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CN-117059544-B - Semiconductor processing device

CN117059544BCN 117059544 BCN117059544 BCN 117059544BCN-117059544-B

Abstract

The invention provides a semiconductor processing device which comprises a first chamber part, a second chamber part capable of moving between an open position and a closed position relative to the first chamber part, and a plurality of positioning mechanisms mounted on the first chamber part and/or the second chamber part, wherein each positioning mechanism comprises a positioning column and a driving mechanism for driving the positioning column to move between a positioning position and an initial position, the positioning column is provided with a positioning side surface perpendicular to the surface of a semiconductor wafer, and when the positioning column is positioned at the positioning position, the positioning side surface of the positioning column can position the edge of the semiconductor wafer. The semiconductor wafer can be centrally positioned by the mutual matching of the positioning sides of the positioning columns of the positioning mechanisms.

Inventors

  • WANG JI

Assignees

  • 无锡华瑛微电子技术有限公司

Dates

Publication Date
20260512
Application Date
20220506

Claims (8)

  1. 1. A semiconductor processing apparatus, comprising: A first chamber portion; A second chamber portion movable between an open position and a closed position with respect to the first chamber portion, wherein a micro chamber is formed between the first chamber portion and the second chamber portion when the second chamber portion is located at the closed position with respect to the first chamber portion, wherein a semiconductor wafer can be accommodated in the micro chamber, and wherein the semiconductor wafer can be taken out or put in when the second chamber portion is located at the open position with respect to the first chamber portion; A plurality of positioning mechanisms mounted on the first chamber portion and/or the second chamber portion, each positioning mechanism including a positioning column and a driving mechanism driving the positioning column to move between a positioning position and an initial position, the positioning column having a positioning side surface perpendicular to a surface of the semiconductor wafer, the positioning side surface of the positioning column being capable of positioning an edge of the semiconductor wafer when the positioning column is located at the positioning position, The driving mechanism drives the positioning column to move through air pressure, when the positioning column is positioned at the positioning position, the positioning column moves to the initial position through reducing the air pressure, when the positioning column is positioned at the initial position, the positioning column moves to the positioning position through increasing the air pressure, the positioning column is driven to move along a straight line, The semiconductor wafer is centrally positioned by the mutual matching of the positioning side surfaces of the positioning columns of the positioning mechanisms, The positioning column comprises a guide rod, a positioning head part positioned at one end of the guide rod and a limiting end part positioned at the other end of the guide rod, the positioning side surface of the positioning column is the outer side surface of the positioning head part, The positioning column further comprises a guide head positioned at the tail end of the positioning head, wherein the guide head is provided with an inclined guide surface, and the inclined guide surface guides the edge of the semiconductor wafer when the positioning column moves from an initial position to a positioning position.
  2. 2. A semiconductor processing apparatus according to claim 1, wherein the first chamber portion and/or the second chamber portion is provided with a plurality of positioning through holes, each positioning mechanism is mounted in a corresponding positioning through hole, Each positioning mechanism also comprises an air pipe joint arranged at the outer end of the positioning through hole and a sleeve pipe arranged in the positioning through hole and provided with a penetrating inner hole, the outer end of the air pipe joint is connected with an air pipe, the inner end of the air pipe joint is separated from the sleeve pipe by a preset distance, The guide rod of the positioning column is arranged in the inner hole of the sleeve in a sliding way, the limiting end part of the positioning column is limited to move between the sleeve and the tracheal joint, When the locating column is located the initial position, spacing tip of locating column with the inner contact of tracheal joint, the location head of locating column is retracted, when the locating column is located the locating position, spacing tip of locating column with sheathed tube one end contact, the location head of locating column stretches out for the location side of location head with semiconductor wafer is located same height, and then makes the location side of location head can be right the edge of semiconductor wafer is fixed a position.
