization ability. In addition, it is also known to blend a reinforcing material such as glass fiber for improving the impact resistance and rigidity of the polyamide resin composition. The glass fibers may be treated with a sizing agent or a surface treatment agent for the purpose of improving dispersibility in polyamide resins. For example, patent document 1 discloses a glass fiber sizing agent comprising a copolymer compound obtained by copolymerizing 20 to 60 mass% of an unsaturated dicarboxylic acid or carboxylic anhydride, 20 to 75 mass% of methyl acrylate and 5 to 20 mass% of methyl methacrylate, an aminosilane, and a polyurethane resin, wherein the glass fiber sizing agent has a weight average molecular weight of 10000 to 60000. Patent document 1 describes that the sizing agent can improve the mechanical strength (in particular, the tensile strength) of a polyamide resin to which glass fibers are added. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. H06-032979 Patent document 2 Japanese patent laid-open No. 49-55796 Patent document 3 Japanese patent application laid-open No. 2017-75303 Patent document 4 Japanese patent application laid-open No. 2014-231452 Disclosure of Invention Problems to be solved by the invention As described in patent document 1, it is known that the heat aging resistance of a polyamide resin composition can be improved by a copper-based heat stabilizer. However, according to the new knowledge of the present inventors, there is a problem that the tensile strength of the polyamide resin composition itself is lowered due to the addition of the copper-based heat stabilizer. The above-mentioned problem of the decrease in tensile strength is particularly remarkable when a molded article of the polyamide resin composition is used under a high-temperature environment. In addition, in recent years, there has been an increasing demand for further improving the long-term heat resistance of polyamide resin compositions, and development of polyamide resin compositions capable of maintaining a predetermined tensile strength for a longer period of time under a high-temperature environment has been demanded. In view of these circumstances, an object of the present invention is to provide a polyamide resin composition capable of suppressing a decrease in tensile strength caused by addition of a copper-based heat stabilizer at a high temperature and maintaining a predetermined tensile strength for a longer period of time in a high-temperature environment, and a polyamide molded article comprising the polyamide resin composition. Means for solving the problems [1] A polyamide resin composition comprising a polyamide resin and a copper-based heat stabilizer, The polyamide resin is a polyamide resin comprising a component unit (a) derived from a dicarboxylic acid and a component unit (b) derived from a diamine, The dicarboxylic acid-derived component unit (a) includes a component unit derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid, The diamine-derived constituent unit (b) includes: a component unit (b 1) derived from an alkylene diamine having 4 to 18 carbon atoms in an amount of from more than 50 mol% to 90 mol% based on the total mole number of the component unit (b) derived from a diamine, and A component unit (b 2) derived from 1, 3-bis (aminomethyl) cyclohexane in an amount of 10 mol% or mor