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CN-117059513-B - Wafer chip mounter

CN117059513BCN 117059513 BCN117059513 BCN 117059513BCN-117059513-B

Abstract

The invention provides a wafer chip mounter, which comprises a chassis, a first packaging robot feeding system, a first dispensing and dispensing manipulator, a glue cleaning and discharging box, a glue dispensing mechanism, a first material robot feeding system, an intelligent height measuring system, a second dispensing manipulator, a material pressing and supporting and positioning mechanism, a third turret manipulator, a second material robot feeding system, a second packaging robot feeding system, a third packaging robot discharging system and an adhesive jig system, wherein the first packaging robot feeding system, the first dispensing and dispensing manipulator, the glue cleaning and discharging box, the first material robot feeding system, the intelligent height measuring system, the second dispensing and dispensing manipulator, the material pressing and supporting and positioning mechanism, the third turret manipulator, the second material robot feeding system, the second packaging robot feeding system and the third packaging robot discharging system are arranged on the chassis. The invention has the beneficial effects that the structure is scientific and reasonable, the use is safe and convenient, and compared with the traditional die bonder and chip mounter, the precision is greatly improved, and the materials are diversified. And the data tracing function can monitor and correct each item of data in real time in the production process of the product. The problem tracking is convenient, the operation is convenient, and operators can be on duty only through simple training.

Inventors

  • XIE WEIFENG
  • CHEN GUANHAI

Assignees

  • 深圳市卓兴先进封装技术有限公司

Dates

Publication Date
20260505
Application Date
20221102

Claims (10)

