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CN-117168199-B - Method and equipment for manufacturing heat conduction plate

CN117168199BCN 117168199 BCN117168199 BCN 117168199BCN-117168199-B

Abstract

The invention discloses a manufacturing method of a heat conducting plate, which comprises the steps of preparing a heat conducting plate semi-finished product with a liquid injection port and an extraction port, injecting a working fluid into a cavity of the heat conducting plate semi-finished product, performing a sealing operation on the heat conducting plate semi-finished product to enable the liquid injection port to be in a sealing state, performing a temperature feedback pressure adjusting operation on the heat conducting plate semi-finished product to adjust the pressure in the cavity to ensure that the instant temperature difference between two temperature measuring points of the heat conducting plate semi-finished product is lower than a threshold value, wherein the temperature feedback pressure adjusting operation comprises heating the heat conducting plate semi-finished product, extracting air from the cavity through the extraction port to adjust the pressure in the cavity, fixing the pressure in the cavity when the instant temperature difference is lower than the threshold value, and performing the sealing operation on the extraction port of the heat conducting plate semi-finished product to form the heat conducting plate. The invention can ensure that the performance of the heat conduction plate meets the specification in an automatic mode, thereby improving the manufacturing yield of the heat conduction plate.

Inventors

  • WU ZHIMENG

Assignees

  • 创新服务股份有限公司

Dates

Publication Date
20260508
Application Date
20220525

Claims (10)

  1. 1. The manufacturing method of the heat conducting plate is realized by using an automatic assembly line type manufacturing device, and comprises the following steps: preparing a semi-finished heat conduction plate with a liquid injection port and an extraction port in a first working station; injecting a working fluid into a chamber of the thermally conductive plate blank in a second station; Performing a sealing operation on the semi-finished product of the heat conducting plate in a third working station to make the liquid injection port be in a sealed state, and And performing a temperature feedback pressure adjustment operation on the semi-finished product of the heat conducting plate in a fourth workstation to ensure that the real-time temperature difference between two temperature measuring points of the semi-finished product of the heat conducting plate is lower than a threshold value, and performing the sealing operation on the extraction opening of the semi-finished product of the heat conducting plate to form a heat conducting plate, wherein the temperature feedback pressure adjustment operation comprises heating the semi-finished product of the heat conducting plate, extracting air from the chamber through the extraction opening to adjust the pressure in the chamber, and fixing the pressure in the chamber when the real-time temperature difference is lower than the threshold value.
  2. 2. The method of claim 1, further comprising detecting an injection amount of the working fluid in the second station in real time.
  3. 3. The method of claim 1, further comprising performing an air-tightness measurement of the thermal conductive plate in the fourth station.
  4. 4. The method of claim 1, wherein the sealing operation is performed by a device selected from the group consisting of an ultrasonic heating device, a laser heating device, and a resistance welding device.
  5. 5. The method of claim 1, wherein the thermal conductive plate has more than one liquid injection port and more than one pumping port, and the liquid injection ports and pumping ports are independent.
  6. 6. A heat conduction plate manufacturing device is provided with a semi-finished product manufacturing station, a liquid injection workstation, a liquid injection port sealing workstation and a pressure adjusting workstation, so as to execute an automatic assembly line type heat conduction plate manufacturing method, and the heat conduction plate manufacturing method comprises the following steps: Preparing a semi-finished heat guide plate with a liquid injection port and an air extraction port in the semi-finished product manufacturing station; Injecting a working fluid into a chamber of the thermal conductance plate blank in the liquid injection station; in the filling port sealing station, performing a sealing operation on the semi-finished product of the heat conducting plate to make the filling port in a sealed state, and And performing a temperature feedback pressure adjustment operation on the semi-finished product of the heat conducting plate in the pressure adjustment workstation to ensure that the real-time temperature difference between two temperature measuring points of the semi-finished product of the heat conducting plate is lower than a threshold value, and performing the sealing operation on the extraction opening of the semi-finished product of the heat conducting plate to form a heat conducting plate, wherein the temperature feedback pressure adjustment operation comprises heating the semi-finished product of the heat conducting plate, extracting air from the chamber through the extraction opening to adjust the pressure in the chamber, and fixing the pressure in the chamber when the real-time temperature difference is lower than the threshold value.
  7. 7. The apparatus of claim 6, wherein the method further comprises detecting the injection amount of the working fluid in real time using the injection station.
  8. 8. The apparatus of claim 6, wherein the method further comprises performing an air tightness measurement on the thermal conductive plate using the pressure adjustment station.
  9. 9. The apparatus for manufacturing a thermal conductive plate according to claim 6, wherein the means for performing the sealing operation is one selected from the group consisting of an ultrasonic heating means, a laser heating means and a resistance welding means.
  10. 10. The apparatus for manufacturing a thermal conductive plate according to claim 6, wherein the thermal conductive plate has more than one liquid inlet and more than one gas outlet, and the liquid inlet and the gas outlet are independent.

