CN-117300287-B - Attaching method and attaching equipment

CN117300287BCN 117300287 BCN117300287 BCN 117300287BCN-117300287-B

Abstract

The invention discloses an adhering method and adhering equipment. The attaching device comprises a material dipping table, a bearing plate, a scraping plate and a pneumatic unit. The material dipping table is provided with a reference plane and a material placing groove concavely arranged from the reference plane. The periphery of the bearing plate is arranged in the material placing groove, so that the bottom surface of the bearing plate and the material placing groove form a buffer zone together. The material placing groove is used for placing a material to be dipped in and is positioned on the top surface of the bearing plate. The scraping plate is used for scraping redundant parts of the dipping material which are arranged in the material placing groove but protrude out of the reference plane along the reference plane so as to form a dipping material layer with the outer surface coplanar with the reference plane. The pneumatic unit can be used for inflating or exhausting the buffer area so as to enable the bearing plate to be elastically bent to be bent. Accordingly, the dipping layer which can synchronously bend along with the bearing plate is formed.

Inventors

SHI DUNZHI
HUANG LIANGYIN
Liu Huangsongkai

Assignees

均华精密工业股份有限公司

Dates

Publication Date: 20260512
Application Date: 20220623

Claims (11)

1. A method of attaching a plurality of solder joints on a curved bottom surface of an electronic component, the method comprising: A pre-step of providing an attaching apparatus comprising: a material dipping table with a reference plane and a material placing groove concavely arranged from the reference plane, and The periphery of the bearing plate is arranged in the material placing groove, so that the bottom surface of the bearing plate and the material placing groove form a buffer zone together; A filling step, namely arranging a dipping material in the material placing groove and on the top surface of the bearing plate; A flattening step, namely removing redundant parts of the dipping material which are arranged in the material placing groove but protrude out of the reference plane to form a dipping material layer with the outer surface coplanar with the reference plane; an adjusting step of inflating or exhausting the buffer area to make the bearing plate bend to form a curve corresponding to the curved bottom surface and make the dipping layer bend synchronously with the bearing plate, and And an adhering step, namely moving the welding parts of the electronic component towards the bearing plate and abutting against the top surface of the bearing plate, wherein the bearing plate in a bending shape can be correspondingly and elastically bent along with the arrangement of the welding parts so as to abut against the welding parts, and further, the welding parts are adhered to the adhering layer.
2. The method according to claim 1, wherein in the flattening step, a scraper is relatively moved across the placement tank along the reference plane to scrape the excess portion of the dipping material.
3. The method according to claim 1, wherein the thickness of the adhesive layer is smaller than the thickness of any one of the solder joints in the planarizing step, and wherein the curved bottom surface of the electronic component is kept from contacting the adhesive layer in the adhering step.
4. A method of adhering as set forth in claim 3 wherein the adhering material is further defined as a flux.
5. The attaching method according to claim 1, wherein in said adjusting step, said outer surface of said dipping layer is kept parallel to said top surface of said carrier plate.
6. The method of claim 1, wherein the curved bottom surface is further defined as a curved concave surface, wherein in the adjusting step, the buffer area is inflated with a pneumatic unit to elastically bend the carrier plate in a direction away from a bottom of the placement tank, and wherein in the attaching step, the electronic component is sucked by a suction nozzle and moved toward the carrier plate.
7. An attaching apparatus, characterized in that the attaching apparatus comprises: the material dipping table is provided with a reference plane and a material placing groove concavely arranged from the reference plane; the periphery of the bearing plate is arranged in the material placing groove so that the bottom surface of the bearing plate and the material placing groove form a buffer zone together, wherein the material placing groove is used for placing a dipping material therein and is positioned on the top surface of the bearing plate; A scraper plate corresponding to the reference plane for scraping the excessive part of the dipping material arranged in the material placing groove and protruding out of the reference plane along the reference plane to form a dipping material layer with the outer surface coplanar with the reference plane, and And the pneumatic unit is communicated with the buffer area, and can be used for inflating or exhausting the buffer area so as to enable the bearing plate to be elastically bent to be bent.
8. The attaching device according to claim 7, wherein said carrier plate is provided at a bottom of said stock chest, and said air-moving unit is connected to said bottom of said stock chest so as to communicate with said buffer zone, said air-moving unit being defined to inflate said buffer zone.
9. The apparatus of claim 7, further comprising a lift table, wherein a top surface of the lift table is positioned in the buffer zone and the carrier plate is disposed on the top surface.
10. The apparatus of claim 9, wherein the table top of the lift table is movable between a first position and a second position relative to a bottom of the placement tank, the placement tank being configured for placement of the dip material when the table top is in the first position, and the pneumatic unit being configured to pump the buffer zone when the table top is in the second position.
11. The apparatus of claim 9, wherein the table top of the lift table is movable between a first position and a second position relative to the bottom of the chute, and wherein the pneumatic unit is operable to inflate the buffer zone when the table top is in the first position.

