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CN-117245951-B - Method for preparing integrated high-thermal-conductivity layered material electronic packaging heat dissipation silicon rubber gasket based on stripping

CN117245951BCN 117245951 BCN117245951 BCN 117245951BCN-117245951-B

Abstract

The invention relates to a method for preparing an integrated high-thermal conductivity layered material electronic packaging heat dissipation silicon rubber gasket based on stripping, which is characterized in that polydopamine modified boron nitride or graphite powder, silicon rubber, a silane coupling agent and a double-five vulcanizing agent are placed into a three-roller mixer for mixing, the roller spacing is reduced, the mixing time is prolonged, the silicon rubber gasket for high-heat-conductivity electronic packaging heat dissipation is obtained by peeling boron nitride or graphite powder in the composite material under the action of roller shearing force, placing the mixed mixture in a metal mold, performing vacuum hot-pressing vulcanization, and then performing secondary vulcanization.

Inventors

  • GONG HONGYU
  • SHENG MINGMING
  • ZHANG YUJUN

Assignees

  • 山东大学

Dates

Publication Date
20260505
Application Date
20230809

Claims (10)

  1. 1. A method for preparing a silicon rubber gasket for electronic packaging and heat dissipation of an integrated high-thermal-conductivity layered material based on stripping comprises the following steps: 1) Preparing polydopamine modified powder: Adding Tris into deionized water, regulating the pH of the solution to obtain a Tris buffer solution, dispersing dopamine hydrochloride in the Tris buffer solution, immersing boron nitride powder or graphite powder into the mixed solution, stirring, and carrying out suction filtration, washing and drying on the solution to obtain polydopamine modified boron nitride or graphite powder; 2) The method comprises the steps of placing polydopamine modified boron nitride or graphite powder, silicon rubber, a silane coupling agent and a double-penta vulcanizing agent into a three-roller mixer for mixing, wherein the roller spacing of the three-roller mixer is 10-100 mu m, the mixing time is 2-48h, the roller spacing is reduced, the mixing time is prolonged, the boron nitride or graphite powder is peeled off in a composite material under the action of roller shearing force, the mixed mixture is placed into a metal mold, and then the silicon rubber gasket for high-heat conductivity electronic packaging heat dissipation is obtained after vacuum hot-press vulcanization.
  2. 2. The method according to claim 1, wherein in step 1), the mass to volume ratio of Tris to deionized water is (1.5-2.5): (1500-2500), unit, g/mL, and the pH of the solution is adjusted to 8-9.
  3. 3. The method according to claim 1, wherein in step 1), dopamine hydrochloride is added in an amount of 1-2.5mg/mL (Tris buffer).
  4. 4. The method according to claim 1, wherein in step 1), the particle size of the boron nitride powder is 5 to 50 μm and the particle size of the graphite powder is 10 to 150 μm.
  5. 5. The method according to claim 1, wherein in step 1), the boron nitride or graphite powder is added in an amount of 40-60g/L (Tris buffer), the stirring reaction temperature is 40-60 ℃, and the reaction time is 6-10 hours.
  6. 6. The method of claim 1, wherein in step 2), the silicone rubber is a high viscosity silicone rubber selected from the group consisting of methyl vinyl silicone rubber and methyl vinyl phenyl silicone rubber.
  7. 7. The method according to claim 6, wherein in step 2), the vinyl content in the methyl vinyl silicone rubber is 5 to 50mol% and the phenyl content in the methyl vinyl phenyl silicone rubber is 10 to 80mol%.
  8. 8. The method according to claim 1, wherein in the step 2), the coupling agent is KH550, KH560, KH570 or BTMOS, and the mass ratio of the polydopamine modified powder, the silicone rubber, the silane coupling agent and the bis-penta vulcanizing agent is (100-150): 1-10): 1-3.
  9. 9. The method according to claim 1, wherein in step 2), the roll spacing is 30 to 60 μm, the kneading temperature is 25 to 40 ℃, the roll speed is 30 to 150rpm/min, and the kneading time is 20 to 48 hours.
  10. 10. The method according to claim 1, wherein in the step 2), the vacuum hot press vulcanization pressure is 8-12MPa, the hot press temperature is 150-180 ℃, the hot press time is 15-30 minutes, the secondary vulcanization temperature is 200-250 ℃, and the vulcanization time is 1-2 hours.

