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CN-117174633-B - Pick-up patch suction head, preparation method and hybrid bonding method

CN117174633BCN 117174633 BCN117174633 BCN 117174633BCN-117174633-B

Abstract

The invention discloses a pick-up patch suction head, a preparation method and a hybrid bonding method, belongs to the technical field of semiconductor packaging, and solves the problems that in the prior art, the cleanliness cannot be guaranteed by direct contact pick-up of a microchip, the required space is large, and non-contact pick-up cannot be used for the microchip. The suction head comprises a suction disc, a base body and a cover body which are arranged in a split mode, wherein an air inlet channel, an air distribution cavity, a cyclone channel and an air cyclone cavity are formed in the base body, and the radial angle between the air outlet direction of the cyclone channel and the radial angle of the cyclone cavity is more than 0 DEG and less than or equal to 90 deg. The preparation method comprises processing the base body and the cover body, and sealing and connecting. The hybrid bonding method comprises picking up the front surface of the microchip by using a pick-up patch suction head, placing the back surface of the microchip on a contact suction head, and contacting the front surface of the microchip with a wafer to carry out pressurization patch. Pick-up patch suction head, preparation method and hybrid bonding method can be used for the patch of microchip.

Inventors

  • DING FEI
  • WANG QIDONG
  • DAI FENGWEI
  • CAO LIQIANG

Assignees

  • 中国科学院微电子研究所

Dates

Publication Date
20260508
Application Date
20220527

Claims (7)

  1. 1. A pick-up patch suction head is characterized by comprising a cyclone suction head and a suction cup for vacuum adsorption of the cyclone suction head, wherein the cyclone suction head comprises a base body and a cover body which are arranged in a split mode, an air inlet channel, an air distribution cavity, a cyclone channel and an air rotation cavity which are sequentially communicated are formed in the base body, the top end of the air distribution cavity is an open end, the cover body is arranged at the open end in a covering mode and is in sealing connection with the open end, and the radial angle between the air outlet direction of the cyclone channel and the cyclone cavity is larger than 0 DEG and smaller than or equal to 90 DEG; The cyclone channel comprises a first section and a second section communicated with the first section, the axis of the first section is parallel to the axis of the base body, and the radial angle between the air outlet direction of the second section and the cyclone cavity is more than 0 DEG and less than or equal to 90 DEG; The cyclone suction head comprises a cover body, a base body, a suction head and a pick-up patch, wherein a limit block and a limit groove which are matched with each other are arranged at the joint of the cover body and the base body, the limit block is fixedly connected with one of the cover body and the base body, the limit groove is arranged on the other of the cover body and the base body, the limit block comprises a connecting section, a limit section and a pick-up section which are sequentially connected, the connecting section, the limit section and the pick-up section are all positioned at the edges of the cover body and the base body, the limit groove comprises a connecting groove, a limit groove and a pick-up groove which are sequentially communicated, the connecting section is inserted into the connecting groove, the limit section is inserted into the limit groove, the pick-up section is inserted into the pick-up groove, the limit section limits axial displacement between the cover body and the base body, the pick-up section limits radial displacement between the cover body and the base body, the pick-up patch is suitable for the microchip, the size of the microchip is 1-100 mm, and the airflow sequentially passes through an air inlet channel, an air distribution cavity, a cyclone channel and a cyclone cavity, flows out of a gap between the cyclone cavity and the microchip, and is rapidly spread outwards along the radial direction of the cyclone cavity, and no contact and pick-up of the microchip is realized.
  2. 2. The pick-up patch tip of claim 1 wherein the outlet direction of the cyclonic channel is at an angle of 90 ° to the radial direction of the cyclonic cavity.
  3. 3. The pick-up patch tip of claim 2 wherein the number of cyclonic channels is 3-6.
  4. 4. A pick-up patch suction head as claimed in claim 3, wherein the number of cyclonic channels is 4; the air outlet direction of two adjacent cyclone inner channels is vertical.
  5. 5. The pick-up patch tip of claim 1 wherein the material of the base and cover is stainless steel, aluminum alloy or copper alloy.
  6. 6. A method of manufacturing a pick-up patch tip, characterized in that the method of manufacturing is for manufacturing a pick-up patch tip as claimed in any one of claims 1 to 5, the method of manufacturing comprising the steps of: step 1, respectively processing a base body and a cover body; and 2, performing sealing connection on the base body and the cover body to obtain the pick-up patch suction head.
  7. 7. A hybrid bonding method employing the pick-and-place tip of any one of claims 1 to 5, comprising the steps of: Non-contact pick-up is carried out on the front surface of the microchip by adopting a pick-up patch suction head; Placing the back of the microchip on the contact suction head; And the pick-up patch suction head releases the front surface of the microchip, and contacts the front surface of the microchip with the wafer to carry out pressurization patch so as to complete the hybrid bonding from the microchip to the wafer.

