CN-117259332-B - Dust purging device and method

CN117259332BCN 117259332 BCN117259332 BCN 117259332BCN-117259332-B

Abstract

The invention discloses a dust purging device and method, wherein the device comprises a plasma gas generating device and a purging device, the purging device is provided with a first air inlet, a first exhaust port, a second air inlet, a second exhaust port, a component clamping structure and a purging cavity, the first air inlet, the first exhaust port, the second air inlet and the second exhaust port are all communicated with the purging cavity, the component clamping structure is used for placing a purged component and is provided with a purging opening, the purging opening is communicated with the purging cavity, the first air inlet faces the purging opening, and the first air inlet is connected with the plasma gas generating device and receives plasma gas generated by the plasma gas generating device. The dust blowing device blows dust on the surface of the blown component through plasma gas, so that dust removal of the blown component is realized.

Inventors

LIU GUIYUAN
GU YI
LIU DAFU
SUN DUO
LI XUE

Assignees

无锡中科德芯感知科技有限公司

Dates

Publication Date: 20260508
Application Date: 20220613

Claims (9)

1. A dust purging device is characterized by comprising a plasma gas generating device and a purging device; the purging device is provided with a first air inlet, a first exhaust port and a part clamping structure, and a purging cavity is arranged in the purging device; The first air inlet and the first exhaust outlet are communicated with the purging cavity, the component clamping structure is used for placing a purged component and is provided with a purging opening, the purging opening is communicated with the purging cavity, the first air inlet faces the purging opening, and the first air inlet is connected with the plasma gas generating device and receives the plasma gas generated by the plasma gas generating device; the purging device is further provided with a second exhaust port which is communicated with the purging chamber and is arranged at the bottom of the purging chamber; the purging device is further provided with a second air inlet which is communicated with the purging cavity, and the second air inlet is arranged obliquely above the second discharge outlet and is opposite to the second discharge outlet; The first exhaust port is arranged below the second air inlet and adjacent to the second air inlet; the air outlet route of the first exhaust port is staggered with the air inlet route of the second air inlet; a slope is arranged between the second air inlet and the second exhaust outlet, the second air inlet is positioned at the upper end of the slope, and the second exhaust outlet is positioned at the lower end of the slope; The first air inlet is positioned on the upstream side of the purging opening in the air flow direction, and the first exhaust outlet is positioned on the downstream side of the purging opening; The component clamping structure is obliquely arranged relative to the horizontal direction.
2. The dust purging device as claimed in claim 1, further comprising a suction unit, wherein the first discharge opening and/or the second discharge opening are/is connected to the suction unit.
3. The dust purge apparatus of claim 1, wherein the first exhaust port and the second air inlet port each comprise a plurality of holes, the holes of the first exhaust port being staggered with the holes of the second air inlet port.
4. The dust purge apparatus of claim 1, wherein the first air inlet, the first outlet, or the second air inlet comprises a plurality of holes.
5. The dust purge apparatus of claim 1, wherein the plasma gas generating apparatus comprises a housing provided with an air inlet and an air outlet, and a first stationary electrode and a second stationary electrode provided inside the housing; The first electrostatic electrode is close to the air inlet, and the second electrostatic electrode is close to the air outlet; and a plurality of ash adhering members are further arranged between the first static electrode and the second static electrode.
6. The dust purge apparatus of claim 5, wherein the dust adhering member is detachable with respect to the housing.
7. The dust purge apparatus of claim 5, wherein the dust adhering members are staggered within the housing.
8. The dust purging device of claim 1, wherein the dust purging device is configured to purge dust adsorbed inside the device housing during packaging.
9. A dust blowing method, characterized in that it uses the dust blowing device according to any one of claims 1 to 8 to blow dust of a blown part, comprising the steps of: s1, starting a plasma gas generating device; S2, placing the purged part on a part clamping structure and facing the purging opening; S3, opening a first exhaust port, closing a first air inlet at the moment, and exhausting gas in the purging cavity; S4, closing the first exhaust port, opening the first air inlet, and filling plasma gas into the purging cavity; s5, closing the first air inlet, opening the first exhaust port, and exhausting plasma gas in the purging cavity; s6, closing the first exhaust port, simultaneously opening the second exhaust port and the second air inlet, and cleaning dust on the bottom surface of the purging cavity; S7, closing the second exhaust port, closing the second air inlet and completing a purging period; And S8, repeating the steps S3 to S7 one or more times.

