CN-117232415-B - Substrate detection method and detection device thereof

CN117232415BCN 117232415 BCN117232415 BCN 117232415BCN-117232415-B

Abstract

The invention provides a substrate detection method and a substrate detection device. The detection device comprises a bottom plate, a distance measuring unit and a processing unit, wherein the bottom plate is provided with a suction mechanism. The detection device is provided with an attraction detection mode and a direct detection mode, wherein the attraction detection mode is that an attraction mechanism is started and attracts the substrate placed on the bottom plate, the attraction thickness of the substrate is calculated through the processing unit, the direct detection mode is that the attraction mechanism is closed to stop attracting the substrate placed on the bottom plate, the direct thickness of the substrate is calculated through the processing unit, and finally, the processing unit calculates and generates a warping value of the substrate according to the direct thickness and the attraction thickness, and the warping value is used for representing the warping degree of the substrate. Therefore, the detection device is matched with the detection method, the influence of the thickness difference of the substrate on the detection of the warping degree is eliminated, and the detection device has wide applicability and high accuracy.

Inventors

WEI RUCHAO
CHEN DONGLIN
LIAO QIKAI

Assignees

超能高新材料股份有限公司

Dates

Publication Date: 20260505
Application Date: 20220607

Claims (10)

1. The detection method of the substrate is applied to an environment for detecting the substrate by using a detection device, the detection device comprises a bottom plate, a ranging unit and a processing unit, the bottom plate is provided with a suction mechanism and a suction surface, the bottom plate is coupled with the ranging unit, the processing unit is coupled with the ranging unit, and the detection method comprises the following steps: a preparation step of placing the substrate on the suction surface of the base plate; a suction step of starting and sucking the substrate placed on the bottom plate by the suction mechanism so that the substrate and the suction surface are parallel to each other; An attraction ranging step, wherein the ranging unit is started to sense the distance between the ranging unit and the substrate, and generates at least one attraction ranging signal to be transmitted to the processing unit; an attraction thickness calculation step in which the processing unit calculates an attraction thickness of the substrate from the attraction distance measurement signal; A closing suction step of closing the suction mechanism to stop suction of the substrate placed on the base plate, and A warp value calculation step, wherein the processing unit calculates and generates a warp value of the substrate according to the direct thickness and the suction thickness, and the warp value is used for representing the warp degree of the substrate; Wherein the detection method further comprises, before the suction step or after the suction closing step: A direct ranging step, wherein the ranging unit is started to sense the distance between the ranging unit and the substrate, the ranging unit generates at least one direct ranging signal and transmits the signal to the processing unit, and And a direct thickness calculation step, wherein the processing unit calculates the direct thickness of the substrate according to the direct ranging signal.
2. The inspection method according to claim 1, wherein the substrate has a predetermined thickness, the inspection method further comprising a thickness difference calculating step, wherein the processing unit performs a subtraction operation according to the suction thickness and the predetermined thickness to generate a thickness difference.
3. The detection method according to claim 1, wherein the ranging unit includes at least one light emitter and at least one light sensor, and the attraction ranging step includes the following steps: an attracting emission step of emitting a light beam toward the substrate by the light emitter of the distance measuring unit and generating an attracting emission signal to the processing unit, and An attraction sensing step, wherein the light sensor of the ranging unit senses the light beam reflected by the substrate and generates an attraction sensing signal to the processing unit; wherein, in the attraction thickness calculating step, the processing unit calculates the attraction thickness of the substrate according to the time when the attraction emission signal is generated and the time when the attraction sensing signal is generated.
4.A detection method according to claim 3, wherein the direct ranging step comprises the steps of: a direct emission step of emitting the light beam toward the substrate by the light emitter of the ranging unit and generating a direct emission signal to the processing unit; a direct sensing step, in which the light sensor of the ranging unit receives the light beam reflected by the substrate and generates a direct sensing signal to the processing unit; Wherein, in the direct thickness calculating step, the processing unit calculates the direct thickness of the substrate according to the time of the generation of the direct emission signal and the time of the generation of the direct sensing signal.
5. A substrate inspection apparatus for use in an environment for inspecting a substrate, the inspection apparatus comprising: a base plate having an attracting surface on which the substrate is placed and an attracting mechanism for attracting the substrate; A ranging unit coupled to the base plate for sensing a distance between the ranging unit and the substrate, and A processing unit coupled to the ranging unit; The detection device is provided with an attraction detection mode and a direct detection mode, wherein the attraction detection mode is that the attraction mechanism is started and attracts the substrate placed on the bottom plate, the distance measurement unit is started to sense the distance between the distance measurement unit and the substrate, the distance measurement unit generates at least one attraction distance measurement signal and transmits the attraction distance measurement signal to the processing unit, the processing unit calculates the attraction thickness of the substrate according to the attraction distance measurement signal, the direct detection mode is that the attraction mechanism is closed to stop attracting the substrate placed on the bottom plate, the distance measurement unit is started to sense the distance between the distance measurement unit and the substrate, the distance measurement unit generates at least one direct distance measurement signal and transmits the direct thickness of the substrate to the processing unit, the processing unit generates a warping value of the substrate according to the direct thickness and the attraction thickness calculation, and the warping value is used for representing the warping degree of the substrate.
6. The inspection apparatus according to claim 5, wherein the substrate has a predetermined thickness, and the processing unit performs a subtraction operation according to the suction thickness and the predetermined thickness to generate a thickness difference.
7. The detecting device according to claim 5, wherein the ranging unit comprises at least one light emitter and at least one light sensor, when the detecting device is in a suction detecting mode, the light emitter of the ranging unit emits a light beam towards the substrate and generates a suction emission signal to the processing unit, the light sensor of the ranging unit senses the light beam reflected by the substrate and generates a suction sensing signal to the processing unit, the processing unit calculates the suction thickness of the substrate according to the time generated by the suction emission signal and the time generated by the suction sensing signal, and when the detecting device is in a direct detecting mode, the light emitter of the ranging unit emits the light beam towards the substrate and generates a direct emission signal to the processing unit, the light sensor of the ranging unit receives the light beam reflected by the substrate and generates a direct sensing signal to the processing unit, and the processing unit calculates the direct thickness of the substrate according to the time generated by the direct emission signal and the time generated by the direct sensing signal.
8. The inspection device of claim 5, wherein the substrate is a ceramic substrate.
9. The detection device according to claim 5, wherein the attraction mechanism includes: A plurality of air-sucking holes provided on the suction surface of the base plate, and And the vacuumizing element is coupled with the plurality of vacuumizing holes and is started to generate negative pressure to attract the substrate placed on the attraction surface, so that the substrate and the attraction surface are parallel to each other.
10. The detection apparatus according to claim 5, wherein the distance measuring unit includes a light collimation path lens group, a dispersion lens group, and a dispersion light receiving group, and the processing unit calculates the distance between the distance measuring unit and the base plate by chromatic confocal displacement sensing.