Description

Pick-up patch suction head, preparation method and hybrid bonding method Technical Field The invention belongs to the technical field of semiconductor packaging, and particularly relates to a pick-up patch suction head, a preparation method and a hybrid bonding method. Background The chip-to-wafer (D2W) hybrid bonding technology is a bump-free bonding mode, is sensitive to the cleanliness of bonding surfaces, and causes a large number of pores at bonding interfaces or complete failure of bonding due to pollution generated on the surfaces of chips in the process of bonding. The chip can be picked up by adopting a direct contact mode (for example, front direct contact and peripheral direct contact), wherein the front direct contact mode is difficult to ensure the surface cleanliness requirement of the chip suction head, the cleaning treatment is required to be carried out later, the efficiency is low, the cost is high, the peripheral direct contact mode is required to have large space between chips, the number of chips which are discharged from wafers is seriously reduced, and the non-contact mode is mainly applied to pick up and place products with larger size (for example, such as ultrathin wafers, glass jet flow discs and the like) at present and cannot be applied to pick up and place micro chips. Disclosure of Invention In view of the above analysis, the invention aims to provide a pick-up patch suction head, a preparation method and a hybrid bonding method, which solve the problems that the cleanliness cannot be ensured by direct contact pick-up of a microchip, the required space is large and the non-contact pick-up cannot be used for the microchip in the prior art. The aim of the invention is mainly realized by the following technical scheme: The invention provides a pick-up patch suction head which comprises a cyclone suction head and a suction cup for vacuum adsorption of the cyclone suction head, wherein the cyclone suction head comprises a base body and a cover body which are arranged in a split mode, an air inlet channel, an air distribution cavity, a cyclone channel and an air rotation cavity are sequentially formed in the base body, the top end of the air distribution cavity is an open end, the cover body is arranged at the open end in a covering mode and is in sealing connection with the open end, and the radial angle between the air outlet direction of the cyclone channel and the cyclone cavity is larger than 0 DEG and smaller than or equal to 90 deg. Further, the air inlet channel is arranged along the radial direction of the base body, the air distribution cavity is arranged at the top end of the base body, the cyclone channel is arranged at the bottom end of the base body, and the axis of the air distribution cavity and the axis of the cyclone channel are parallel to the axis of the base body. Further, the cyclone channel comprises a first section and a second section communicated with the first section, the axis of the first section is parallel to the axis of the base body, and the radial angle between the air outlet direction of the second section and the cyclone cavity is more than 0 DEG and less than or equal to 90 deg. Further, the air outlet direction of the cyclone channel and the radial direction of the cyclone cavity are at an angle of 90 degrees. Further, the number of the cyclone channels is 3-6. Further, the number of the cyclone channels is 4, and the air outlet directions of two adjacent cyclone channels are vertical. Further, the materials of the base body and the cover body are stainless steel, aluminum alloy or copper alloy. Further, the pick-up patch suction head is suitable for a microchip, and the size of the microchip is 1-100 mm multiplied by 1-100 mm. The invention also provides a preparation method of the pick-up patch suction head, which is used for preparing the pick-up patch suction head and comprises the following steps: step 1, respectively processing a base body and a cover body; and 2, performing sealing connection on the base body and the cover body to obtain the pick-up patch suction head. The invention also provides a hybrid bonding method, which adopts the pick-up patch suction head and comprises the following steps: Non-contact pick-up is carried out on the front surface of the microchip by adopting a pick-up patch suction head; Placing the back of the microchip on the contact suction head; And the pick-up patch suction head releases the front surface of the microchip, and contacts the front surface of the microchip with the wafer to carry out pressurization patch so as to complete the hybrid bonding from the microchip to the wafer. Compared with the prior art, the invention has at least one of the following beneficial effects: A) The invention provides a pick-up patch suction head, which is designed by a unique cyclone suction head structure aiming at a microchip, on one hand, the cyclone suction head in the prior art has larger size, so that the cyclone