CN-117103479-B - Electroplated precious stone cutting saw blade and manufacturing process thereof

CN117103479BCN 117103479 BCN117103479 BCN 117103479BCN-117103479-B

Abstract

The invention relates to an electroplated precious stone cutting saw blade and a manufacturing process thereof, and belongs to the technical field of diamond cutting grinding tools. The diamond coating comprises a matrix with a serrated peripheral surface and a diamond layer, wherein the serrated peripheral surface of the matrix is a bevel, the diamond layer is plated on the bevel, the diamond layer is a single layer in the radial direction of the bevel, the region to be plated with the diamond particles is a plating layer on the bevel of single saw tooth of the matrix, the diamond particles in the diamond layer are coated and plated in the plating layer, and the thickness of the plating layer is larger than the particle size of the diamond particles in the radial direction of the bevel. The saw blade has light load, greatly improved efficiency and service life, is suitable for flaking, meets the requirement of powerful or high-linear-speed cutting, is also suitable for large-scale manufacturing of multiple pieces, and has low manufacturing cost.

Inventors

SONG JINGXIN
Liang anning
LONG HUILING
SONG YOUPENG

Assignees

桂林磨院材料科技有限公司
桂林创源金刚石有限公司

Dates

Publication Date: 20260508
Application Date: 20230828

Claims (4)

1. The electroplated gem cutting saw blade is characterized by comprising a base body (1) with a sawtooth-shaped peripheral surface and a diamond layer (3), wherein the sawtooth-shaped peripheral surface of the base body (1) is a bevel (2), the diamond layer (3) is plated on the bevel (2), the diamond layer (3) is a single layer in the radial direction of the bevel (2), the area of the single sawtooth of the base body (1), which is to be plated with diamond particles, is an electroplated layer (21), the diamond particles in the diamond layer (3) are coated and plated in the electroplated layer (21), and the thickness of the electroplated layer (21) is larger than the particle size of the diamond particles in the radial direction of the bevel (2); On the inclined surface (2) of the single saw tooth of the matrix (1), the difference of the radius at two points which are arbitrarily separated by 1 time of particle diameter along the circumferential direction is larger than or equal to one fourth of the particle diameter of the diamond particles, and smaller than or equal to one half of the particle diameter of the diamond particles; In the axial direction of the inclined plane (2), the axial arrangement width of each row of the diamond particles is more than one time of the particle size of the diamond particles, and less than two times of the particle size of the diamond particles; And a row of diamond particles which are axially close to the end face of the substrate (1) on the inclined surface (2) are provided with a part of diamond particles protruding out of the end face of the substrate (1) to form a side edge.
2. A electroplated gemstone cutting saw blade according to claim 1, wherein said diamond particles are arranged in single or double or multiple rows or single or double or multiple rows of intersections in the axial direction of said bevel (2).
3. A electroplated gemstone cutting saw blade according to claim 2, wherein said diamond particles are arranged in a double or multiple intersecting arrangement in the axial direction of said bevel (2), and wherein the areas between adjacent two rows of said diamond particles not coated with said diamond particles are blank coating (22) in the circumferential direction of said bevel (2) of a single serration of said substrate (1), said blank coating (22) having a width greater than zero and less than twice the particle size of said diamond particles.
4. A manufacturing process of a cutting saw blade for electroplated gemstones is characterized in that, a electroplated gemstone cutting saw blade for use in the manufacture of any one of the preceding claims 1 to 3, comprising the steps of: s1, processing a matrix material into a matrix (1) at one time through punching according to peripheral saw teeth and mounting mesopores of a designed shape; S2, insulating the area of the non-plating layer (21) on the inclined plane (2); S3, arranging a plurality of matrixes (1) in parallel and series on an electrode shaft; s4, isolating two adjacent matrixes (1) by using a non-conductive partition board, wherein the non-conductive partition board is larger than or equal to one time of the grain diameter of the diamond particles at each point on the periphery of the matrixes (1); s5, plating diamond particles on the electroplated layer (21) through an electroplating process, and enabling the thickness of the radial electroplated layer (21) of the inclined plane (2) to be larger than the particle size of the diamond particles to form a diamond layer (3); And S6, shaping and sharpening the plated saw blade.

