CN-117377539-B - Wire drawing die

Abstract

A wire drawing die is provided with a blank as a wear-resistant member provided with a die hole for wire drawing a wire rod, and a die shell for supporting the blank. The blank has a higher thermal conductivity than the form. The blank has an upstream end face and a downstream end face in the drawing direction, a die hole is provided between the upstream end face and the downstream end face, and the downstream end face is exposed from the die case.

Inventors

• Haramoto Kohei
• Takashi Takashi
• KIMURA KOICHIRO
• XIAO LINFENG

Assignees

• 住友电气工业株式会社
• 联合材料公司

Dates

Publication Date

20260508

Application Date

20220502

Priority Date

20210512

Claims (6)

1. 1. A wire drawing die is provided with: a wear-resistant member provided with a die hole for wire drawing of a wire rod, and A formwork supporting the wear-resistant component, The wear part has a higher thermal conductivity than the form, The wear-resistant member has an upstream end face and a downstream end face in a drawing direction, the die hole is provided between the upstream end face and the downstream end face, the downstream end face is exposed from the die case, The die further includes a cover having a through hole through which the wire passes, the cover having a heat dissipation member provided with the through hole in contact with the wear-resistant member, and a support member supporting the heat dissipation member, the heat dissipation member having a higher thermal conductivity than the support member, The heat dissipation member includes at least one selected from the group consisting of diamond, CBN, and a composite material including diamond or CBN.
2. 2. The bushing of claim 1 wherein, The support member includes any one of the following: At least one element selected from the group consisting of copper, silver, tungsten and molybdenum or an alloy containing the element, or A single body of ceramic material or a composite of the ceramic material and metal.
3. 3. The wire drawing die according to claim 1 or 2, wherein, The heat dissipation member and the support member are joined by solder or screw clips.
4. 4. The wire drawing die according to claim 1 or 2, wherein, A plating layer is provided on the joint surface of the heat dissipation member and the support member.
5. 5. The wire drawing die according to claim 1 or 2, wherein, The diameter D of the sizing part of the die hole is more than 10 mu m and less than 1.0 mm.
6. 6. The wire drawing die according to claim 1 or 2, wherein, The length L of the sizing part of the die hole is 20-100% of the diameter D of the sizing part of the die hole.

Description

Wire drawing die Technical Field The present disclosure relates to a wire drawing die. The present application claims priority based on Japanese patent application No. 2021-080723, filed on day 2021, month 5 and day 12. The entire contents of the japanese patent application are incorporated into the present specification by reference. Background Conventionally, for example, japanese patent application laid-open No. 9-108726 (patent document 1) discloses a wire drawing die. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 9-108726 Disclosure of Invention The die comprises a wear-resistant member provided with a die hole for wire drawing a wire rod, and a die shell for supporting the wear-resistant member, wherein the wear-resistant member has a higher thermal conductivity than the die shell, and the wear-resistant member has an upstream end face and a downstream end face in the wire drawing direction, the die hole being provided between the upstream end face and the downstream end face, and the downstream end face being exposed from the die shell. Drawings Fig. 1 is a plan view of a wire drawing die 100 according to an embodiment. Fig. 2 is a cross-sectional view of the die 100 taken along line II-II in fig. 1. Fig. 3 is a cross-sectional view showing in detail the shape of the inner surface of the die hole 103 provided in the blank (blank) 120 in fig. 2. Fig. 4 is a plan view of a cap 200 mounted on the wire drawing die 100 according to the embodiment. Fig. 5 is a cross-sectional view of the cap 200 along the V-V line in fig. 4. Fig. 6 is a cross-sectional view showing the wire drawing die 100 to which the cover 200 is attached and a wire drawing method using the wire drawing die 100. Fig. 7 is a cross-sectional view showing a heat diffusion path in the wire-drawing die 100 to which the cover 200 is attached. Fig. 8 is a cross-sectional view of a conventional wire drawing die 100. Detailed Description [ Problem to be solved by the present disclosure ] In the conventional wire drawing die, it is difficult to sufficiently dissipate heat generated during wire drawing. [ Description of embodiments of the present disclosure ] First, embodiments of the present disclosure are described. The die comprises a wear-resistant member provided with a die hole for wire drawing a wire rod, and a die shell for supporting the wear-resistant member, wherein the wear-resistant member has a higher thermal conductivity than the die shell, and the wear-resistant member has an upstream end face and a downstream end face in the wire drawing direction, the die hole being provided between the upstream end face and the downstream end face, and the downstream end face being exposed from the die shell. In the die having such a structure, the heat conductivity of the wear-resistant member is higher than that of the die case, and the downstream end face of the wear-resistant member is exposed from the die case, so that heat can be diffused from the downstream end face. As a result, heat generated during the wire drawing process can be sufficiently dissipated. Preferably, the wire-drawing die further includes a cover having a through hole through which the wire passes, the cover having a heat dissipation member provided with the through hole in contact with the wear-resistant member, and a support member supporting the heat dissipation member, the heat dissipation member having a higher thermal conductivity than the support member. In this case, since the heat radiating member is in contact with the wear-resistant member, heat of the wear-resistant member can be efficiently transferred to the heat radiating member. Preferably, the heat dissipation member comprises at least one selected from the group consisting of diamond, CBN, and a composite material comprising diamond or CBN. In this case, the heat dissipation member can efficiently dissipate heat because the heat dissipation member has particularly high thermal conductivity. Preferably, the support member is any one of at least one simple substance selected from the group consisting of copper, silver, tungsten and molybdenum or an alloy containing the simple substance, or a single body of a ceramic material or a composite of the ceramic material and a metal. In this case, the strength of the support member becomes high. Preferably, the heat dissipation member and the support member are joined by solder or screw clips. In this case, the heat radiating member and the supporting member are firmly joined by solder or screw clips. As a result, the heat dissipation member can be prevented from falling off the support member. Preferably, a plating layer is provided on the joint surface of the heat radiating member and the support member. In this case, the heat sink member and the support member are firmly joined to each other at the joint surface of the heat sink member and the support member. The heat generated at the working site of a general wire-drawi