CN-117226276-B - Positioning scribing mechanism for semiconductor wafer

Abstract

The invention relates to a positioning scribing mechanism for a semiconductor wafer, which belongs to the field of production of semiconductor wafers and comprises a base, wherein an air cylinder is arranged at the bottom of the base, the top of the air cylinder is connected with a mounting plate, one side of the mounting plate is movably connected with a positioning clamp I, the other side of the mounting plate is movably connected with a positioning clamp II, the top of the positioning clamp I is detachably and horizontally connected with an alignment piece, the top of the positioning clamp II is provided with a detachable connecting clamping piece, the alignment piece and the clamping piece are used for clamping the alignment of a plurality of layers of semiconductor wafers, the top of the base is provided with a belt assembly, the top of the belt assembly is provided with the semiconductor wafer, a guide rail is vertically arranged at the feeding and discharging position of the belt assembly, the guide rail is matched with the ball screw assembly to move, the bottom of the ball screw assembly is provided with a tool bit, one side of the ball screw assembly is provided with a driving device, the driving device moves the tool bit in the horizontal direction through the ball screw assembly, the tool bit is connected with the ball screw assembly through the tool bit air cylinder, the tool bit air cylinder controls the tool bit to move in the vertical direction, and the problem that the traditional equipment production line cannot be integrally aligned, pressed and cut, and the driving device is low in efficiency caused by manual operation is provided.

Inventors

• XIA JILIANG
• WANG YANHUI
• SUN DADE

Assignees

• 青岛融合装备科技有限公司

Dates

Publication Date

20260512

Application Date

20231010

Claims (3)

1. 1. The positioning scribing mechanism for the semiconductor wafer is characterized by comprising a base (1), wherein an air cylinder (2) is arranged in the base (1), the top of the air cylinder (2) is connected with a mounting plate (3), one side of the mounting plate (3) is movably connected with a positioning clamp I (4), the other side of the mounting plate (3) is movably connected with a positioning clamp II (5), the top of the positioning clamp I (4) is detachably and horizontally connected with an alignment piece (6), and the top of the positioning clamp II (5) is provided with a detachable connection clamping piece (7); the top of the base (1) is provided with a belt component (8), and a semiconductor wafer is placed on the top of the belt component (8); the feeding and discharging part of the belt assembly (8) is vertically provided with a guide rail (9), the guide rail (9) is matched with the ball screw assembly (10) to move, the bottom of the ball screw assembly (10) is provided with a tool bit (12), one side of the ball screw assembly (10) is provided with a driving device (11), and the driving device (11) moves the tool bit (12) horizontally through the ball screw assembly (10); the tool bit (12) is connected with the ball screw assembly (10) through a tool bit cylinder (21), and the tool bit cylinder (21) controls the tool bit (12) to move in the vertical direction; The positioning clamp I (4) is L-shaped, the right-angle side of the positioning clamp I (4) is connected with the base (1) through the pin shaft I (13), the adjusting device (14) is detachably arranged at the inner edge of the bottom of the positioning clamp I (4), the adjusting device (14) is vertically arranged, one end of the adjusting device (14) is contacted with the connecting mounting plate (3) and used for returning movement of the alignment piece (6); The positioning clamp I (4) is connected with the belt component (8) through the spring (15) and is used for the alignment movement of the semiconductor wafer; A guide groove (501) is formed in the middle of the positioning clamp II (5), a pin shaft II (16) is arranged in the guide groove (501), and the pin shaft II (16) is matched with the guide groove (501) to realize track control of the top clamping piece (7) and is used for positioning the semiconductor wafer in the vertical direction; An auxiliary vision sensor (18) is arranged near the cutter head (12), a transmission signal is transmitted to the driving device (11), and the control of the track of the cutter head (12) is realized through the driving device (11); the positioning clamp II (5) is connected with the adapter piece (19) through the pin shaft III (17), an adjusting block (20) is arranged at the bottom of the adapter piece (19), and the adjusting block (20) is used for adapting to the specifications of semiconductor wafer glass with different thicknesses; Guide slot (501) are including guide slot I (5011) and guide slot II (5012), are the obtuse angle between guide slot I (5011) and guide slot II (5012), and guide slot I (5011) is used for the rotation of clamping piece (7) around the axis, and guide slot II (5012) is used for the vertical removal of clamping piece (7).
2. 2. The alignment scribing mechanism for semiconductor wafers as claimed in claim 1, wherein the belt assembly (8) comprises a support member (801) and a belt (802), a baffle plate (803) is provided on one side of the support member (801), the top of the baffle plate (803) is higher than the top of the belt (802), Wherein, the height difference between the top of the baffle plate (803) and the top of the belt (802) is H.
3. 3. The alignment scribing mechanism for semiconductor wafers according to claim 1 or 2, wherein the base (1) is provided with a gap (101) on both sides, the gap (101) being used for extending the alignment jig I (4) and the alignment jig II (5) from the inside of the base (1) while providing a movement track space of the alignment jig I (4) and the alignment jig II (5).