Description

Dust purging device and method Technical Field The invention relates to the field of semiconductor device shell packaging, in particular to a dust blowing device and a dust blowing method. Background With technological advancement and social development, the application of semiconductor devices is more and more widely used in various fields and industries. The photoelectric semiconductor device is a key core component in the fields of monitoring, security, detection and the like, has a wide application scene, and is also a direction of the vigorous development of various high-new enterprises. Due to the special working properties of the photoelectric semiconductor device, the packaging form of the photoelectric semiconductor device which cannot be subjected to injection molding and glue injection according to the traditional logic operation semiconductor device is determined. But rather, the photosensitive surface is exposed and the packaging structure placed in the cavity is required to be used for packaging. The space on the photosurface causes that tiny particles, dust and redundant substances possibly are electrostatically adsorbed on the photosurface, which can shade the photosurface and directly affect the performance index of the device. Therefore, the cleanliness in the packaging process is controlled, and the removal of surface residues is very important for the optoelectronic semiconductor device. The cleanliness of the large environment in the process room is controlled, the important requirement is that personnel are required to be guaranteed to bring less dust, and the generated vibration dust is timely removed, so that the dust can be reduced, but the packaging cleanliness requirement of the photoelectric detector cannot be met. The mode is high in difficulty and high in cost, and the effect of controlling the cleanliness is poor, so that the cleanliness inside the packaging cavity is guaranteed for effectively removing dust adsorbed on the surface of the photoelectric chip. Dust in the small environment inside the processing chamber can be concentrated, so that the inside of the shell can be cleaned more conveniently, and the inside cleanliness can be guaranteed more effectively. Disclosure of Invention The invention aims to overcome the defects of high difficulty and high cost in cleaning dust on the surface of a semiconductor in the prior art, and provides a dust blowing device and a dust blowing method. The invention solves the technical problems by the following technical scheme: A dust purge apparatus includes a plasma gas generating apparatus and a purge apparatus; the purging device is provided with a first air inlet, a first exhaust port and a part clamping structure, and a purging cavity is arranged in the purging device; The first air inlet and the first exhaust port are both communicated with the purging cavity, the component clamping structure is used for placing a purged component and is provided with a purging opening, the purging opening is communicated with the purging cavity, the first air inlet faces the purging opening, and the first air inlet is connected with the plasma gas generating device and receives plasma gas generated by the plasma gas unit. In the scheme, the dust blowing device sprays plasma gas to the surface of the blown component through the first air inlet, positive and negative charges contained in the plasma gas are neutralized with charges contained in dust adsorbed on the surface of the blown component, so that electrostatic adsorption capacity is lost, meanwhile, the dust can be vibrated by kinetic energy brought by blowing, and suspended in the gas of the cavity to form colloid, and then the colloid is discharged through the first discharge port, so that dust removal of the blown component is realized. Preferably, the purging device is further provided with a second exhaust port, and the second exhaust port is communicated with the purging chamber and is arranged at the bottom of the purging chamber. In this solution, a second discharge opening is provided at the bottom of the purge chamber, so that large particles not suspended in the gas can be discharged. Preferably, the dust blowing device further comprises an air suction unit, and the first discharge port and/or the second discharge port are/is connected to the air suction unit. In this scheme, set up the air suction unit and more easily with the colloid that contains the dust and big granule dust in the purge chamber discharge. Preferably, the purging device is further provided with a second air inlet, the second air inlet is communicated with the purging chamber, and the second air inlet is arranged obliquely above the second discharge outlet and is opposite to the second discharge outlet. In this scheme, through setting up the second air inlet just to the second discharge port, can discharge big granule dust more conveniently. Preferably, a slope is arranged between the second air inlet and the