  3. 3. The semiconductor processing apparatus of claim 2, wherein the spacing end, the guide rod and the positioning head are cylindrical, the outer diameter of the spacing end is larger than the inner diameter of the inner bore of the sleeve, the outer diameter of the positioning head is smaller than the outer diameter of the guide rod of the positioning column, When the positioning column is located at the initial position, the limiting end of the positioning column is tightly matched with the inner end of the air pipe joint to prevent air leakage, and when the positioning column is located at the positioning position, the limiting end of the positioning column is tightly matched with one end of the sleeve to prevent air leakage.
  4. 4. The semiconductor processing apparatus of claim 1, wherein the positioning columns of each positioning mechanism can be replaced with different or the same spacing distances between the positioning sides of the positioning columns and the central axes of the positioning columns before and after replacement, and accurate centering of the semiconductor wafer is achieved by selecting the positioning columns having the appropriate spacing distances.
  5. 5. The semiconductor processing apparatus according to any one of claims 1 to 4, wherein, The first chamber part is provided with a first channel, the second chamber part is provided with a second channel, when the second chamber part is positioned at the closed position relative to the first chamber part and the micro chamber is internally provided with a semiconductor wafer, the first channel and the second channel are communicated and form an edge micro-processing space together with the edge of the semiconductor wafer, the outer edge of the semiconductor wafer accommodated in the micro chamber stretches into the edge micro-processing space, the edge micro-processing space is communicated with the outside through an edge processing through hole, fluid enters or flows out of the edge micro-processing space through the edge processing through hole, The first chamber part is provided with a sealing joint part positioned outside the first channel, the second chamber part is provided with an joint groove corresponding to the sealing joint part, The first edge surface, the second edge surface, and the outer end bevel surface of the outer edge of the semiconductor wafer are exposed to the edge micro-processing space, one or more of the edge processing through holes serves as a fluid inlet, one or more of the edge processing through holes serves as a fluid outlet, The edge micro-processing space is annular or arc-shaped, the outer edge of the semiconductor wafer stretches into the edge micro-processing space, and the edge micro-processing space is a closed space and is communicated with the outside through an edge processing through hole; the inner sidewall portion top surface of the first channel abuts against a first edge surface of the semiconductor wafer adjacent the first chamber portion, and the inner sidewall portion top surface of the second channel abuts against a second edge surface of the semiconductor wafer adjacent the second chamber portion.
  6. 6. The semiconductor processing apparatus according to claim 5, wherein the first chamber portion further has a first recess formed in an inner wall surface of the first chamber portion facing the micro chamber, the first recess being located inside the first channel, the second chamber portion further has a second recess formed in an inner wall surface of the second chamber portion facing the micro chamber, the second recess being located inside the second channel, a partial region of a second edge surface of the semiconductor wafer covering a top of the second recess to form a second inner micro-space, a partial region of a first edge surface of the semiconductor wafer covering a top of the first recess to form a first inner micro-space, the first inner micro-space and the second inner micro-space being located inside the edge micro-processing space, the first chamber portion having a first recess surface communicating with a second through-hole communicating with the second chamber portion when the second chamber portion is located at the closed position with respect to the first chamber portion, The first concave part and the second concave part are annular or arc-shaped, and when the edge of the semiconductor wafer is corroded by utilizing the edge micro-processing space, liquid or gas is introduced into the first concave part and the second concave part so as to prevent the liquid in the edge micro-processing space from penetrating inwards.
  7. 7. The semiconductor processing apparatus according to claim 5, wherein the seal engaging portion includes an inner edge surface located on an inner side, and a tip end of the seal engaging portion protrudes into the engaging recess when the second chamber portion is located at the closed position with respect to the first chamber portion, a tip end portion of the inner edge surface thereof being in sealing engagement with a wall of the engaging recess, and an upper end portion of the inner edge surface thereof forming an outer side face of the edge micro-processing space.
  8. 8. The semiconductor processing apparatus according to claim 7, wherein a sealing surface of a distal end portion of an inner edge surface of the seal joint and a groove wall of the joint groove is located below the edge micro-processing space, and the sealing surface is perpendicular to an extending direction of the semiconductor wafer.