  1. 1. The wafer chip mounter is characterized by comprising a chassis (1), a first packaging robot feeding system (2), a first dispensing and dispensing manipulator (6), a glue cleaning and discharging box (19), a dispensing mechanism (5), a first material robot feeding system (17), an intelligent height measuring system (18), a second dispensing manipulator (7), a material pressing and supporting positioning mechanism (20), a third turret manipulator (16), a second material robot feeding system (21), a second packaging robot feeding system (3), a third packaging robot discharging system (4) and a bonding jig system (10) which are arranged on the chassis (1), The packaging first robot feeding system (2) is provided with a material storage box (2-5) for storing multiple boxes of materials, the packaging first robot feeding system (2) can replace the material storage box (2-5) according to the needs and send the materials to the first material robot feeding system (17), the materials are conveyed to the material pressing supporting and positioning mechanism (20) through the first material robot feeding system (17), after the materials are fixed by the material pressing supporting and positioning mechanism (20), the height is measured through the intelligent height measuring system (18), and the materials are accurately positioned through the first intelligent image system (22); The first dispensing glue manipulator (6) and the second dispensing glue manipulator (7) are connected with the dispensing glue mechanism (5), the first dispensing glue manipulator (6) and the second dispensing glue manipulator (7) drive the dispensing glue mechanism (5) to process the dispensing glue of the materials on the material pressing and supporting and positioning mechanism (20), the material pressing and supporting and positioning mechanism (20) returns the processed materials to the first material robot feeding system (17), the materials are conveyed to the second material robot feeding system (21) through the first material robot feeding system (17), the materials are conveyed to the bonding jig system (10) through the second material robot feeding system (21), the bonding jig system (10) fixes the materials, and the materials are accurately positioned through the second intelligent image system (9); The packaging second robot feeding system (3) conveys materials to be bonded from a storage material box to the position below a suction nozzle of a third turret manipulator (16) and accurately positions the materials through a third intelligent imaging system (12); the material sucked by the third turret manipulator (16) is transferred to the fourth intelligent imaging system (8) for accurate positioning, and the third turret manipulator (16) is transferred to the position right above the material fixed by the bonding jig system (10) to bond the material; The second material robot feeding system (21) conveys the bonded materials to the third robot discharging system (4), the third robot discharging system (4) stores the materials into the material boxes respectively, and the material boxes are conveyed to a discharging table of the third robot discharging system (4).
  2. 2. The wafer mounter according to claim 1, wherein said packaging first robot feeding system (2) includes a lifting assembly (2-1), a forward and backward moving assembly (2-2), a pushing assembly (2-3), a gripping assembly (2-4), a material storage box (2-5), a discharging table (2-6), a feeding table (2-7), and a feeding transfer assembly (2-8), said lifting assembly (2-1) is mounted on said forward and backward moving assembly (2-2), said pushing assembly (2-3) is mounted on said feeding table (2-7), said gripping assembly (2-4) is mounted on said lifting assembly (2-1), said material storage box (2-5) is placed on said feeding table (2-7), and is transferred to a material storage box (2-5) for taking position by means of a feeding transfer assembly (2-8), and transferred to a feeding system (17) by means of the lifting assembly (2-1), the gripping assembly (2-4) for transferring the material storage box (2-5) to the feeding system, the material is sent to the first material robot feeding system (17) from the material storage box (2-5) through the pushing component (2-3), and after the material in the material storage box (2-5) is sent, the material storage box (2-5) is sent to a discharging box placing position of the discharging table (2-6) through the lifting component (2-1), the front and back moving component (2-2) and the grabbing component (2-4).
  3. 3. The wafer mounter according to claim 1, wherein the first material robot feeding system (17) includes a track adjusting assembly (17-6), and a conveying assembly (17-1) mounted on the track adjusting assembly (17-6), a material waiting assembly (17-2), a material cover assembly (17-3), a material positioning assembly (17-4), and a material discharging and waiting assembly (17-5), when the material is transferred from the first robot feeding system (2) into the conveying assembly (17-1), the material waiting level transferred to the material waiting assembly (17-2) through the conveying assembly (17-1) is waited, the fine positioning of the material positioning assembly (17-4) is carried out through the conveying assembly (17-1), the material cover assembly (17-3) presses the material point painting glue, and after finishing the point painting glue, the material waiting level transferred to the material discharging and waiting assembly (17-5) through the conveying assembly (17-1) is waited for being transferred to the second material robot feeding system (21).
  4. 4. The wafer mounter according to claim 3, wherein the material pressing support positioning mechanism (20) comprises an adjustable fixing base (20-1), a precise cylinder sliding table (20-2) and three layers of adjustable material supporting plates (20-3), the three layers of adjustable material supporting plates (20-3) are installed on the precise cylinder sliding table (20-2), the precise cylinder sliding table (20-2) is installed on the adjustable fixing base (20-1), and fixing materials are pressed to a material cover assembly (17-3) for fixing positions through up-and-down movement of the precise cylinder sliding table (20-2).
