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CN-117227274-B - High-performance copper-aluminum interface eutectic composite material and preparation method thereof

CN117227274BCN 117227274 BCN117227274 BCN 117227274BCN-117227274-B

Abstract

The high-performance copper-aluminum interface eutectic composite material comprises an aluminum plate and a copper plate, wherein the aluminum plate is a base layer, an upper copper plate and a lower copper plate are used as coating layers, a eutectic layer is formed between the aluminum plate and the upper copper plate and between the aluminum plate and the lower copper plate, the aluminum plate comprises, by weight, 0.04-0.25% of Si, 0.1-0.3% of Fe, 0.15% of Ti, the balance of Al and unavoidable impurities, and the copper plate comprises, by weight, pb <0.03%, fe <0.1% and the balance of Cu and unavoidable impurities. And provides a preparation method of the high-performance copper-aluminum interface eutectic composite material. The invention has higher shearing strength and peeling strength, can realize metallurgical bonding between composite metals to form a eutectic layer, can meet the bonding strength of materials, and has simpler, more economical and more efficient preparation method compared with the existing production mode of composite materials.

Inventors

  • Yang Peiliu
  • Lu Caiju
  • WANG TAO
  • SONG YABO
  • XU YINCHANG
  • Zhai Pixian

Assignees

  • 慈溪驰马金属制品有限公司

Dates

Publication Date
20260508
Application Date
20230810

Claims (7)

  1. 1. The high-performance copper-aluminum interface eutectic composite material comprises an aluminum plate and an upper copper plate and a lower copper plate, wherein the aluminum plate is used as a base layer, the upper copper plate and the lower copper plate are used as a coating layer, and the eutectic composite material is characterized in that a eutectic layer is formed between the aluminum plate and the upper copper plate and between the lower copper plate, the aluminum plate comprises, by weight, 0.04-0.25% of Si, 0.1-0.3% of Fe, 0.15% of Ti, the balance of Al and unavoidable impurities, the copper plate comprises, by weight, pb <0.03%, fe < 0.1% and the balance of Cu and unavoidable impurities, the eutectic layer comprises, by weight, al 2 Cu、Al 4 Cu 9 , the interface layer thickness of the eutectic layer is 300-500nm, the conventional shear strength of the eutectic composite material is 75-80 MPa, the conventional peel strength is 140-170 KPa, the tensile strength of the eutectic composite material is more than 202MPa at room temperature, the shear strength of 80-85 MPa after 24h, the peel strength of 80-85 KPa after 24h at high temperature is 300 ℃ and the elongation of the eutectic composite material after breaking is 15%.
  2. 2. The high-performance copper-aluminum interface eutectic composite material according to claim 1, wherein the aluminum plate is 1050, 1060, 1100, 8011 or 3003 aluminum, the aluminum content is greater than 98% of the aluminum, the thickness range is 6-16 mm, the copper plate is T2 copper or brass, and the thickness range is 5-35% of the thickness of the composite plate.
  3. 3. The high-performance copper-aluminum interface eutectic composite material according to claim 1 or 2, wherein the thickness ratio of the copper plate to the aluminum plate is 1 (2-20).
  4. 4. A method of preparing a high performance copper aluminum interfacial eutectic composite material in accordance with claim 1, said method comprising the steps of: 1) The copper plate surface pretreatment comprises the steps of firstly, carrying out high-pressure flushing on the copper plate to quickly remove solid impurities on the surface of the copper plate, then carrying out low-pressure flushing on the copper plate, degreasing the copper plate with 50-70 ℃ alkaline degreasing liquid serving as flushing fluid to remove grease on the surface of the copper plate, polishing off an oxide layer on the surface of the copper plate through steel brush equipment, and finally drying the copper plate for later use; 2) Preheating a copper plate, namely fixing the pretreated copper plate onto feeding equipment, and heating the copper plate to 150-220 ℃ in an oxygen-free environment to form a thicker eutectic layer; 3) Heating an aluminum ingot to 660-710 ℃ to obtain molten aluminum liquid, then introducing inert gas near a roller to fully fill the casting and rolling environment to form an anaerobic environment, heating the outer surface of the roller to 85-95 ℃, introducing cooling liquid into the roller to increase the cooling speed of casting and rolling to form smaller grains, starting casting and rolling equipment, enabling the molten aluminum liquid to contact with a processed copper plate in the anaerobic environment to realize solid-liquid composite anaerobic continuous casting and rolling, and finally obtaining a copper-aluminum composite slab, wherein the composite rate after solid-liquid composite casting and rolling is 100%; 4) Homogenizing and annealing the composite slab, namely putting the obtained copper-aluminum composite slab into an annealing furnace for homogenizing and annealing; 5) Cold rolling, namely performing secondary rolling on the annealed composite plate blank, and adjusting rolling equipment to obtain a required plate thickness and a required plate width, wherein the plate thickness after final secondary rolling is 0.2-16 mm, the thickness of the copper plate is 5-35% of the thickness of the whole composite plate, and the plate width is 600-1200 mm; 6) And (3) secondary annealing, namely, finally, carrying out secondary annealing on the copper-aluminum composite board subjected to cold rolling, refining grains, adjusting the structure and eliminating the structural defects.
  5. 5. The method according to claim 4, wherein in the homogenizing annealing process of step 4), the heating temperature is 430 ℃ to 510 ℃ and the annealing time is 4 to 5 hours.
  6. 6. The method according to claim 4 or 5, wherein in the secondary annealing process of step 6), the heating temperature is 300 ℃ to 350 ℃ and the temperature is cooled to 80 ℃ or lower in an annealing furnace.
  7. 7. The method according to claim 4 or 5, wherein in the step 3), the inert gas is nitrogen, the rolling speed of the rolls in the solid-liquid composite casting is 600-1300 mm/min, the temperature of the cooling liquid is 20-30 ℃, and the cooling rate is 300-1000 ℃.