Description

Attaching method and attaching equipment Technical Field The present invention relates to a method for adhering, and more particularly, to a method for adhering a material to form a curved material layer and an apparatus for adhering the material. Background The conventional material dipping device is formed with a tank body capable of accommodating the material to be dipped for an object to be dipped. Wherein, the liquid level of the dipping material in the existing dipping device is a horizontal plane, so the object can control the dipping area through the depth of the dipping liquid level. However, the conventional dipping device is insufficient to meet the above requirements due to the diversification of object types and the derived curved surface dipping requirement. Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks. Disclosure of Invention The embodiment of the invention provides a dipping method and a dipping device, which can effectively improve the defects possibly generated by the prior dipping device. The embodiment of the invention discloses an adhering method which is suitable for a plurality of welding parts on the curved bottom surface of an electronic component, and comprises the steps of providing adhering equipment, an adjusting step, and an adhering step, wherein the adhering equipment comprises an adhering table, a bearing plate and a filling step, the adhering table is provided with a datum plane and a material placing groove concavely arranged from the datum plane, the periphery of the bearing plate is arranged in the material placing groove so that the bottom surface of the bearing plate and the material placing groove jointly form a buffer area, the adhering step is used for arranging an adhering material in the material placing groove and on the top surface of the bearing plate, a flattening step is used for removing redundant parts of the adhering material which are arranged in the material placing groove but protrude out of the datum plane to form an adhering material layer with the outer surface coplanar to the datum plane, the buffer area is inflated or deflated to enable the bearing plate to be bent corresponding to the curved bottom surface of the curve and enable the adhering material layer to be bent synchronously along with the bending of the bearing plate, and the adhering step is used for moving the plurality of welding parts of the electronic component towards the bearing plate and abutting against the top surface of the bearing plate and enabling the plurality of the adhering material to be arranged on the top surface of the bearing plate along with the bending part. Preferably, in the flattening step, a scraper is relatively moved across the material placing groove along the reference plane so as to scrape off the redundant part of the dipping material. Preferably, the thickness of the dipping layer is smaller than that of any one of the welding parts in the flattening step, and the curved bottom surface of the electronic component is kept not contacted with the dipping layer in the attaching step. Preferably, the dip is further defined as a flux. Preferably, in the adjusting step, the outer surface of the dipping layer is kept parallel to the top surface of the bearing plate. Preferably, the curved bottom surface is further defined as a curved concave surface, the buffer area is inflated by a pneumatic unit in the adjusting step to elastically bend the bearing plate in a direction away from the bottom of the material placing groove, and the electronic component is sucked by a suction nozzle and moved toward the bearing plate in the attaching step. The embodiment of the invention also discloses a piece of adhering equipment, which comprises an adhering table, a bearing plate and a scraping plate, wherein the adhering table is provided with a datum plane and a material placing groove concavely arranged from the datum plane, the periphery of the bearing plate is arranged in the material placing groove so that the bottom surface of the bearing plate and the material placing groove jointly form a buffer area, the material placing groove is used for arranging an adhering material in the material placing groove and is positioned on the top surface of the bearing plate, the scraping plate is arranged corresponding to the datum plane and is used for scraping redundant parts of the adhering material arranged in the material placing groove but protruding out of the datum plane along the datum plane so as to form an adhering material layer with the outer surface coplanar with the datum plane, and the pneumatic unit is communicated with the buffer area, wherein the pneumatic unit can be used for inflating or deflating the