CN-117212311-B - Grid ruler curing method, device and system

CN117212311BCN 117212311 BCN117212311 BCN 117212311BCN-117212311-B

Abstract

The application provides a grid ruler curing method, device and system. The method is applied to a grid ruler curing system, the grid ruler curing system comprises a grid ruler to be cured, a clamp body and a substrate, the method comprises the steps of obtaining a curing stress association relation between the substrate and the grid ruler in a curing connection process, wherein the curing stress association relation is a corresponding relation between a tensile force applied to the substrate along the length direction of the substrate and a warping degree generated by the grid ruler, determining a target tensile force applied to the substrate according to the curing stress association relation, connecting two ends of the substrate with the clamp body respectively, and in the process of continuously applying the target tensile force to the substrate through the clamp body, conducting curing connection on the grid ruler and the substrate, and after the curing connection of the substrate and the grid ruler is completed, withdrawing the target tensile force and removing the clamp body to obtain the target adhesive. The application can solve the problems of low measurement precision caused by the influence of the bonding assembly quality due to the substrate warpage caused by the stress generated in the curing process in the prior art.

Inventors

XIA HUANXIONG
LIU JIANHUA
YANG HONGFAN
AO XIAOHUI
LIU SHAOLI
LI DA

Assignees

北京理工大学

Dates

Publication Date: 20260508
Application Date: 20230920

Claims (9)

