CN-117326327-B - Component pickup mechanism and component transfer system

Abstract

The application provides a component picking mechanism and a component transferring system, wherein the component picking mechanism comprises a substrate, an adsorption functional layer and an adjusting mechanism, the substrate comprises a first surface positioned in the thickness direction of the substrate, and a second surface connected to the edge of the first surface, and the second surface is obliquely arranged relative to the first surface. The adsorption functional layer is arranged on the first surface of the substrate, the adjusting mechanism comprises an adjusting unit arranged on the first surface and a connecting wire connected to the adjusting unit, the adjusting unit is electrically connected with the control mechanism through the connecting wire, and the adjusting unit is configured to be capable of adjusting the adsorption capacity of the adsorption functional layer to the element to be transferred under the control of the control mechanism. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends to the first surface through the second surface.

Inventors

• WANG YUNDA
• GUO QINHUA

Assignees

• 香港科技大学(广州)

Dates

Publication Date

20260505

Application Date

20231007

Claims (15)

1. 1. A component pickup mechanism, comprising: The substrate comprises a first surface positioned in the thickness direction of the substrate and a second surface connected to the edge of the first surface, wherein the second surface is obliquely arranged relative to the first surface; An adsorption functional layer arranged on the first surface of the substrate; The adjusting mechanism comprises an adjusting unit arranged on the first surface and a connecting wire connected with the adjusting unit, the adjusting unit is electrically connected with the control mechanism through the connecting wire, the adjusting unit is configured to be capable of adjusting the adsorption capacity of the adsorption functional layer to the element to be transferred under the control of the control mechanism, and the adjusting unit is at least partially positioned between the adsorption functional layer and the first surface; The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends to the first surface through the second surface.
2. 2. The component pickup mechanism according to claim 1, wherein the base includes a support structure and a substrate disposed on the support structure, the first face being located on a side of the substrate facing away from the support structure; the second face is located on at least one side of the substrate in a direction parallel to the first face.
3. 3. The component pickup mechanism according to claim 2, further comprising a conductive portion provided on a side of the connection line facing away from the second face, one end of the conductive portion being connected to the connection line, and the other end being connected to the control mechanism, so as to achieve signal transmission between the connection line and the control mechanism.
4. 4. The component pickup mechanism according to claim 2, wherein the support structure is disposed at least partially beyond the substrate in a direction parallel to the first face, such that at least part of the structures in the control mechanism are disposed on the support structure.
5. 5. The component pickup mechanism according to claim 4, further comprising a conductive portion and a supporting portion provided on a side of the supporting structure facing the substrate, the supporting portion being located between the substrate and the control mechanism in a direction parallel to the first face; The conducting part is positioned on one side of the control mechanism, which is away from the supporting structure, and is electrically connected with the control mechanism, and the conducting part extends to the second surface through one side of the supporting part, which is away from the supporting structure, and is electrically connected with the connecting wire.
6. 6. The component pickup mechanism according to claim 2, wherein the connection line includes a first portion on the first face, and a second portion connecting the first portion and the control mechanism; wherein the second portion covers at least part of the control mechanism and extends to the second face.
7. 7. The component pickup mechanism of claim 6, wherein an average width of the second portion is greater than an average width of the first portion.
8. 8. The component pickup mechanism according to claim 2, wherein the support structure includes a third face in a direction parallel to the first face, the second face and the third face being on the same plane; the control mechanism is configured to be disposed on the third face.
9. 9. The component pickup mechanism according to claim 1, wherein, The orthographic projection of the adjusting unit on the first surface is at least partially positioned outside the orthographic projection of the adsorption functional layer on the first surface, so that at least part of the adjusting unit is exposed relative to the adsorption functional layer.
10. 10. The component pickup mechanism according to claim 9, wherein the adsorbing-functional layer includes a plurality of adsorbing-functional blocks arranged at intervals, at least part of the regulating units being arranged between adjacent adsorbing-functional blocks, and/or, At least part of the adjusting unit is arranged between the adsorption functional block and the first surface.
11. 11. The component pickup mechanism according to claim 1, wherein the number of the second faces is plural, and the plural second faces are provided separately at different edges of the first face; at least part of the connecting lines extend to the first face via different second faces.
12. 12. The component pickup mechanism of claim 11, wherein the first face includes a first central region, and the plurality of second faces and the plurality of connecting lines are symmetrically distributed with respect to the first central region.
13. 13. The component pickup mechanism according to claim 1, wherein the adjustment unit includes a first connection end and a second connection end, the first connection end and the second connection end being electrically connected to different ones of the connection lines, respectively.
14. 14. The component pickup mechanism according to claim 13, wherein the first connection ends of at least partially different ones of the adjustment units are disposed in electrical connection with the same connection line.
15. 15. A component transfer system, comprising: a donor substrate and a target substrate, the donor substrate having an element to be transferred disposed thereon; a component pickup mechanism according to any one of claims 1 to 14; A transfer mechanism to which at least one of the donor substrate, the target substrate, and the element pickup mechanism is provided, the transfer mechanism being configured to be able to adjust a distance between the element pickup mechanism with respect to the donor substrate and the target substrate; A control mechanism configured to be able to adjust an environmental condition of the adsorption functional layer to change an adsorption capacity of the adsorption functional layer to the element to be transferred.