  5. 5. The wafer mounter according to claim 1, wherein the first robot (6) comprises a first left and right rectilinear platform (6-1), a first front and rear rectilinear platform (6-2), and a first up and down rectilinear module (6-3), the first up and down rectilinear module (6-3) is mounted on the first front and rear rectilinear platform (6-2), the first front and rear rectilinear platform (6-2) is mounted on the first left and right rectilinear platform (6-1), the first front and rear rectilinear platform (6-2), and the first up and down rectilinear module (6-3) are capable of rectilinear motion to perform a three-dimensional space dispensing function, the second robot (7) comprises a second left and right rectilinear platform (7-1), a second front and rear rectilinear platform (7-2), a second up and down rectilinear module (7-3), the second up and down rectilinear module (7-3) is mounted on the second left and right rectilinear platform (7-2), the first left and right rectilinear platform (6-2), and the first up and down rectilinear module (6-3) are capable of rectilinear motion to perform a three-dimensional space dispensing function, the first left and the second robot (7) comprises the second left and right rectilinear platform (7-1), the second front and the second front rectilinear module (7-2), and the second up and down rectilinear module (7-3) are mounted on the second front and the second rectilinear platform (7-2) The second front-back linear platform (7-2) and the second upper-lower linear module (7-3) can perform linear motion to finish the glue dispensing function of the three-dimensional space.
  6. 6. The wafer mounter according to claim 5, wherein said stippling mechanism (5) comprises a left and right linear platform (5-1) and an upper and lower linear platform (5-2), said left and right linear platform (5-1) and said upper and lower linear platform (5-2) are mounted on said second upper and lower linear modules (7-3), and the relative positions of two stippling heads X, Z in two directions are determined by corresponding linear adjustment.
  7. 7. The wafer mounter according to claim 1, wherein said second material robot feeding system (21) includes a left and right rectilinear platform (21-1), a front and rear rectilinear platform (21-2) and an outfeed transfer assembly (21-3), said front and rear rectilinear platform (21-2) and outfeed transfer assembly (21-3) being mounted on said left and right rectilinear platform (21-1), material being transferred into said second material robot feeding system (21) by said first material robot feeding system (17), material being transferred into said bonding jig system (10) at a location thereof by said outfeed transfer assembly (21-3) in said second material robot feeding system (21), said bonding jig system (10) fixing material, material to be bonded being transferred to an outfeed level in said third robot outfeed system (4) by said outfeed transfer assembly (21-3).
  8. 8. The wafer mounter according to claim 1, wherein the third turret robot (16) includes a high-precision ZR assembly (16-1) with a fixed suction nozzle, a turntable assembly (16-2), a high-precision DD motor (16-3), and a gas-electric slip ring assembly (16-4), the high-precision ZR assembly (16-1) is mounted on the turntable assembly (16-2), the turntable assembly (16-2) is mounted on the high-precision DD motor (16-3), and the gas-electric slip ring assembly (16-4) is mounted on the high-precision DD motor (16-3) to provide electricity and gas for the high-precision ZR assembly (16-1) with a fixed suction nozzle.
  9. 9. The wafer mounter according to claim 1, wherein said second robot loading system (3) includes a wafer stage lifting/lowering unit (3-1), a wafer storage cassette (3-2), a wafer gripping/transferring unit (3-3), a wafer gripper unit (3-4), a front-rear moving unit (3-5), a left-right moving unit (3-6), a film-expanding rotation correcting unit (3-7), a raising/lowering unit (3-8), said wafer storage cassette (3-2) is stored on said wafer stage lifting/lowering unit (3-1), said wafer gripper unit (3-4) is mounted on said wafer gripping/transferring unit (3-3), said film-expanding rotation correcting unit (3-7) is mounted on said left-right moving unit (3-6), said left-right moving unit (3-6) is mounted on said front-rear moving unit (3-5), said raising/lowering unit (3-8) is fixed on said front-moving unit (3-5), and said wafer gripper unit (3-4) is lifted by said wafer gripper unit (3-3) to transfer the wafer stage (3-3) by lifting/lowering the wafer gripper unit (3-4), then the wafer is conveyed to a film expansion rotation correction component (3-7) for film expansion fixation, then the wafer is conveyed to the position below the suction nozzle through the left-right movement component (3-6) and the front-back movement component (3-5) for movement, and is accurately positioned and corrected through a third intelligent image system (12), and then the wafer is conveyed to the position right below the suction nozzle through the up-down movement component (3-8).
  10. 10. The wafer mounter according to claim 1, wherein the third robot discharging system (4) includes a discharging table (4-1), a lifting assembly (4-2), a front and rear moving assembly (4-3), a material blocking assembly (4-4), a feed transfer assembly (4-5), a feeding table (4-6), a material storage box (4-7), and a gripping assembly (4-8), the lifting assembly (4-2) is mounted on the front and rear moving assembly (4-3), the material blocking assembly (4-4) is mounted on the feeding table (4-6), the gripping assembly (4-8) is mounted on the lifting assembly (4-2), the material storage box (4-7) is loaded on the feeding table (4-6), the material storage box (4-7) is transferred to a material taking position by the feeding transfer assembly (4-5), the gripping assembly (4-8) is transferred to the material storage box (4-7) by the lifting assembly (4-2), and the gripping assembly (4-8) is carried into the material storage box (4-7) by the lifting assembly (4-2), and when the material storage box (4-7) is loaded in the third robot discharging system (4-2) and the material storage box (4-7) is loaded in the material storage box, the front and back moving component (4-3) and the grabbing component (4-8) convey the material storage box (4-7) to a discharging box placing position of the discharging table (4-1).