Description

Substrate detection method and detection device thereof Technical Field The present invention relates to a detection device, and more particularly, to a method and a device for detecting a substrate. Background Alumina ceramic substrate is the most widely used inorganic nonmetallic substrate material in the industries of semiconductors, electronics and the like because of its good heat conduction performance, higher mechanical strength, excellent insulating performance and high cost performance with great application value. Especially, the high-power high-brightness LED and insulated gate bipolar transistor have very wide application prospect when being used as an insulated radiating substrate. With the development of packaging technology of light emitting diodes and insulated gate bipolar transistors, there is an increasing demand for large-sized, high-flatness, high-surface-quality ceramic substrates that can improve the circuit printing efficiency and heat dissipation efficiency. At present, the molding process for industrially producing the alumina ceramic substrate in batch mainly comprises casting molding, powder pressing molding and gel casting molding. When the multilayer ceramic substrate is manufactured by the process described above, the multilayer ceramic substrate can be manufactured with high dimensional accuracy in the main surface direction. However, the multilayer ceramic substrate may be warped during the firing step due to the influence of the distribution of conductor portions such as conductor films and via conductors in the green ceramic laminate to be the multilayer ceramic substrate, and the influence of factors such as the thickness and composition of the ceramic green layer. Particularly, when the surface conductor film is located on the main surface of the green ceramic laminate, warpage is likely to be greatly affected. Chinese patent No. CN104475353 discloses a board warpage detector, which comprises a frame, a first feeding device, a control device, a detection device, a sorting device, a second feeding device and a receiving device, wherein the first feeding device, the control device, the detection device, the sorting device, the second feeding device and the receiving device are respectively and fixedly connected with the frame, the detection device is arranged above the first feeding device, the sorting device is arranged between the first feeding device and the second feeding device, the receiving device is arranged at the tail end of the frame, the first feeding device, the detection device, the sorting device, the second feeding device and the receiving device are respectively and electrically connected with the control device, and the board warpage detector can detect the warpage of a copper-clad plate and a circuit board and automatically separate qualified products with the warpage less than or equal to a set standard value from unqualified products with the warpage greater than the set standard value. However, the above-mentioned plate warpage detector has a disadvantage in that when there is a thickness difference in the ceramic substrate, the above-mentioned warpage detector cannot determine whether there is a thickness difference in the ceramic substrate or eliminate the influence of the thickness difference on the warpage measurement, and thus cannot accurately measure whether there is a warpage in the plate. Accordingly, the present inventors have made the present invention after observing the above-described deficiency. Disclosure of Invention The invention aims to provide a substrate detection method, which is characterized in that a substrate placed on a bottom plate is started and attracted through an attraction mechanism, a ranging unit is started to generate a ranging signal and transmit the ranging signal to a processing unit, the attraction thickness of the substrate is calculated through the processing unit, then the attraction mechanism is closed to stop attracting the substrate placed on the bottom plate, the ranging unit is started to generate the ranging signal and transmit the ranging signal to the processing unit, the direct thickness of the substrate is calculated through the processing unit, and finally the processing unit calculates and generates a warping value of the substrate according to the direct thickness and the attraction thickness, wherein the warping value is used for representing the warping degree of the substrate. Therefore, the influence of the thickness difference of the substrate on the detection of the warping degree is successfully eliminated, and the detection can be realized only by performing one-time subtraction operation through the processing unit, so that the method is very suitable for detection in mass production, and has wide applicability and high accuracy. The invention provides a substrate detection method, which is applied to an environment for detecting a substrate by utilizing a detection device, wherein the d