CN-117252837-B - Data processing method and device for wafer test, medium and electronic equipment

CN117252837BCN 117252837 BCN117252837 BCN 117252837BCN-117252837-B

Abstract

The application provides a data processing method, a device, a medium and electronic equipment for wafer testing. According to the method, first, reference information of any shape is generated according to a small number of detection points meeting requirements and test marks on corresponding detection points of any shape in a test target, then all the detection points and the test marks of the shape in a wafer are analyzed through the reference information of the shape, and detection point information and test mark information meeting the reference information are screened out from the reference information and serve as preparation data. The generated reference information not only comprises a first length-width ratio value range for judging the detection point and a second length-width ratio value range for judging the test trace, but also comprises a position relation range of the detection point and the test trace. By taking the range in various constraint conditions as an analysis basis, erroneous judgment and missed judgment can be effectively avoided, and the analysis precision is improved. By the method, the time for processing the data is saved, the testing efficiency is improved, and the problem of inefficiency of manual processing is solved.

Inventors

ZHOU YUHONG
Mao Fangdi
ZHANG WENCAI
XU LI
WU FUCUN

Assignees

宁波工程学院
捷信（浙江）通信技术有限公司

Dates

Publication Date: 20260508
Application Date: 20230922

Claims (7)

1. A method for processing data for wafer testing, comprising: After any test target in the wafer is subjected to trial puncture, a first image is obtained through an image device, wherein the first image is matched with a first area photographed by the image device in a preset plane coordinate system; Determining first detection information of a plurality of first detection points of any shape and first test trace information of a plurality of first test traces on the corresponding first detection points based on the first region position of the first region and the first image, wherein the first detection points meet preset first detection conditions, and the first test traces meet preset second detection conditions; determining reference information of the shape in a preset plane coordinate system based on first detection information of the first detection points and first test trace information of the first test traces; Analyzing second detection information of all second detection points of the shape in the wafer and second test trace information corresponding to second test traces on the second detection points based on the reference information; When the second detection information of any second detection point and the second test trace information corresponding to the second test trace on the second detection point meet the reference information, determining the second detection information of the second detection point and the second test trace information corresponding to the second test trace of the second detection point as preparation data; the first detection information of each first detection point comprises a detection point area position corresponding to a detection point area occupied by the first detection point in a preset plane coordinate system and a first aspect ratio value of the detection point area corresponding to the first detection point; The first test trace information of each first test trace comprises a trace area position of a trace area corresponding to the first test trace in a preset plane coordinate system and a second length-width ratio value of the trace area corresponding to the first test trace; the determining the reference information of the shape in the preset plane coordinate system based on the first detection information of the first detection points and the first test trace information of the first test traces includes: Obtaining a position relation range in the reference information based on the detection point area positions of the plurality of first detection points and the trace area positions of the plurality of first test traces; obtaining a first aspect ratio value range in the reference information based on the first aspect ratio values of the first detection points; Obtaining a second aspect ratio value range in the reference information based on the second aspect ratio values of the plurality of first test traces; The obtaining the position relation range in the reference information based on the detection point area positions of the plurality of first detection points and the trace area positions of the plurality of first test traces includes: Obtaining a first distance value and a first included angle value of a first straight line and a preset coordinate axis in a preset plane coordinate system based on a detection point area position of any first detection point and a trace area position of any first test trace, wherein the first straight line passes through the detection point area position of the first detection point and the trace area position of the first test trace; and determining a first range of angles in the range of positional relationships based on all the first range values.
2. The method of claim 1, wherein determining first detection information for a number of first detection points of any shape and first test trace information for a first test trace on a corresponding first detection point based on the first region location and the first image comprises: Determining a first detection image of a plurality of first detection points of any shape and a first test trace image corresponding to a first test trace on the first detection points based on the first image; acquiring first detection information of each first detection point based on the first region position and the first detection image of each first detection point in the first image, and And acquiring first test trace information corresponding to the first test trace based on the first region position and the first test trace image of each first test trace in the first image.
3. The method of claim 2, wherein the acquiring first detection information for each first detection point based on the first region location and the first detection image for each first detection point in the first image comprises: Determining a first image area of any first detection image in the first image, wherein the first image area is a minimum rectangular area containing the first detection image, and any side of the first image area is parallel to any side of the first image; determining a detection point area of a first detection image in a preset plane coordinate system based on the first area position and the first image area, wherein any side of the detection point area is parallel to one coordinate axis of the preset plane coordinate system; Determining the position of a preset azimuth angle of the detection point area as the position of the detection point area; the first aspect ratio value is obtained based on the checkpoint area.
4. The method of claim 2, wherein the acquiring first test trace information corresponding to the first test trace based on the first region location and the first test trace image of each first test trace in the first image comprises: determining a second image area of any first test trace image in the first image, wherein the second image area is a smallest rectangular area containing the first test trace image, and any side of the second image area is parallel to any side of the first image; Determining a trace area of a first test trace image in a preset plane coordinate system based on the first area position and the second image area, wherein any side of the trace area is parallel to one coordinate axis of the preset plane coordinate system; Determining the position of a preset azimuth angle of the trace area as the trace area position; the second aspect ratio value is obtained based on the trace region.
5. A data processing apparatus for wafer testing, comprising: the image shooting unit is used for acquiring a first image through the image device after any test target in the wafer is subjected to trial puncture, wherein the first image is matched with a first area photographed by the image device in a preset plane coordinate system; An information determining unit, configured to determine first detection information of a plurality of first detection points of any shape and first test trace information of a plurality of first test traces on the corresponding first detection points based on a first area position of the first area and the first image, where the first detection points meet a preset first detection condition, and the first test traces meet a preset second detection condition; the first detection information of each first detection point comprises a detection point area position corresponding to a detection point area occupied by the first detection point in a preset plane coordinate system and a first length-width ratio value of the detection point area corresponding to the first detection point; The standard determining unit is used for determining the reference information of the shape in a preset plane coordinate system based on the first detection information of the first detection points and the first test trace information of the first test traces, determining the reference information of the shape in the preset plane coordinate system based on the first detection information of the first detection points and the first test trace information of the first test traces, and comprises the steps of obtaining a position relation range in the reference information based on the detection point area positions of the first detection points and the trace area positions of the first test traces, obtaining a first length-width ratio value range in the reference information based on the first length-width ratio value of the first detection points, obtaining a second length-width ratio value range in the reference information based on the second length-width ratio value of the first test traces, obtaining a position relation range in the reference information based on the detection point area positions of the first detection points and the first test trace area positions of the first test traces, and determining a position relation range in the first coordinate system based on any first coordinate system, and all the first coordinate range of the first length-width ratio value and the first coordinate system, and determining a position relation range in the first coordinate system based on any first length-width ratio value; An analysis unit configured to analyze second detection information of all second detection points of the shape in the wafer and second test trace information corresponding to second test traces on the second detection points based on the reference information; The data determining unit is used for determining second detection information of any second detection point and second test trace information of the second test trace corresponding to the second detection point as preparation data when the second detection information of the second detection point and the second test trace information of the second test trace corresponding to the second detection point meet the reference information.
6. A computer readable storage medium, on which a computer program is stored, characterized in that the program, when being executed by a processor, implements the method according to any one of claims 1 to 4.
7. An electronic device, comprising: One or more processors; Storage means for storing one or more programs, Wherein the one or more processors implement the method of any of claims 1 to 4 when the one or more programs are executed by the one or more processors.

