CN-117289409-B - Optical module and optical module plugging structure

CN117289409BCN 117289409 BCN117289409 BCN 117289409BCN-117289409-B

Abstract

The invention discloses an optical module and an optical module plugging structure, wherein the optical module comprises a mounting shell, a circuit board structure and a heat conduction assembly, wherein a mounting cavity is formed in the mounting shell, heat conduction abdication through holes communicated with the mounting cavity are respectively formed in the upper side wall and the lower side wall of the mounting shell, the circuit board structure comprises a power device, the power device is arranged in the mounting cavity, the heat conduction assembly comprises two heat conduction abutting parts, and the two heat conduction abutting parts are mutually matched to compress the upper end face and the lower end face of the power device and are respectively exposed in the corresponding heat conduction abdication through holes. The heat conduction butt part is used for directly conducting the heat of the power device to the external heat dissipation structure, so that the existence of an air gap is reduced, the thermal resistance is reduced, and the heat dissipation efficiency is improved.

Inventors

MAO SEN
LU KAIKAI
Tan Wulie
JIAO YINGHAO
MAO HU

Assignees

广东鸿芯科技有限公司

Dates

Publication Date: 20260508
Application Date: 20230911

Claims (10)

1. An optical module, comprising: the mounting shell is provided with a mounting cavity, and the upper side wall and the lower side wall of the mounting shell are respectively provided with a heat conduction abdication through hole communicated with the mounting cavity; a circuit board structure including a power device arranged in the mounting cavity, and The heat conduction assembly comprises two heat conduction abutting parts, and the two heat conduction abutting parts are mutually matched to compress the upper end face and the lower end face of the power device and are respectively exposed to the corresponding heat conduction abdication through holes.
2. The optical module of claim 1, wherein the mounting cavity is formed with a through-hole extending rearward therethrough, the circuit board structure further comprising: A first circuit board and a second circuit board, wherein the first circuit board is arranged at the front end of the mounting cavity and is used for carrying an optical lens, the second circuit board is arranged at the rear end of the mounting cavity and is provided with a conductive plug part which is adapted to extend out of the plug through hole, and And the conductive soft belt is electrically connected with the power device to the first circuit board and the second circuit board.
3. The optical module of claim 2, wherein the power device comprises a device body and a rigid conductive substrate, the rigid conductive substrate is disposed around the device body, and pins of the device body are soldered to the rigid conductive substrate; the conductive flexible strap electrically connects the rigid conductive substrate to the first circuit board and the second circuit board.
4. The optical module of claim 1, wherein the two thermally conductive relief holes comprise an upper relief hole through an upper sidewall of the mounting cavity, the upper relief hole expanding rearward to a rear end face of the mounting housing; The two heat conduction butt parts comprise upper heat conduction butt parts corresponding to the upper abdication through holes, the upper heat conduction butt parts are provided with upper heat conduction surfaces which are arranged upwards, and the upper heat conduction surfaces are arranged obliquely downwards in the front-to-back direction.
5. The optical module of claim 1, wherein two of the thermally conductive relief holes comprise an upper relief hole in an upper sidewall of the mounting cavity, the upper relief hole expanding rearward to a rear face of the mounting housing; The two heat conduction butt parts comprise upper heat conduction butt parts corresponding to the upper yielding through holes, the upper heat conduction butt parts are provided with upper heat conduction surfaces which are arranged upwards, the upper heat conduction surfaces are provided with a plurality of heat conduction slots, the heat conduction slots are arranged at intervals from left to right, and the heat conduction slots are all penetrated backwards to the rear end surfaces of the upper heat conduction butt parts.
6. The optical module of claim 1, wherein a side relief through hole is formed on each of the left and right side walls of the mounting cavity corresponding to the heat conduction contact portion, the side relief through hole is used for exposing the left and right side ends of the heat conduction contact portion, and a plurality of heat dissipation through holes penetrating left and right are formed on the heat conduction contact portion corresponding to the side relief through hole.
7. The optical module of claim 1, wherein the mounting housing includes an upper housing and a lower housing, corresponding to each of the heat conduction abdication holes, the upper housing is formed with two upper housing side plates disposed opposite left and right, the lower housing is formed with two lower housing side plates disposed opposite left and right, the upper housing side plates and the corresponding lower housing side plates are disposed in overlapping manner in a left-right direction to form an overlapping connection group, each of the heat conduction abdication holes expands to the corresponding overlapping connection group in the left-right direction to form bearing end surfaces at upper and lower ends of the overlapping connection group, respectively, two connection protruding strips extending in a front-rear direction are formed on the bearing end surfaces, and the two connection protruding strips are disposed on the upper housing side plates and the lower housing side plates respectively; The two heat conduction abutting parts are detachably connected, the left end and the right end of each heat conduction abutting part are respectively arranged on the corresponding bearing end faces, and the corresponding two connecting convex strips are provided with matching grooves.
8. An optical module plugging structure, comprising: An optical module comprising an optical module according to any one of claims 1 to 7; the plugging cage is provided with a plugging cavity which is arranged forward and is opened, the plugging cavity is used for accommodating the optical module, two heat dissipation abdication through holes are formed on the upper side wall and the lower side wall of the plugging cavity corresponding to the two heat conduction abdication through holes in a penetrating way, and The heat dissipation assembly comprises two heat dissipation abutting parts, wherein the two heat dissipation abutting parts are arranged on the plugging cage and respectively extend into the corresponding heat dissipation abdication through holes correspondingly to abut against the corresponding heat conduction abutting parts.
9. The optical module mating structure of claim 8, wherein the two thermally conductive abutments comprise an upper thermally conductive abutment having an upwardly disposed upper thermally conductive face, wherein: The upper heat conducting surface is provided with a plurality of heat conducting slots which are arranged at intervals from left to right and are penetrated backwards to the rear end face of the heat conducting abutting part, the two heat radiating abutting parts comprise upper heat radiating abutting parts, the upper heat radiating abutting parts are provided with a plurality of heat radiating convex strips corresponding to the plurality of heat conducting slots, and/or, In the direction from front to back, the upper heat conducting surface is arranged obliquely downwards, and the upper side wall of the plug-in cavity is arranged obliquely corresponding to the upper heat conducting surface.
10. The optical module plugging structure of claim 8, wherein a side relief through hole is formed on the left and right side walls of the mounting cavity corresponding to the heat conduction abutting portion, the side relief through hole is used for exposing the left and right side ends of the heat conduction abutting portion, and a plurality of heat dissipation through holes penetrating left and right are formed on the heat conduction abutting portion corresponding to the side relief through hole; Ventilation abdicating holes are formed on the left side wall and the right side wall of the plug-in cavity corresponding to the plurality of heat dissipation through holes; The heat dissipation assembly further comprises a heat dissipation air pipe, and the heat dissipation air pipe is communicated to the ventilation abdicating hole.

