CN-117425622-B - Alumina particles and resin composition using same

Abstract

The present invention provides alumina particles which are used as a filler for a resin composition and which can improve the thermal conductivity of the resin composition compared with the conventional alumina particles. An alumina particle having a cumulative particle size distribution such that 50% of the particles have a particle diameter D50 of more than 100 μm as measured from the particle side, an alpha conversion rate of 90% or more, and alpha-alumina is a single crystal. The Na content of the alumina particles is preferably 800ppm or less. The cumulative particle size distribution of the alumina particles is preferably 70 to 135 μm in terms of the particle diameter D10 at which 10% of the particles are accumulated from the fine particle side.

Inventors

• NAKATA KUNIHIKO
• ARISE ICHIRO
• Jiangchuan
• SHIMASAKI YASUHARU
• Ogen Uehara kodo

Assignees

• 住友化学株式会社

Dates

Publication Date

20260508

Application Date

20220526

Priority Date

20210604

Claims (5)

1. 1. An alumina particle having a cumulative particle size distribution, a particle diameter D50 of more than 100 μm as a cumulative 50% from the microparticle side, an alpha conversion of 90% or more, and alpha-alumina being a single crystal, The cumulative particle size distribution has a particle diameter D10 of 70 to 135 μm in which 10% of the particles are accumulated from the particle side, The cumulative particle size distribution has a particle diameter D90 of 130 to 200 μm, which is 90% of the cumulative particle diameter D90 from the particle side.
2. 2. The alumina particles according to claim 1, wherein Na content is 800ppm or less.
3. 3. The alumina particles according to claim 1, wherein the roundness is 0.90 to 1.00.
4. 4. The alumina particles according to claim 1, wherein the density is 3.80g/cm 3 or more.
5. 5. A resin composition comprising a resin and the alumina particles of any one of claims 1 to 4.

Description

Alumina particles and resin composition using same Technical Field The present disclosure relates to alumina particles and a resin composition using the same. Background Heat generated by energizing the electronic component is dissipated via the heat sink. In order to improve heat dissipation efficiency, a technique of filling a heat dissipation material between an electronic component and a heat sink is known. As one of the heat dissipation members, a resin composition containing a resin and inorganic particles is known, and alumina particles can be used as the inorganic particles (for example, patent documents 1 to 3). Patent document 1 discloses alumina particles having an α -phase content of 40% or less, an average circularity of 0.95 or more, and an average particle diameter of 100 μm or less as alumina particles capable of improving fluidity at the time of highly filling in a resin. As a method for producing alumina particles, a method is disclosed in which a pulverized product of fused alumina is melted by a flame fusion method, and water is sprayed into a furnace to rapidly cool the furnace. Patent document 2 discloses alumina particles having an average sphericity of 0.93 or more and an α -ratio of alumina of 95% or more as alumina particles capable of improving the tackiness and flowability of a composition blended in a resin or the like. As a method for producing alumina particles, a method is disclosed in which metal aluminum powder, alumina powder or a mixture of both is used as a raw material, and the raw material is melted by flame fusion, cooled and solidified, and then reheated. Patent document 3 discloses a method of obtaining round fused alumina particles having an average particle diameter of 5 to 4000 μm by pulverizing fused alumina using a jet mill and removing edges of the fused alumina particles. Prior art literature Patent literature Patent document 1 International publication No. 2009/133904 Patent document 2 International publication No. 2008/053536 Patent document 3 Japanese patent laid-open No. 2006-169090 Disclosure of Invention In recent years, an increase in the amount of heat generated by ICs of electronic devices due to high integration of ICs and an increase in the amount of heat generated by electronic components driven by high current due to electromotive of electric vehicles, airplanes, and the like have become a problem. In order to achieve more efficient heat dissipation, it is required to further improve the thermal conductivity of the resin composition. In order to achieve more efficient heat dissipation, it is also required to reduce as much as possible the interface between the resin used in the resin composition and the filler (alumina particles), i.e., to increase the particle diameter of the alumina particles. However, the alumina particles disclosed in patent documents 1 and 2 have not been studied to further improve the thermal conductivity of the resin composition. When the alumina particles of patent document 3 are mixed with a resin to form a resin composition, it is difficult to say that the heat conductivity is sufficient. In view of the above, an object of one embodiment of the present invention is to provide alumina particles which are used as a filler for a resin composition and which can improve the thermal conductivity of the resin composition as compared with the conventional one. Further, another embodiment of the present invention is to provide a resin composition using alumina particles. In embodiment 1 of the present invention, the cumulative particle size distribution is such that 50% of the particle diameter D50 from the microparticle side exceeds 100 μm, the rate of conversion to α is 90% or more, and α -alumina is a single crystal. In the invention, according to embodiment 2, the Na content of the alumina particles according to embodiment 1 is 800ppm or less. In accordance with embodiment 3 of the present invention, the alumina particles according to embodiment 1 or 2 have a cumulative particle size distribution in which 10% of the particles have a particle diameter D10 of 70 to 135 μm from the particle side. The invention according to claim 4 is the alumina particles according to any one of claims 1 to 3, wherein the cumulative particle size distribution has a particle diameter D90 of 130 to 200 μm, which is 90% of the cumulative particle diameter D90 from the microparticle side. The invention according to claim 5 is the alumina particles according to any one of claims 1 to 4, wherein the roundness is 0.90 to 1.00. The invention according to claim 6 provides the alumina particles according to any one of claims 1 to 5, wherein the density is 3.80g/cm 3 or more. The invention according to claim 7 provides a resin composition comprising a resin and the alumina particles according to any one of claims 1 to 6. By using the alumina particles of one embodiment of the present invention as a filler, a resin composition having high thermal conductiv