Description

Wafer chip mounter Technical Field The invention relates to the field of electronic industry packaging, in particular to a wafer chip mounter. Background The electronic industry is developed on the basis of development and application of electronic science and technology, and the development of the electronic industry is very fast in the 20 th century, and the integrated circuit is updated every three years almost due to improvement of production technology and improvement of processing technology, and mass production and use of large-scale integrated circuits and computers, optical fiber communication, digital communication, satellite communication technology, intelligent wearing and medical and aesthetic electronics are raised, so that the electronic industry is a rapidly rising high-technology industry. The development of the electronic industry and the wide application of the products thereof have profound effects on the military field. But the wafer chip mounter in the current market is complex in structure and single in function, the existing wafer chip mounter is mainly used for independently producing the spot painting glue by the spot painting glue device in a manual jig combination mode, the working strength is high, the spot painting glue precision is low, the glue is single, the productivity is low, the product has no data to trace back, the occupied area is large, more manual work is required, and the process cannot be integrated. The bonding of components is generally only one, and multiple devices or multiple times are needed to complete the bonding, so that the bonding is performed repeatedly, the process is greatly prolonged, and the precision is difficult to control. Disclosure of Invention The present invention is directed to a high-precision wafer mounter, so as to solve the problems set forth in the background art. The aim of the invention can be achieved by the following technical scheme: The wafer chip mounter comprises a case, a first packaging robot feeding system, a first dispensing and glue discharging manipulator, a glue cleaning and discharging box, a glue dispensing mechanism, a first material robot feeding system, an intelligent height measuring system, a second dispensing and glue discharging manipulator, a material pressing supporting and positioning mechanism, a third turret manipulator, a second material robot feeding system, a second packaging robot feeding system, a third packaging robot discharging system and a bonding jig system which are arranged on the case, The material storage box for storing the multi-box materials is arranged on the packaging first robot feeding system, the material storage box can be replaced according to the requirement, the materials are sent to the first material robot feeding system, the materials are sent to the material pressing supporting and positioning mechanism through the first material robot feeding system (17), after the materials are fixed by the material pressing supporting and positioning mechanism, the height is measured through the intelligent height measuring system, and the materials are accurately positioned through the first intelligent image system; The first dispensing and gluing mechanical arm and the second dispensing and gluing mechanical arm are connected with the dispensing and gluing mechanism, the first dispensing and gluing mechanical arm and the second dispensing and gluing mechanical arm drive the dispensing and gluing mechanism to process the dispensing and gluing of the materials on the material pressing, supporting and positioning mechanism, the material pressing, supporting and positioning mechanism is used for placing the processed materials back into the first material robot feeding system, the materials are conveyed into the second material robot feeding system through the first material robot feeding system, the materials are conveyed into the bonding jig system through the second material robot feeding system, the bonding jig system is used for fixing the materials, and the materials are accurately positioned through the second intelligent image system; packaging a second robot feeding system to convey materials to be bonded from a storage material box to the position below a suction nozzle of a third turret manipulator and accurately positioning a third-pass intelligent imaging system; Transferring the sucked materials of the third turret manipulator to a fourth intelligent image system for accurate positioning, transferring the third turret manipulator to the position right above the materials fixed by the bonding jig system, and bonding the materials; the second material robot feeding system conveys the bonded materials to the third packaging robot discharging system, the third packaging robot discharging system stores the materials into the material boxes respectively, and the material boxes are conveyed to the discharging tables of the three-robot discharging system. As a further improvement of the