Description

High-performance copper-aluminum interface eutectic composite material and preparation method thereof Technical Field The invention relates to the field of bimetal composite materials, in particular to a copper-aluminum interface eutectic composite material with good tensile strength, high peel strength and good conductivity and a preparation method thereof. Background The aluminum composite material is a lightweight and high-performance layered composite conductor material with an outer layer of copper and an inner layer of aluminum or aluminum alloy, and combines excellent conductivity of copper with outstanding lightweight characteristics and cost advantages of aluminum. The main preparation methods of the copper-aluminum composite board mainly comprise three methods, namely a solid-solid composite method, a liquid-liquid composite method and a solid-liquid composite method according to the basic state of a matrix during combination. There are basically two types of solid-solid composites, one is rolling composite and one is explosive composite. The rolling compounding method has the advantages that after the surfaces of two metals are processed, mechanical occlusion is formed under the action of rolling force, and then metallurgical bonding is formed through diffusion annealing. The liquid-liquid compounding method adopts double-crystallizer continuous casting compounding to ensure that the copper-aluminum interface is easier to achieve metallurgical bonding, but the copper-aluminum interface of the product is too thick, the equipment structure is complex, the investment is large, the product size is relatively single, the process is complex and the stability is poor. The solid-liquid compounding method can shorten the preparation process flow, save energy and reduce cost, but the current solid-liquid compounding method can not produce copper-aluminum composite boards with good interface bonding performance, and the thickness of the eutectic layer of the produced composite boards is not ideal. The eutectic composition can adjust the morphology and the size of the structure by changing the proportion of the components and the solidification condition, so that the optimization of the mechanical property is realized, the synergistic effect among different components can be utilized to improve the strength, the toughness, the wear resistance, the corrosion resistance and the like, and the diversity and the complexity of the components can be increased by introducing the concept of high-entropy alloy, so that the ultra-high-strength plasticity is realized. Therefore, there is a need to provide a method for preparing a copper-aluminum composite material capable of producing a eutectic layer, so as to ensure that the copper-aluminum composite material has good interface bonding and excellent performance. Disclosure of Invention In order to overcome the defects of low composite strength, poor product performance, high production cost and low production efficiency of the conventional bimetal composite plate, the invention provides the high-performance copper-aluminum interface eutectic composite plate with higher shear strength and peeling strength, and simultaneously provides a simple, economic and efficient preparation method of the copper-aluminum eutectic composite material. The technical scheme adopted for solving the technical problems is as follows: The high-performance copper-aluminum interface eutectic composite material comprises an aluminum plate and a copper plate, wherein the aluminum plate is a base layer, an upper copper plate and a lower copper plate are used as coating layers, a eutectic layer is formed between the aluminum plate and the upper copper plate and between the aluminum plate and the lower copper plate, the aluminum plate comprises, by weight, 0.04-0.25% of Si, 0.1-0.3% of Fe, 0.15% of Ti, the balance of Al and unavoidable impurities, and the copper plate comprises, by weight, pb <0.03%, fe < 0.1% and the balance of Cu and unavoidable impurities. Further, the aluminum plate is 1050, 1060, 1100, 8011 or 3003 aluminum, the aluminum content is greater than 98%, the thickness range is 6-16 mm, the copper plate is T2 copper or brass, and the thickness range is 5-35% of the thickness of the composite plate. Preferably, the thickness ratio of the copper plate to the aluminum plate is 1 (2-20). Further, the eutectic layer compound comprises Al 2Cu、Al4Cu9, wherein the interface layer thickness of the eutectic layer is 300-500nm, and the crystal phase test recombination rate is more than 40%. Preferably, the eutectic composite material has a conventional shear strength of 75-80 MPa, a conventional peel strength of 140-170 KPa, a tensile strength of >202MPa at room temperature, a shear strength of 80-85 MPa after a high temperature of 300 ℃ for 24h, a peel strength of 80-85 KPa after a high temperature of 300 ℃ for 24h, and an elongation after break of >15%. The preparation method of the high-pe