CN-117136139-B - Method for manufacturing nozzle plate, and fluid ejection head

Abstract

A nozzle plate having at least a nozzle cone (12) and a straight line communication path (13) in a nozzle hole is manufactured through the following steps (1) to (5). Step 1 (S-1) of preparing a single crystal silicon substrate (1) having a surface with a crystal orientation of (100), step 2 (S-2) of forming a mask layer (2) on the surface of the single crystal silicon substrate in the same manner, step 3 (S-3) of forming an opening pattern (3) on the mask layer, step 4 (S-4) of forming a through hole (4) by performing a penetration process on the single crystal silicon substrate located under the opening pattern from the surface by dry etching, and step 5 (S-5) of enlarging the through hole by anisotropic wet etching on the single crystal silicon substrate, thereby forming a nozzle cone portion and a straight line communication path continuous with the nozzle cone portion.

Inventors

• KAJITA HIROSHI
• SAMESHIMA KOUICHI

Assignees

• 柯尼卡美能达株式会社

Dates

Publication Date

20260505

Application Date

20210331

Claims (4)

1. 1. A method for manufacturing a nozzle plate of a fluid jet head, comprising the steps of sequentially performing the following steps 1,2, 3, 6, 7, 4, and 5 to manufacture a nozzle plate having at least a nozzle cone and a straight line communication path in a nozzle hole, Step 1, preparing a monocrystalline silicon substrate having a surface with a crystal orientation of [100], Step 2 of uniformly forming a mask layer on the surface of the single crystal silicon substrate, Step 3, forming an opening pattern on the mask layer, A step 6 of forming a hole by performing deep excavation processing from the surface of the single crystal silicon substrate under the opening pattern by dry etching, Step 7, forming a mask layer on the side wall of the hole, A step 4 of forming a through hole by performing a through process from the surface of the single crystal silicon substrate under the opening pattern by dry etching, And step 5 of forming a nozzle cone and a straight line communication path continuous with the large diameter end of the nozzle cone on the single crystal silicon substrate by expanding the through hole by anisotropic wet etching of the single crystal silicon substrate.
2. 2. The method of manufacturing a nozzle plate according to claim 1, wherein after the step 5, a step of forming a protective film that covers surfaces including the inside of the nozzle cone and the inside of the straight communication path is performed.
3. 3.A nozzle plate of a fluid ejection head manufactured by the method for manufacturing a nozzle plate according to claim 1 or 2, having a straight line communication path formed of 4 [100] planes continuous with respect to a direction in which a diameter of a nozzle cone formed of 4 [111] planes of single crystal silicon is enlarged.
4. 4. A fluid ejection head provided with the nozzle plate of claim 3.

Description

Method for manufacturing nozzle plate, and fluid ejection head Technical Field The invention relates to a manufacturing method of a nozzle plate, a nozzle plate and a fluid nozzle. Background Conventionally, a method of manufacturing a nozzle plate having a nozzle cone and a straight communication path in a nozzle hole has been proposed. Such a method for manufacturing a nozzle plate is disclosed in, for example, patent document 1 and patent document 2. Patent document 1 discloses a method for manufacturing a funnel-shaped nozzle plate in which a nozzle cone portion and a nozzle straight tube portion are formed on a SOI (Silicon On Insulator) substrate, which is a silicon wafer having a structure in which a silicon single crystal layer is formed on an oxide film. In patent document 1, the photoresist is patterned from the opposite side with respect to the front-end hole formed by wet etching, and then the rear-end hole is etched. That is, a method of joining and penetrating a hole deep-dug from one surface of a substrate and a hole deep-dug from the other surface in the substrate. In patent document 2, wet etching is performed from the top and bottom without forming a through hole from one side, and this is the same method. Prior art literature Patent literature Patent document 1 Japanese patent application No. 5519263 Patent document 2 Japanese patent application laid-open No. 2014-512989 Disclosure of Invention In the above-described conventional technique, the hole bored from one surface of the substrate and the hole bored from the other surface are joined and penetrated in the substrate to form the nozzle hole, but positional displacement of the hole bored from one surface and the hole bored from the other surface is unavoidable. Therefore, if the conventional manufacturing method is adopted, the nozzle cone and the linear communication path are displaced, and therefore the symmetry of the fluid flow is lost, which may cause deterioration of the injection angle, and further, precipitation occurs in the nozzle due to the displacement, and bubbles remain therein, which may deteriorate the bubble removal performance. The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a nozzle plate in which a nozzle cone portion and a linear communication path are continuous so as not to be displaced, and a fluid head including the nozzle plate. One embodiment of the present invention for solving the above problems is a method for manufacturing a nozzle plate of a fluid jet head, which includes a step 1 to a step 5 described below for manufacturing a nozzle plate having at least a nozzle cone portion and a linear communication path in a nozzle hole. Step 1, preparing a monocrystalline silicon substrate having a surface with a crystal orientation of [100], Step 2 of forming a mask layer on the surface of the single crystal silicon substrate in the same manner, Step3, forming an opening pattern on the mask layer, A step 4 of forming a through hole by performing a through-hole processing from the surface of the single crystal silicon substrate located under the opening pattern by dry etching, And step 5 of forming a nozzle taper and a straight line communication path continuous with the nozzle taper by expanding the through-hole by anisotropic wet etching of the single crystal silicon substrate. Another aspect of the present invention is a nozzle plate of a fluid ejection head having a straight line communication path formed of 4 [100] planes, which is continuous with a direction in which a diameter of a nozzle cone formed of 4 [111] planes of single crystal silicon increases. According to the method for manufacturing the nozzle plate of the fluid ejection head of the above-described one embodiment of the present invention, since the through-holes formed through the one opening pattern are enlarged for the one nozzle to form the nozzle cone and the linear communication path, the nozzle plate in which the nozzle cone and the linear communication path are continuous without being displaced can be configured. According to the nozzle plate of the above embodiment of the present invention, since the nozzle cone portion and the linear communication path are continuous without being displaced, the fluid flow is symmetrical, and the injection angle is stable. In addition, the deposition is not easy to generate in the nozzle, and the bubble removal performance is also good. Drawings Fig. 1 is a cross-sectional view showing the main steps of a method for manufacturing a nozzle plate according to a first embodiment of the present invention. Fig. 2 is a rear view of a nozzle plate of the first embodiment of the present invention, showing nozzle hole portions. Fig. 3 is a cross-sectional view of a nozzle plate according to a first embodiment of the present invention, showing the case where a protective film is provided. Fig. 4 is a cross-sectional view showing