Description

Optical module and optical module plugging structure Technical Field The present invention relates to the field of optical modules, and in particular, to an optical module and an optical module plugging structure. Background With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing. In order to respond to the market demand for high-bandwidth high-speed data transmission, the module design is increasingly developed in the direction of miniaturization and high density, although a high-integrated circuit is striving in the direction of miniaturization and low power consumption, along with the development of high-speed high-bandwidth module technology, the high heat power consumption of the module also becomes a problem which must be faced, while the existing mainstream heat dissipation mode is to conduct the heat of the power consumption device in the optical module to the shell of the optical module through a heat dissipation gasket or heat conduction glue, and then conduct heat dissipation through the contact of the shell and an external heat dissipation structure, more air gaps or heat conduction glue exist between the power consumption device and the final heat dissipation device in the mode, so that the heat resistance is increased, and the heat dissipation effect is directly poor. Disclosure of Invention The invention mainly aims to provide an optical module and an optical module plugging structure, and aims to solve the problem that the existing optical module heat dissipation mode is poor in heat dissipation effect. In order to achieve the above object, the optical module according to the present invention includes: the mounting shell is provided with a mounting cavity, and the upper side wall and the lower side wall of the mounting shell are respectively provided with a heat conduction abdication through hole communicated with the mounting cavity; a circuit board structure including a power device arranged in the mounting cavity, and The heat conduction assembly comprises two heat conduction abutting parts, and the two heat conduction abutting parts are mutually matched to compress the upper end face and the lower end face of the power device and are respectively exposed to the corresponding heat conduction abdication through holes. Optionally, the mounting cavity is formed with a plugging through hole in a rearward penetrating way, and the circuit board structure further includes: A first circuit board and a second circuit board, wherein the first circuit board is arranged at the front end of the mounting cavity and is used for carrying an optical lens, the second circuit board is arranged at the rear end of the mounting cavity and is provided with a conductive plug part which is adapted to extend out of the plug through hole, and And the conductive soft belt is electrically connected with the power device to the first circuit board and the second circuit board. Optionally, the power device includes a device body and a rigid conductive substrate, the rigid conductive substrate is disposed around the device body, and pins of the device body are soldered to the rigid conductive substrate; the conductive flexible strap electrically connects the rigid conductive substrate to the first circuit board and the second circuit board. Optionally, the two heat conduction abdication through holes comprise upper abdication through holes penetrating through the upper side wall of the installation cavity, and the upper abdication through holes are expanded backwards to the rear end face of the installation shell; The two heat conduction butt parts comprise upper heat conduction butt parts corresponding to the upper abdication through holes, the upper heat conduction butt parts are provided with upper heat conduction surfaces which are arranged upwards, and the upper heat conduction surfaces are arranged obliquely downwards in the front-to-back direction. Optionally, the two heat conduction abdication through holes comprise upper abdication through holes positioned on the upper side wall of the installation cavity, and the upper abdication through holes are expanded backwards to the rear end face of the installation shell; The two heat conduction butt parts comprise upper heat conduction butt parts corresponding to the upper yielding through holes, the upper heat conduction butt parts are provided with upper heat conduction surfaces which are arranged upwards, the upper heat conduction surfaces are provided with a plurality of heat conduction slots, the heat conduction slots are arranged at intervals from left to right, and the heat conduction slots are all penetrated backwards to the rear end surfaces of the upper heat conduction butt parts. Optionally, a lateral abdication through hole is formed on the left and right side walls of the mounting cavity corresponding to the thermal conduction abutting part respectively,