Description

Positioning scribing mechanism for semiconductor wafer Technical Field The invention relates to a positioning scribing mechanism for a semiconductor wafer, and belongs to the field of semiconductor wafer production. Background The traditional wafer positioning and scribing mechanism mostly adopts a mechanical method or an optical method, the mechanical method generally uses a mechanical arm to position and scribe, but the precision is lower and is easily influenced by environmental factors, the optical method uses a laser interferometer to position and scribe, and the precision is higher, but the equipment cost is high, and the popularization and the application are difficult. According to the metal calendaring positioning mechanism disclosed in the Chinese patent CN218903083U, the invention relates to the technical field of metal calendaring positioning, in particular to a metal calendaring positioning mechanism, an adjusting device comprises a sliding groove, two sliding blocks are connected inside the sliding groove in a sliding way, extension plates are fixedly arranged on the side surfaces of the two sliding blocks, grooves are formed in the side surfaces of the extension plates, movable limiting plates are fixedly arranged on one end surfaces of the movable blocks, which are far away from the grooves, of the movable blocks, sliding plates are fixedly connected inside the strip grooves in a sliding way, threaded rods are rotatably connected between inner walls of two ends of a U-shaped support, hand wheels are fixedly arranged at one end port of each threaded rod, vertical grooves are formed in the inner wall surface of the U-shaped support, T-shaped plates are connected on the surfaces of the threaded rods in a threaded way, two traction rods are hinged to the bottom surfaces of the T-shaped plates, and one ends of the traction rods, which are far away from the T-shaped plates, of the traction rods are hinged with the sliding blocks. The invention solves the problem that the prior positioning mechanism is only suitable for carrying out calendaring operation on metal workpieces with one specification, thereby causing lower universality of the whole device. The traditional equipment does not relate to a pressing device and a scribing device, so that automatic integrated operation can not be carried out on a semiconductor wafer in the using process, meanwhile, the traditional equipment driving device is manual, more manpower and time cost are wasted in the using process, and the equipment is inconvenient to use on a production line due to low efficiency. Disclosure of Invention The invention aims to solve the technical problems that a traditional equipment production line cannot be aligned, pressed and cut integrally, and a driving device is low in efficiency caused by manual operation, so that a positioning scribing mechanism for a semiconductor wafer is provided. The invention relates to a positioning scribing mechanism for a semiconductor wafer, which comprises a base, wherein an air cylinder is arranged at the bottom of the base, the top of the air cylinder is connected with a mounting plate, one side of the mounting plate is movably connected with a positioning clamp I, the other side of the mounting plate is movably connected with a positioning clamp II, the top of the positioning clamp I is detachably and horizontally connected with an alignment piece, the top of the positioning clamp II is provided with a detachable connection clamping piece, and the alignment piece and the clamping piece are used for clamping alignment of a plurality of layers of semiconductor wafers; the top of the base is provided with a belt component, and a semiconductor wafer is placed on the top of the belt component; the feeding and discharging positions of the belt assemblies are vertically provided with guide rails which are matched with the ball screw assemblies to move, the bottoms of the ball screw assemblies are provided with tool bits, one sides of the ball screw assemblies are provided with driving devices, and the driving devices move the tool bits in the horizontal direction through the ball screw assemblies; The tool bit passes through tool bit cylinder and connects ball screw assembly, and tool bit cylinder control tool bit carries out vertical direction motion. Through setting up the base, the base can provide support and the protection of whole installation for other spare part, through setting up the bottom installation cylinder in the base, the cylinder can provide the power supply that is used for location and clamp operation, through setting up cylinder top connection mounting panel, the mounting panel can provide the installation space, install the operation for other spare part, through setting up mounting panel one side swing joint positioning fixture I, positioning fixture I can be used for the alignment operation of semiconductor wafer, through setting up mounting panel opposite side swing joint pos