Description

Component pickup mechanism and component transfer system Technical Field The present application relates to the field of component transferring apparatuses, and in particular, to a component pickup mechanism and a component transferring system. Background With the development of the scientific and technical level, the complexity of the electronic device is gradually increased, and the miniaturization of the electrical components inside the device is also gradually advanced. By reducing the size of the electrical components, more electrical components can be integrated in a limited space, thereby improving the use experience. While miniaturized electrical component integration often requires transfer, existing pick-up structures are prone to failure and have insufficient reliability. Disclosure of Invention The embodiment of the application provides a component pickup mechanism and a component transfer system, which can realize huge transfer. In a first aspect, an embodiment of the present application provides a component pickup mechanism, including a substrate, an adsorption functional layer, and an adjustment mechanism, where the substrate includes a first surface located in a thickness direction of the substrate, and a second surface connected to an edge of the first surface, and the second surface is disposed obliquely with respect to the first surface. The adsorption functional layer is arranged on the first surface of the substrate, the adjusting mechanism comprises an adjusting unit arranged on the first surface and a connecting wire connected to the adjusting unit, the adjusting unit is electrically connected with the control mechanism through the connecting wire, and the adjusting unit is configured to be capable of adjusting the adsorption capacity of the adsorption functional layer to the element to be transferred under the control of the control mechanism. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends to the first surface through the second surface. In some embodiments, the base includes a support structure and a substrate disposed on the support structure, the first face being on a side of the substrate facing away from the support structure. The second face is located on at least one side of the substrate in a direction parallel to the first face. In some embodiments, the component pick-up mechanism further includes a conductive portion disposed on a side of the connection wire facing away from the second surface, one end of the conductive portion is connected to the connection wire, and the other end is connected to the control mechanism, so as to realize signal transmission between the connection wire and the control mechanism. In some embodiments, the support structure is disposed at least partially beyond the substrate in a direction parallel to the first face such that at least a portion of the control mechanism is disposed on the support structure. In some embodiments, the component pick-up mechanism further comprises a conductive portion and a support portion provided on a side of the support structure facing the substrate, the support portion being located between the substrate and the control mechanism in a direction parallel to the first face. The conduction part is located one side of the control mechanism, which is away from the support structure, and is electrically connected with the control mechanism, and the conduction part extends to the second surface through one side of the support part, which is away from the support structure, and is electrically connected with the connecting wire. In some embodiments, the connection line includes a first portion on the first face, and a second portion connecting the first portion and the control mechanism. Wherein the second portion covers at least part of the control mechanism and extends to the second face. In some embodiments, the average width of the second portion is greater than the average width of the first portion. In some embodiments, the support structure includes a third face in a direction parallel to the first face, the second face being coplanar with the third face, the control mechanism being configured to be disposed on the third face. In some embodiments, the conditioning unit is located at least partially between the adsorption functional layer and the first face, and/or the orthographic projection of the conditioning unit on the first face is located at least partially outside the orthographic projection of the adsorption functional layer on the first face, such that at least a portion of the conditioning unit is exposed with respect to the adsorption functional layer. In some embodiments, the adsorption function layer includes a plurality of adsorption function blocks disposed at intervals, at least a portion of the conditioning unit being located between adjacent adsorption function blocks, and/or, At least part of