Description

Method for preparing integrated high-thermal-conductivity layered material electronic packaging heat dissipation silicon rubber gasket based on stripping Technical Field The invention relates to a method for preparing a silicon rubber gasket for electronic packaging and heat dissipation of an integrated high-thermal-conductivity layered material based on stripping, belonging to the technical field of chip heat dissipation and packaging. Background With the progress of 5G technology, electronic products are being miniaturized, highly integrated and high-power, and meanwhile, the heat dissipation requirements are also higher and higher. If the heat of the electronic device cannot be timely dissipated, the service life performance of the product is affected slightly, and the device is invalid and causes safety problems, so that the preparation of the composite material with high heat conductivity is urgently needed to ensure effective heat dissipation and normal operation of the device. The traditional metal-based heat conduction material has large density and large surface roughness, so that the application scene of the material is limited. The polymer-based heat-conducting composite material is a heat-conducting material for chip heat dissipation, which is popular at present because of low density, good processability and good flexibility and packaging property. At present, a common method for preparing the composite material for the high-heat-conductivity electronic packaging is to add a heat-conducting filler to enhance the heat conductivity, and the process is simple and is suitable for mass production. The heat conductive filler includes carbon filler including graphite, graphene nanoplatelets and carbon nanotubes, and inorganic filler including Al 2O3, siN and AlN, which have been successfully filled into various polymer matrices. Graphene and white graphene (BN nano-sheets) become ideal heat conduction fillers due to the characteristics of extremely high heat conductivity, high transverse-longitudinal ratio and the like. However, the graphene and boron nitride nano-sheets have complex stripping process, lower yield and difficult dispersion, so that the doped composite material has high cost and is difficult to put into practical application on a large scale, and even if the graphene and boron nitride nano-sheets can be dispersed, the composite material for heat dissipation of the boron nitride nano-sheets/graphene polymer-based chip with high heat conductivity cannot be obtained due to thicker graphene and boron nitride nano-sheets. Therefore, the development of the composite material for heat dissipation of the high-thermal-conductivity boron nitride nanosheets/graphene polymer-based chips, which is low in cost and simple in process, has important significance. Disclosure of Invention Aiming at the problems that the existing stripping process of graphene and boron nitride nano sheets is complex, the yield is low and the dispersion is difficult, and even if the graphene and boron nitride nano sheets can be dispersed, the composite material for heat dissipation of the high-heat-conductivity boron nitride nano sheets/graphene polymer-based chip cannot be obtained due to thicker sheets, the invention provides a method for preparing an integrated high-heat-conductivity layered material electronic packaging heat dissipation silicon rubber gasket based on stripping. The invention is realized by the following technical scheme: a method for preparing a silicon rubber gasket for electronic packaging and heat dissipation of an integrated high-thermal-conductivity layered material based on stripping comprises the following steps: 1) Preparing polydopamine modified powder: Adding Tris into deionized water, regulating the pH of the solution to obtain a Tris buffer solution, dispersing dopamine hydrochloride in the Tris buffer solution, immersing boron nitride powder or graphite powder into the mixed solution, stirring, and carrying out suction filtration, washing and drying on the solution to obtain polydopamine modified boron nitride or graphite powder; 2) The method comprises the steps of placing polydopamine modified boron nitride or graphite powder, silicon rubber, a silane coupling agent and a double-penta vulcanizing agent into a three-roller mixer for mixing, wherein the roller spacing of the three-roller mixer is 10-100 mu m, the mixing time is 2-48h, the roller spacing is reduced, the mixing time is prolonged, the boron nitride or graphite powder is peeled off in a composite material under the action of roller shearing force, the mixed mixture is placed into a metal mold, and then the silicon rubber gasket for high-heat conductivity electronic packaging heat dissipation is obtained after vacuum hot-press vulcanization. According to the invention, in the step 1), the mass volume ratio of Tris to deionized water is (1.5-2.5): (1500-2500), unit, g/mL, and the pH of the solution is adjusted to 8-9. According t