1. The grid ruler curing method is characterized by being applied to a grid ruler curing system, wherein the grid ruler curing system comprises a grid ruler to be cured, a clamp body and a substrate, and comprises the following steps: the method for acquiring the association relation of the curing stress of the substrate and the grid ruler in the curing connection process comprises the steps of establishing a curing dynamics model of adhesive curing in the curing connection process; determining a modulus change in the curing process of the adhesive according to the curing dynamics model and a time curing degree equivalent method, determining the curing pressure of the adhesive according to the modulus change, taking the preset tension applied to the substrate and the curing pressure of the adhesive as the second tension applied to the substrate, and obtaining the warping degree generated by the grid ruler under the second tension; Determining a target pulling force applied to the substrate according to the association relation of the curing stress, wherein the target pulling force applied to the substrate comprises determining a first applied pulling force corresponding to the minimum warping degree according to the association relation of the curing stress, determining a first pulling force generated by curing an adhesive in a curing connection process, and determining the target pulling force applied to the substrate according to the first applied pulling force and the first pulling force; and respectively connecting the two ends of the substrate with the clamp body, curing and connecting the grating ruler with the substrate in the process of continuously applying the target tension to the substrate through the clamp body, and after the curing and connecting of the substrate and the grating ruler are completed, withdrawing the target tension and removing the clamp body to obtain the target bonding piece.
2. The method of claim 1, wherein establishing a cure kinetics model of adhesive cure during the cure-attach process comprises: acquiring heat flow change in the adhesive curing process; Determining the relationship between the heat flow rate and time or between the heat flow rate and temperature according to the heat flow change; determining a curing power equation of the adhesive according to the relation between the heat flow rate and time or the relation between the heat flow rate and temperature; and establishing the curing dynamics model according to the curing dynamic equation.
3. The method of claim 2, wherein determining a heat flow rate versus time, or a heat flow rate versus temperature, from the heat flow variation comprises: performing differential scanning calorimetry DSC experiments at different curing temperatures to determine a first variation of heat flow rate versus time, and Acquiring isothermal DSC exothermic data; and integrating the isothermal DSC exothermic data to obtain total reaction exotherms at all curing temperatures, wherein each total reaction exotherm has the corresponding curing degree of the adhesive.
4. The method of claim 1, wherein determining the change in modulus during curing of the adhesive based on the cure kinetics model and the time cure equivalent method comprises: dividing the adhesive into a natural modulus part and a high-order viscoelastic effect part according to the relaxation creep property of the adhesive; from the intrinsic modulus portion and the viscoelastic effect portion, a change in modulus during curing of the adhesive is determined.
5. The method of claim 4 wherein the natural modulus portion of the adhesive is determined according to the adhesive's relaxed creep characteristics using the following equation; ; Wherein, the The intrinsic modulus at curing temperature at full cure is expressed, and is related to the curing temperature employed in the curing process; represents the uncured intrinsic modulus, satisfying The curing degree of the glass transition point and the gel point is represented by alpha c1 and alpha c2 , the curing degree of the glass transition point and the gel point is represented by r r , the factor of two competing factors of stress relaxation and curing hardening is represented by alpha mod , and the ratio of a first difference value to a second difference value is represented by alpha c1 , and the second difference value is represented by alpha c2 and alpha c1 .
6. The method of claim 4, wherein determining the viscoelastic effector moiety based on the relaxed creep characteristics of the adhesive comprises: According to the time curing degree equivalent method, the same logarithmic coordinates and the viscoelastic characteristics under different curing degrees are adopted to obtain the modulus corresponding relation between the modulus of each curing degree and the modulus of the reference curing degree; and determining the viscoelastic effect part according to the modulus corresponding relation.
7. The method of claim 1, wherein obtaining the degree of warpage generated by the grid ruler under the second tensile force comprises: measuring a deformed image of the grid ruler according to a three-dimensional digital image correlation method when the second tensile force is applied to the substrate; According to the deformation image, determining the central deformation and the two-end deformation of the grid ruler; and obtaining the warping degree of the grid ruler under the second tensile force according to the central deformation and the deformation of the two ends.
8. A grid ruler curing device, comprising: The first acquisition module is used for acquiring a curing stress association relation between a substrate and the grid ruler in the curing connection process, wherein the curing stress association relation is a corresponding relation between a tensile force applied to the substrate along the length direction of the substrate and a warping degree generated by the grid ruler; the first determining module is used for determining the target tensile force applied to the substrate according to the association relation of the curing stress; The first processing module is used for respectively connecting two ends of the substrate with the clamp body, curing and connecting the grating ruler with the substrate in the process of continuously applying the target pulling force to the substrate through the clamp body, and removing the target pulling force and removing the clamp body after the curing and connecting of the substrate and the grating ruler are completed to obtain a target bonding piece; The first determining module comprises a first determining unit, a second determining unit, a third determining unit and a third determining unit, wherein the first determining unit is used for determining a first applied pulling force corresponding to the minimum warping degree according to the association relation of the curing stress, the second determining unit is used for determining a first pulling force generated by curing the adhesive in the curing connection process, and the third determining unit is used for determining a target pulling force applied to the substrate according to the first applied pulling force and the first pulling force; The grid ruler curing device further comprises a first building module, a second determining module, a third determining module, a second obtaining module and a fourth determining module, wherein the first building module is used for building a curing dynamics model of adhesive curing in a curing connection process, the second determining module is used for determining modulus change in the adhesive curing process according to the curing dynamics model and a time curing degree equivalent method, the third determining module is used for determining adhesive curing pressure according to the modulus change, the second obtaining module is used for obtaining warping degree of the grid ruler under the second pulling force by taking preset pulling force applied to the substrate and the adhesive curing pressure as the second pulling force applied to the substrate, and the fourth determining module is used for determining a curing stress association relation between the substrate and the grid ruler in the curing connection process according to the second pulling force and the warping degree.
9. A grid scale curing system, comprising: the device comprises a grid ruler to be solidified, a clamp body, a substrate, a nut, a pressure sensor, a first bolt, a first gasket, a second gasket and a second bolt; The grid ruler is connected with the substrate through an adhesive; the fixture body is fixed on the working table surface of the grid ruler curing system; The first bolt penetrates through a first side plate of the grid ruler curing system and is connected with the nut; the first gasket is positioned on the outer side of the first side plate and between the first bolt and the nut; The pressure sensor is positioned adjacent to the first bolt; The second bolt penetrates through a second side plate of the grid ruler curing system and is connected with the substrate; the second gasket is positioned on the outer side of the second side plate and between the second bolt and the substrate; The method comprises the steps of establishing a curing dynamics model of adhesive curing in a curing connection process, determining modulus change in the adhesive curing process according to the curing dynamics model and a time curing degree equivalent method, determining adhesive curing pressure according to the modulus change, determining a preset tension applied to a substrate and the adhesive curing pressure as a second tension applied to the substrate, obtaining the warping degree of a grid ruler under the second tension, determining a curing stress association relation between the substrate and the grid ruler in the curing connection process according to the second tension and the warping degree, wherein the curing stress association relation is a corresponding relation between the tension applied to the substrate in the length direction of the substrate and the warping degree generated by the grid ruler, determining a first applied tension corresponding to the minimum warping degree according to the curing stress association relation, determining a first tension generated by adhesive curing in the curing connection process, determining a target tension applied to the substrate according to the first applied tension and the first tension, connecting two ends of the substrate with a clamp body respectively, continuing to apply the target tension to the substrate and the grid ruler, removing the target tension from the target grid ruler, and completing the target-clamped-ruler-bonded substrate-bonded-side connection process.

