CN-117460207-B - Folding fin steam chamber cold plate

Abstract

A folding fin vapor chamber cold plate is disclosed. The heat rejection apparatus may include a vapor chamber arrangement and a cover coupled to the vapor chamber arrangement. The vapor chamber apparatus includes a base, a folded fin structure coupled to the base, wherein the base and the folded fin structure define a vapor chamber that houses a wick and a working fluid. The cover and vapor chamber arrangement define a liquid chamber configured to receive a liquid coolant. The folded fin structure includes a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves is part of the vapor chamber. The second plurality of grooves is part of the liquid chamber.

Inventors

• S. Dean
• E. J. Ferrer
• J.P. Franz
• L. Marcotti Sanchez

Assignees

• 慧与发展有限责任合伙企业

Dates

Publication Date

20260512

Application Date

20221020

Priority Date

20220719

Claims (20)

1. 1. A heat removal device, comprising: a vapor chamber apparatus, the vapor chamber apparatus comprising: a base, and A folded fin structure coupled to the base, the base and the folded fin structure defining a vapor chamber containing a wick and a working fluid; a cover coupled to the vapor chamber apparatus, the cover and vapor chamber apparatus defining a liquid chamber configured to receive a liquid coolant, and A plurality of turbulators disposed in the liquid chamber, wherein the turbulators comprise a first subset of turbulators having a first length and a second subset of turbulators having a second length, the second length being different from the first length; Wherein the folded fin structure includes a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure, Wherein the first plurality of grooves are part of the vapor chamber, Wherein the second plurality of grooves are part of the liquid chamber, an Wherein within each groove of the plurality of second grooves, turbulators of the first subset alternate with turbulators of the second subset along a length of the respective groove.
2. 2. The heat removal device of claim 1, Wherein each of the plurality of folded fins includes a pair of side walls and a first end portion coupling the side walls together, Wherein adjacent ones of the plurality of folded fins are coupled together by a second end portion, and Wherein the side walls, the first end portion, and the second end portion of the plurality of folded fins are exposed to the vapor chamber and the liquid chamber.
3. 3. The heat removal device of claim 1, wherein the plurality of turbulators comprises vanes coupled to the cover and extending into the second plurality of grooves.
4. 4. The heat removal device of claim 1, Wherein the base includes a planar portion and a joint portion coupled to and extending perpendicularly from the planar portion, the joint portion defining a lateral boundary of the vapor chamber, the planar portion including a middle portion and an outer portion, wherein the middle portion is thinner than the outer portion, and The wick includes a rigid body in contact with the intermediate portion and the plurality of folded fins.
5. 5. The heat removal device of claim 1, Wherein the wicking member comprises a central region, a plurality of first wicking segments extending radially from the central region, and a plurality of second wicking segments extending from the plurality of first wicking segments parallel to the plurality of folded fins.
6. 6. The heat removal device of claim 1, Wherein the base includes a planar portion including a middle portion forming a bottom boundary of the vapor chamber and an outer flange portion surrounding the middle portion and external to the vapor chamber, Wherein the cover includes a flange disposed opposite the outer flange portion of the base, and Wherein the heat removal device further comprises a gasket disposed between the flange of the cover and the outer flange portion of the base.
7. 7.A heat removal system, comprising: An electronic circuit; The heat removal device of claim 1, wherein said base is thermally coupled to said electronic circuit, and A liquid cooling circuit is fluidly coupled with the cover and configured to supply a flow of liquid through the liquid chamber.
8. 8. The heat removal system of claim 7, Wherein the cover comprises an inlet opening and an outlet opening, the inlet opening and the outlet opening being communicably connected to the liquid chamber, and Wherein the liquid cooling circuit includes a supply line coupled to the inlet opening and a return line coupled to the outlet opening.
9. 9. The heat removal system of claim 8, Wherein the liquid cooling circuit further comprises a pump configured to flow the liquid flow from the supply line, through the liquid chamber, to the return line.
10. 10. The heat removal system of claim 9, Wherein the liquid chamber is configured such that a pressure drop of the liquid flow between the supply line and the return line is less than or equal to 1 psi under conditions in which the liquid flow is supplied through the liquid chamber.