Description

Electroplated precious stone cutting saw blade and manufacturing process thereof Technical Field The invention relates to the technical field of diamond cutting grinding tools, in particular to an electroplated precious stone cutting saw blade and a manufacturing process thereof. Background In the prior art, diamond rolling saw blades are often adopted for cutting precious stone materials, low carbon steel matrixes are adopted for the rolling saw blades, slots penetrating through the matrixes in the radial direction (or with an inclined angle) are formed at the positions close to the outer diameters of the matrixes, the rolling extrusion matrixes are adopted for deforming the matrixes, and the diamond put in the slots is mechanically clamped and fixed, so that the rolling saw blades are characterized by good sharpness, and the main reason is that the diamond rolling saw blades are weak in holding force of the diamond, easy to generate stress shedding phenomenon when the diamond works, work when the sharp stress of the cutting edge angle is small, and drop when the stress of the passivation state is large, so that the diamond rolling saw blades have the characteristics of good sharpness, short service life and unsuitable for powerful or high-linear speed cutting. Disclosure of Invention The invention aims to solve the technical problem of providing an electroplated precious stone cutting saw blade and a manufacturing process thereof aiming at the defects of the prior art. The technical scheme includes that the electroplated gem cutting saw blade comprises a base body with a sawtooth-shaped peripheral surface and a diamond layer, wherein the sawtooth-shaped peripheral surface of the base body is an inclined surface, the diamond layer is plated on the inclined surface, the diamond layer is a single layer in the radial direction of the inclined surface, an area to be plated with diamond particles on the inclined surface of a single sawtooth of the base body is an electroplated layer, the diamond particles in the diamond layer are coated and plated in the electroplated layer, and the thickness of the electroplated layer is larger than the particle size of the diamond particles in the radial direction of the inclined surface. The diamond coating has the advantages that the saw-toothed substrate is beneficial to realizing intermittent cutting, the diamond layer is plated on the inclined plane to control the total thickness of the saw blade, flaking is realized, the diamond layer is a single layer to improve the self-sharpening property of the diamond layer, the diamond particles are coated in the electroplated layer, the thickness of the radial electroplated layer of the saw-toothed inclined plane is larger than the grain diameter of the diamond particles, and the gripping force of the electroplated layer on the diamond particles is beneficial to ensuring. Meanwhile, the saw blade has light load, greatly improved efficiency and service life, is suitable for flaking, meets the requirement of powerful or high-linear-speed cutting, is also suitable for large-scale manufacturing of multiple pieces, and reduces the manufacturing cost. On the basis of the technical scheme, the invention can be improved as follows. Further, on the inclined surface of the single serration of the base body, a difference in radius between two points at which 1-time particle diameters are arbitrarily spaced in the circumferential direction is greater than or equal to one-fourth of the particle diameters of the diamond particles, and less than or equal to one-half of the particle diameters of the diamond particles. The further scheme has the beneficial effect of being beneficial to adjusting the processing load and the service life of the saw blade. Further, the diamond particles are arranged in a single row or a double row or a plurality of rows or a single row or a double row or a plurality of rows of intersection in the axial direction of the inclined plane. The further scheme has the beneficial effects of being beneficial to adapting to different processing conditions according to various embodiments and reducing unnecessary abrasion of diamond particles. Further, in the axial direction of the inclined surface, the axial arrangement width of the diamond particles of each column is larger than the particle diameter of the diamond particles by one time and smaller than the particle diameter of the diamond particles by two times. The adoption of the further scheme has the beneficial effect of being beneficial to improving the consolidation strength of the diamond particles. Further, a row of diamond particles is arranged on the inclined plane and axially close to the end face of the substrate, and part of diamond particles protrude out of the end face of the substrate to form a side edge. The further scheme has the beneficial effects that the side edges formed by the convex end faces of the base bodies are arranged on the circumference of th