Description

Data processing method and device for wafer test, medium and electronic equipment Technical Field The application relates to the technical field of wafer detection, in particular to a data processing method, device, medium and electronic equipment for wafer test. Background Needle testing is a method of inserting probes into test points for testing, and is an important step in wafer testing. The data preparation is an indispensable step in wafer test, and the data preparation is to record the detection point information and the test trace information of the wafer with the test trace for automatic test trace detection. Currently, the data preparation work of wafer test is mainly completed in a manual mode, and the work is time-consuming and tedious and is very prone to error, so that the product yield is seriously affected. Therefore, the present application provides a data processing method for wafer testing, so as to solve one of the above-mentioned problems. Disclosure of Invention The application aims to provide a data processing method, a data processing device, a data processing medium and electronic equipment for wafer testing, which can solve at least one technical problem. The specific scheme is as follows: According to a first aspect of the present application, there is provided a data processing method for wafer testing, including: After any test target in the wafer is subjected to trial puncture, a first image is obtained through an image device, wherein the first image is matched with a first area photographed by the image device in a preset plane coordinate system; determining first detection information of a plurality of first detection points of any shape and first test trace information of first test traces on the corresponding first detection points based on the first region position of the first region and the first image, wherein the first detection points meet preset first detection conditions, and the first test traces meet preset second detection conditions; determining reference information of the shape in a preset plane coordinate system based on first detection information of the first detection points and first test trace information of the first test traces; Analyzing second detection information of all second detection points of the shape in the wafer and second test trace information corresponding to second test traces on the second detection points based on the reference information; When the second detection information of any second detection point and the second test trace information corresponding to the second test trace on the second detection point meet the reference information, determining the second detection information of the second detection point and the second test trace information corresponding to the second test trace of the second detection point as preparation data. According to a second aspect of the present application, there is provided a data processing apparatus for wafer testing, comprising: the image shooting unit is used for acquiring a first image through the image device after any test target in the wafer is subjected to trial puncture, wherein the first image is matched with a first area photographed by the image device in a preset plane coordinate system; An information determining unit, configured to determine first detection information of a plurality of first detection points of any shape and first test trace information corresponding to first test traces on the first detection points based on a first area position of the first area and the first image, where the first detection points meet a preset first detection condition, and the first test traces meet a preset second detection condition; a standard determining unit, configured to determine reference information of the shape in a preset plane coordinate system based on first detection information of the plurality of first detection points and first test trace information of the plurality of first test traces; An analysis unit configured to analyze second detection information of all second detection points of the shape in the wafer and second test trace information corresponding to second test traces on the second detection points based on the reference information; The data determining unit is used for determining second detection information of any second detection point and second test trace information of the second test trace corresponding to the second detection point as preparation data when the second detection information of the second detection point and the second test trace information of the second test trace corresponding to the second detection point meet the reference information. According to a third aspect of the present application, there is provided a computer readable storage medium having stored thereon a computer program which when executed by a processor implements a data processing method of wafer testing as defined in any one of the preceding claims. According to