11. 11. The heat removal system of claim 7, Wherein the heat removal device has a thermal resistance of 0.01C/W or less.
12. 12. A method of rejecting heat, comprising: providing a heat rejection apparatus as in claim 1; Thermally coupling the base of the vapor chamber apparatus to an electronic circuit, and Flowing a liquid through the liquid chamber.
13. 13. A heat removal device, comprising: a vapor chamber apparatus, the vapor chamber apparatus comprising: A base, a base seat and a base seat, A folded fin structure coupled to the base, the base and the folded fin structure defining a vapor chamber, and A wicking structure disposed in the vapor chamber, the wicking structure comprising a wicking material physically distinct from the chassis, and A cover coupled to the vapor chamber apparatus, the cover and the vapor chamber apparatus defining a liquid chamber configured to contain a liquid; Wherein the folded fin structure includes a first corrugated surface defining a first plurality of grooves and a second corrugated surface opposite the first corrugated surface defining a second plurality of grooves, the first and second corrugated surfaces defining a plurality of folded fins extending in a first direction, Wherein the first corrugated surface is exposed to the vapor chamber, Wherein the second corrugated surface is exposed to the liquid chamber, an Wherein the wicking structure comprises a central region, a plurality of first wicking segments formed of the wicking material and extending radially from the central region, a plurality of first channels defined between the first wicking segments, a plurality of second wicking segments formed of the wicking material and extending parallel to the first direction from the plurality of first wicking segments, and a plurality of second channels defined between the second wicking segments, Wherein at least some of the plurality of folded fins extend into at least some of the second channels such that for at least some of the plurality of first wicking segments, a respective first wicking segment is disposed within a respective first groove of the first plurality of grooves.
14. 14. The heat removal device of claim 13, Wherein the plurality of folded fins comprises a raised section in an area above the plurality of first wicking sections, wherein within the raised section a bottom end portion of each folded fin is raised relative to a position external to the raised section.
15. 15. The heat removal apparatus of claim 13, further comprising A conditioning plate disposed over the first plurality of wicking segments, the conditioning plate comprising slots respectively aligned with the first plurality of grooves, the slots configured to regulate flow of vapor into the first plurality of grooves.
16. 16. The heat removal device of claim 15, Wherein the respective lengths of the slits increase as the respective distances of the slits from the central region increase.
17. 17. A heat removal device, comprising: a vapor chamber apparatus, the vapor chamber apparatus comprising: A base including a planar portion and a joint portion coupled to and extending perpendicularly from the planar portion, wherein the planar portion includes a middle portion and an outer portion, an A folded fin structure coupled to the engagement portion of the base, Wherein the base and the folded fin structure define a vapor chamber containing a wick and a working fluid, wherein the intermediate portion defines a bottom boundary of the vapor chamber, the engagement portion defines a lateral boundary of the vapor chamber, and the folded fin structure defines a top boundary of the vapor chamber, and A cover coupled to the vapor chamber apparatus, the cover and vapor chamber apparatus defining a liquid chamber configured to receive a liquid coolant; Wherein the folded fin structure includes a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and a second plurality of grooves on a second side of the folded fin structure, Wherein the first plurality of grooves are part of the vapor chamber, Wherein the second plurality of grooves are part of the liquid chamber, an Wherein the intermediate portion is thinner than the outer portion.
18. 18. The heat removal device of claim 17, Wherein the wick comprises a rigid body in contact with the intermediate portion and the plurality of folded fins.
19. 19. The heat removal device of claim 17, Wherein the cover includes a flange disposed opposite an outer portion of the base, and Wherein the heat removal device further comprises a gasket disposed between the flange of the cover and the outer flange portion of the base.
20. 20. The heat removal device of claim 17, Wherein the engagement portion is coupled to the planar portion at a location between the outer portion and the intermediate portion.

