CN-117339582-B - Method for preparing adsorbent by utilizing waste circuit board vacuum pyrolysis slag

Abstract

The invention belongs to the technical field of waste recovery, and discloses a method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis residues. The method comprises the steps of crushing, sieving, washing and drying vacuum pyrolysis residues of a waste circuit board to obtain an adsorbent precursor, mixing the adsorbent precursor with an acid solution, carrying out impregnation treatment to obtain a mixed solution, carrying out ultrasonic treatment on the mixed solution, filtering the mixed solution subjected to ultrasonic treatment, collecting solids, washing and drying the solids, and thus obtaining the adsorbent. The invention prepares the adsorbent by carrying out acid dipping-ultrasonic treatment on the waste circuit board vacuum pyrolysis slag, has the characteristics of simple and feasible process, low manufacturing cost, high resource utilization rate, environmental friendliness and the like, can well solve the problems of landfill treatment of the vacuum pyrolysis slag, occupation of land resources and the like in the prior art, and has good application prospect in treatment of printing and dyeing wastewater.

Inventors

• YE ZIWEI
• YANG FAN
• Fang Jinlian
• FENG ZHENXI
• LIU MINGYANG
• FENG XIANG
• WU YIHAN
• LI HANG
• Cen Haoyuan
• DAI YINJUAN

Assignees

• 广东环境保护工程职业学院

Dates

Publication Date

20260512

Application Date

20231027

Claims (8)

1. 1. The method for preparing the adsorbent by utilizing the waste circuit board vacuum pyrolysis slag is characterized by comprising the following steps of: crushing, sieving, washing and drying the waste circuit board vacuum pyrolysis slag to obtain an adsorbent precursor; mixing the adsorbent precursor with an acid solution, and carrying out impregnation treatment to obtain a mixed solution; Carrying out ultrasonic treatment on the mixed solution; Filtering the mixed solution subjected to ultrasonic treatment, collecting solids, and washing and drying the solids to obtain an adsorbent; the waste circuit board vacuum pyrolysis slag is prepared by vacuum pyrolysis of waste circuit board resin powder at 400-550 ℃; the waste circuit board vacuum pyrolysis slag mainly comprises pyrolytic carbon and glass fiber; the acid solution is citric acid solution.
2. 2. The method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis slag according to claim 1, wherein the sieving is 120-200 mesh sieving.
3. 3. The method for preparing the adsorbent by utilizing the waste circuit board vacuum pyrolysis slag as claimed in claim 1, wherein the temperature of drying is more than or equal to 100 ℃.
4. 4. The method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis slag according to claim 1, wherein the concentration of the acid solution is 0.1-10mol/L.
5. 5. The method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis slag according to claim 1, wherein the condition of the impregnation treatment comprises the impregnation liquid-solid ratio of 5:1-20:1 and the impregnation time of 0.5-24h.
6. 6. The method for preparing the adsorbent by utilizing the waste circuit board vacuum pyrolysis slag according to claim 1, wherein the ultrasonic treatment conditions comprise ultrasonic power of 300-500W and ultrasonic treatment time of 5-60min.
7. 7. An adsorbent prepared by the method for preparing an adsorbent using waste wiring board vacuum pyrolysis residue according to any one of claims 1 to 6.
8. 8. Use of the adsorbent of claim 7 for treating printing and dyeing wastewater.

Description

Method for preparing adsorbent by utilizing waste circuit board vacuum pyrolysis slag Technical Field The invention belongs to the technical field of waste recovery, and particularly relates to a method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis residues. Background Waste circuit boards contain a abundance of metals such as gold, silver, copper, and the like, also known as "urban mines". The waste circuit board has high metal content and higher economic value, so most of researches are focused on how to efficiently recycle the metal components, and the metal recycling technology is mature at present. Most of the rest nonmetallic components (resin components) are subjected to landfill or incineration treatment, so that resource waste and potential environmental problems are caused. The waste circuit resin powder resource regeneration is used for preparing the adsorbent, and the scholars at home and abroad do a lot of research work. Zhao Ji et al (2019) use nonmetallic components in the waste circuit board as carbon sources, and prepare the magnetic porous carbon material by an activation-magnetization two-step method. Lv Wei et al (2014) adopt carbonization-KOH dipping-activation mode to prepare the active carbon from the abandoned computer circuit board. Yang Ertao (2011) and the like take nonmetal separators of waste printed circuit boards as precursors, and prepare granular activated carbon through pyrolysis, molding, carbonization and steam activation. Patent document CN107867687a prepares activated carbon from waste printed circuit boards, and prepares the activated carbon by directly pulverizing a non-metal part into powder, and the preparation efficiency, the yield and the quality of the activated carbon are low due to the fact that the non-metal powder of the waste circuit board contains impurities such as glass fibers. The prior art also has the following problems that (1) the adsorbent needs to be subjected to secondary high-temperature pyrolysis or activation, and the energy consumption is high, and (2) the waste circuit board resin powder is directly prepared into the adsorption material by a carbonization-secondary activation mode, so that the recycling of organic components in the waste circuit board resin powder can be reduced, and the resource waste is caused. Therefore, it is necessary to develop a method for preparing an adsorbent which can reduce energy consumption without affecting the recycling of organic components in waste circuit board resin powder. Disclosure of Invention The present invention aims to solve at least one of the technical problems in the prior art described above. Therefore, the method for preparing the adsorbent by utilizing the waste circuit board vacuum pyrolysis slag has the characteristics of simplicity in operation, energy conservation and consumption reduction, improves the production efficiency, reduces the production cost, and does not influence the recycling of organic components in the waste circuit board resin powder. The first aspect of the invention provides a method for preparing an adsorbent by utilizing waste circuit board vacuum pyrolysis slag, which comprises the following steps: crushing, sieving, washing and drying the waste circuit board vacuum pyrolysis slag to obtain an adsorbent precursor; mixing the adsorbent precursor with an acid solution, and carrying out impregnation treatment to obtain a mixed solution; Carrying out ultrasonic treatment on the mixed solution; filtering the mixed solution after ultrasonic treatment, collecting solid, and washing and drying the solid to obtain the adsorbent. The method provided by the invention takes waste circuit board vacuum pyrolysis slag as a raw material, the waste circuit board vacuum pyrolysis slag mainly comprises pyrolytic carbon and glass fiber, and pyrolytic carbon adsorption materials are prepared through acid dipping-ultrasonic treatment, so that the traditional secondary pyrolysis or activation operation can be reduced, the energy consumption is saved, the adsorption pores with various apertures can be corroded on the pyrolytic carbon by virtue of the corrosion action of an acid solution, the residual metals in non-metal components can be removed, and the adsorption aperture is enlarged by utilizing ultrasonic high-frequency vibration, so that the adsorption performance is improved. According to some embodiments of the invention, the waste circuit board vacuum pyrolysis slag is prepared by vacuum pyrolysis of waste circuit board resin powder at 400-550 ℃. The nonmetal components of the waste circuit board are subjected to vacuum pyrolysis carbonization, the organic components can be converted into carbon-based materials, and the properties of the glass fibers are basically unchanged, so that the subsequent separation and removal are facilitated. According to some embodiments of the invention, the sieving is through a 120-200 mesh sieve. The glass fiber in the