Description

Semiconductor processing device [ Field of technology ] The present invention relates to the field of processing semiconductor wafers, and more particularly, to a semiconductor processing apparatus. [ Background Art ] The precise edge etching process of semiconductor wafers is a challenging process. It is required to achieve accurate corrosion of the wafer edge micron level without damaging or contaminating the film of the remaining portion. In epitaxial wafer processing and advanced integrated circuit processing, wafer edge etching is an important step for ensuring film formation quality and improving chip yield. Referring to fig. 1a to 1d, fig. 1a is a schematic structural view of a semiconductor wafer 400, fig. 1b is a sectional view E-E of fig. 1a, fig. 1c is a partial sectional view of an outer edge of the semiconductor wafer before the outer edge treatment, and fig. 1d is a sectional view of an outer edge portion of the semiconductor wafer after the outer edge treatment. As shown in fig. 1a to 1d, the semiconductor wafer 400 includes a substrate layer 401 and a thin film layer 402 formed on a first edge surface and a second edge surface of the substrate layer 401. After the selective etching treatment for the first edge surface 404, the second wafer surface 406 and the outer end bevel 408 of the outer edge portion of the semiconductor wafer 400, the thin film layer 402 of the outer edge portion of the semiconductor wafer 400 is removed, and the first edge surface and the second edge surface of the base material layer 401 are exposed. Existing wafer edge etching equipment can be divided into two main types, namely dry method and wet method. The dry method is mainly divided into a plasma method and a polishing method. The plasma edge etching method has high equipment cost and complex method, and is mainly applied to the integrated circuit chip manufacturing process. The polishing method is to remove the contacted film by rotating the wafer and utilizing physical friction and chemical gas-liquid combination. The polishing method has lower equipment cost, but is easy to cause the damage and pollution of the reserved film part, and is mainly applied to the wafer manufacturing process below 200 mm. The wet method mainly comprises a film pasting method and a vacuum adsorption method. The film pasting method adopts pure and anti-corrosion plastic films such as PTFE, PE and the like to protect the part of the film to be reserved, and then the film is wholly exposed in a chemical corrosive gas environment or soaked in chemical corrosive liquid to corrode the exposed part. The film pasting method has a plurality of process steps and needs to be completed by using various equipment, wherein the equipment comprises film pasting, wet etching, cleaning, film removing and the like. The vacuum adsorption method uses a vacuum suction head to suck a wafer, the vacuum suction head has the function of sucking the wafer to protect the part of the film to be kept in the vacuum suction head, exposing the part of the film to be removed outside the vacuum suction head, and then soaking the vacuum suction head and the wafer together in a chemical etching solution to etch away the part of the film exposed outside the vacuum suction head. The vacuum adsorption method has simple process steps and lower equipment cost, but is easy to cause the damage and pollution of the reserved film part, and is mainly applied to the wafer manufacturing process below 200 mm. Chinese patent application number 201821459515.8, entitled "a semiconductor processing apparatus", discloses an edge processing scheme for semiconductor wafers. For this edge processing scheme, the accuracy of the centering of the semiconductor wafer is important, and if the centering is inaccurate, there is a large error in the result of the edge processing. In view of this, there is a need for an improved semiconductor processing apparatus that can improve the accuracy of the centering of the semiconductor wafer. [ Invention ] The invention aims to provide a semiconductor processing device which can flexibly and accurately adjust the position of a wafer and realize the accurate positioning of the wafer. In order to achieve the above object, according to a first aspect of the present invention, there is provided a semiconductor processing apparatus comprising a first chamber portion, a second chamber portion movable relative to the first chamber portion between an open position and a closed position, wherein a micro chamber is formed between the first chamber portion and the second chamber portion when the second chamber portion is located at the closed position relative to the first chamber portion, a semiconductor wafer is receivable in the micro chamber, the semiconductor wafer is capable of being taken out or put in when the second chamber portion is located at the open position relative to the first chamber portion, a plurality of positioning mechanisms mounted on the f