Description

Folding fin steam chamber cold plate Background Electronic devices such as computers, network devices, power supply units, etc. generate heat when in use. A cooling system may be utilized to remove heat from components of an electronic device to maintain the components within a desired operating temperature. For example, liquid cooling techniques may use a liquid coolant stream to remove heat from the system. In such liquid cooling techniques, cold plates may be used to transfer heat from the electronic device to the liquid cooling. The cold plate may be thermally coupled to the electronic device and the liquid coolant stream. For example, some cold plates may have protrusions (e.g., fins, pins, or other similar heat exchanging surface elements) that extend into the liquid coolant flow, allowing the cold plates to absorb heat from the component and dissipate the heat into the liquid coolant in contact with the protrusions. Other types of thermal devices for transferring heat include heat pipe and vapor chamber devices. In the heat pipe and vapor chamber arrangement, a sealed vapor chamber is defined by a set of walls and a working fluid is disposed in the vapor chamber. The working fluid undergoes repeated phase change cycles of vaporization, convection, condensation, and wicking to transfer heat from the hot side of the device (e.g., the side thermally coupled to the heat-generating component) to the cooler side of the device (e.g., the side thermally coupled to the cold plate). This phase change cycle causes the working fluid in the heat pipe or vapor chamber device to transfer heat at rates that greatly exceed the possible rates of conduction through solid metal devices similar in size and shape to the heat pipe or vapor chamber device. Drawings The present disclosure will be understood from the following detailed description, alone or in combination with the accompanying drawings. The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more examples of the present teachings and, together with the description, explain certain principles and operations. In the drawings: fig. 1 is a block diagram illustrating a folded fin vapor chamber cold plate. Fig. 2 is an exploded perspective view of a folded fin vapor chamber cold plate. FIG. 3 is a cross-section of the folded fin vapor chamber cold plate of FIG. 2, wherein the cross-section is taken along 3-3 in FIG. 2. Fig. 4 is a perspective view of the bottom side of the cover of the folded fin vapor chamber cold plate of fig. 2. Fig. 5 is a side view of a row of turbulators of the folded fin vapor chamber cold plate of fig. 2. Fig. 6 is an exploded perspective view of another folding fin vapor chamber cold plate. Fig. 7 is a perspective view of a system including a folded fin vapor chamber cold plate. Detailed Description The term "cold plate" is sometimes used in the art in a varying sense, with some meanings being more general and others being more specific. As used herein, a "cold plate" refers specifically to a subset of thermal devices configured to receive heat from a component via conduction and dissipate the heat into a flow of liquid coolant (e.g., water), as opposed to a "heat sink" as used herein, which refers specifically to a subset of thermal devices configured to receive heat from a component via conduction and dissipate the heat into a gas (e.g., air). Some electronic devices, such as high performance computers, generate a significant amount of heat. Furthermore, as electronic devices become faster and more powerful in the future, it is expected that they will generate even more heat. Such high heat output may be difficult to remove heat from the heat generating component at a sufficient rate. Furthermore, in some cases, more stringent restrictions are being imposed on cooling systems, such as higher intake temperatures and/or lower pressures required for liquid cooled systems, which may make it more difficult for existing thermal devices to remove heat at a desired rate. In the case of cooling techniques utilizing cold plates, some cold plates may not have a high enough heat transfer rate to keep up with the expected heat output while still meeting the increasing constraints imposed on the cooling system. Some cold plates include a set of relatively high surface area protrusions (e.g., fins, pins, and other types of protrusions having relatively high surface areas) that extend from a common base into the liquid coolant stream. The common base may be thermally coupled with the heat generating component, and thus heat is transferred from the component into the base via conduction. Heat is then transferred via conduction through the thickness of the base into the attachment end of the protuberance, then through the protuberance along its height dimension (the dimension extending from its attachment end to its free