Description

Method and equipment for manufacturing heat conduction plate Technical Field The present invention relates to a method for manufacturing a thermal conductive plate, and more particularly, to an automated method for manufacturing a thermal conductive plate capable of ensuring the thermal conductive effect of the thermal conductive plate. Background The principle of the heat conduction plate is that a cavity is formed in the plate body, the cavity is sealed after the cavity is filled with a working fluid (such as water), and the working fluid continuously evaporates and condenses in the cavity to achieve the effect of quick heat conduction. In order to achieve good flow efficiency of the working fluid during evaporation and condensation, the pressure of the cavity inside the thermal conductive plate and the amount of the working fluid must be well matched. However, in the conventional heat conduction plate manufacturing process, the heat conduction efficiency of the heat conduction plate is often compromised due to incorrect pressure in the cavity, such as air leakage during the packaging of the plate body, or incorrect injection amount of the working fluid, thereby reducing the manufacturing yield of the heat conduction plate. Accordingly, there is a need in the art for a novel method of manufacturing a thermally conductive plate. Disclosure of Invention One of the purposes of the present invention is to disclose a method for manufacturing a thermal conductive plate, which can control the injection amount of working fluid and the air pressure of the thermal conductive plate chamber, and measure the thermal conductive effect of the thermal conductive plate to ensure the performance of the thermal conductive plate to meet the specification, thereby greatly improving the manufacturing yield of the thermal conductive plate. Another objective of the present invention is to disclose a method for manufacturing a thermal conductive plate, which can be implemented by an automation device, so as to solve the problem that the conventional thermal conductive plate manufacturing technology cannot produce a large amount of thermal conductive plates continuously by using an automation line (pipeline) manufacturing method. To achieve the above object, a method for manufacturing a thermal conductive plate is provided, which comprises the following steps: The method comprises the steps of preparing a semi-finished heat conduction plate with a liquid injection port and an extraction port in a first working station, injecting a working fluid into a cavity of the semi-finished heat conduction plate in a second working station, conducting a sealing operation on the semi-finished heat conduction plate in a third working station to enable the liquid injection port to be in a sealing state, conducting a temperature feedback pressure adjustment operation on the semi-finished heat conduction plate in a fourth working station to ensure that the instant temperature difference between two temperature measurement points of the semi-finished heat conduction plate is lower than a threshold value, and conducting a sealing operation on the extraction port of the semi-finished heat conduction plate to form a heat conduction plate, wherein the temperature feedback pressure adjustment operation comprises heating the semi-finished heat conduction plate, pumping air from the cavity through the extraction port to adjust the pressure in the cavity, and fixing the pressure in the cavity when the instant temperature difference is lower than the threshold value. In one embodiment, the method further comprises detecting the injection amount of the working fluid in the second station in real time. In one embodiment, the method further comprises performing an air tightness measurement on the thermal conductive plate after the sealing operation is completed in the fourth station. In one embodiment, the sealing operation may be performed by an ultrasonic heating device, a laser heating device, or a resistance welding device. In one embodiment, the thermal conductive plate has more than one liquid injection port and more than one pumping port, and the liquid injection ports and pumping ports are independent. In order to achieve the above object, the present invention further provides a thermal conductive plate manufacturing apparatus having a semi-finished product manufacturing station, a liquid injection port sealing station and a pressure adjusting station, for performing a thermal conductive plate manufacturing method, the manufacturing method comprising the steps of: The method comprises the steps of preparing a semi-finished heat conduction plate with a liquid injection port and an extraction port in a semi-finished product manufacturing station, injecting working fluid into a cavity of the semi-finished heat conduction plate in the liquid injection station, performing sealing operation on the semi-finished heat conduction plate in the liquid injection