Description

Grid ruler curing method, device and system Technical Field The application relates to the technical field of bonding assembly, in particular to a grid ruler curing method, device and system. Background The grating ruler such as grating ruler and time grating ruler is a high-precision linear displacement sensor, the grating ruler measuring structure comprises a grating ruler and a reading head, a main ruler body (also called a glass ruler) in the grating ruler is adhered to a substrate and then is arranged on a moving part such as a guide rail of a machine tool, and the reading head is arranged on a fixed part. The main scale body is connected with the substrate (also called as a matrix or a scale shell) through epoxy resin adhesive, curing stress can be generated in the curing process of the epoxy resin, the curing shrinkage of the epoxy resin is caused, and the two ends of the substrate are deformed in a buckling manner, so that the measurement accuracy is affected. Disclosure of Invention The application aims to provide a grid ruler curing method, device and system, which are used for solving the problems that the substrate warpage is caused by stress generated by free shrinkage or residual stress generated by upper and lower compression clamps in the current curing process, the bonding assembly quality is influenced and the measurement precision is low. To achieve the above object, an embodiment of the present application provides a grid scale curing method applied to a grid scale curing system including a grid scale to be cured, a jig body, and a substrate, the method including: The method comprises the steps of obtaining a curing stress association relation between a substrate and a grid ruler in a curing connection process, wherein the curing stress association relation is a corresponding relation between a tensile force applied to the substrate along the length direction of the substrate and a warping degree generated by the grid ruler; determining a target tensile force applied to the substrate according to the association relation of the curing stress; and respectively connecting the two ends of the substrate with the clamp body, curing and connecting the grating ruler with the substrate in the process of continuously applying the target tension to the substrate through the clamp body, and after the curing and connecting of the substrate and the grating ruler are completed, withdrawing the target tension and removing the clamp body to obtain the target bonding piece. Optionally, determining the target tensile force applied to the substrate according to the curing stress association relation includes: Determining a first applied tensile force corresponding to the minimum warping degree according to the association relation of the solidification stress; Determining a first tensile force generated by curing the adhesive in the process of curing and connecting; And determining a target tension applied to the substrate according to the first applied tension and the first tension. Optionally, the method further comprises: establishing a curing dynamics model of adhesive curing in the curing connection process; determining the modulus change in the adhesive curing process according to the curing dynamics model and the time curing degree equivalent method; determining the adhesive curing pressure according to the modulus change; Taking the preset tension applied to the substrate and the curing pressure of the adhesive as a second tension applied to the substrate, and obtaining the warping degree of the grid ruler under the second tension; and determining the association relation of the curing stress in the curing connection process of the substrate and the grid ruler according to the second tension and the warping degree. Optionally, establishing a curing dynamics model of adhesive curing in the curing connection process includes: acquiring heat flow change in the adhesive curing process; Determining the relationship between the heat flow rate and time or between the heat flow rate and temperature according to the heat flow change; determining a curing power equation of the adhesive according to the relation between the heat flow rate and time or the relation between the heat flow rate and temperature; and establishing the curing dynamics model according to the curing dynamic equation. Optionally, determining the relationship between the heat flow rate and time or the heat flow rate and temperature according to the heat flow change includes: performing differential scanning calorimetry DSC experiments at different curing temperatures to determine a first variation of heat flow rate versus time, and Acquiring isothermal DSC exothermic data; and integrating the isothermal DSC exothermic data to obtain total reaction exotherms at all curing temperatures, wherein each total reaction exotherm has the corresponding curing degree of the adhesive. Optionally, determining the modulus change in the adhesive curing